JPS6417891A - Method for plating wiry body - Google Patents

Method for plating wiry body

Info

Publication number
JPS6417891A
JPS6417891A JP17339087A JP17339087A JPS6417891A JP S6417891 A JPS6417891 A JP S6417891A JP 17339087 A JP17339087 A JP 17339087A JP 17339087 A JP17339087 A JP 17339087A JP S6417891 A JPS6417891 A JP S6417891A
Authority
JP
Japan
Prior art keywords
plating
wiry
wiry body
electromagnetic waves
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17339087A
Other languages
Japanese (ja)
Inventor
Kiyoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP17339087A priority Critical patent/JPS6417891A/en
Publication of JPS6417891A publication Critical patent/JPS6417891A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1664—Process features with additional means during the plating process
    • C23C18/1667—Radiant energy, e.g. laser

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To increase plating speed and to improve plating efficiency when a wiry body of a metal, ceramics, resin or the like is plated by passing through a plating part, by projecting electromagnetic waves on the wiry body during moving in the plating part. CONSTITUTION:When a wiry body 1 is plated by passing through a plating part including a plating tank 3 and a plating soln. 4, electromagnetic waves are projected on the wiry body 1 during moving in the plating part. The electromagnetic waves may be projected from laser oscillators 51, 52, 53, 54.
JP17339087A 1987-07-10 1987-07-10 Method for plating wiry body Pending JPS6417891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17339087A JPS6417891A (en) 1987-07-10 1987-07-10 Method for plating wiry body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17339087A JPS6417891A (en) 1987-07-10 1987-07-10 Method for plating wiry body

Publications (1)

Publication Number Publication Date
JPS6417891A true JPS6417891A (en) 1989-01-20

Family

ID=15959512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17339087A Pending JPS6417891A (en) 1987-07-10 1987-07-10 Method for plating wiry body

Country Status (1)

Country Link
JP (1) JPS6417891A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020033631A (en) * 2018-08-31 2020-03-05 パナソニックＩｐマネジメント株式会社 Tungsten wire and elastic member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020033631A (en) * 2018-08-31 2020-03-05 パナソニックＩｐマネジメント株式会社 Tungsten wire and elastic member

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