JPS641754A - Epoxy resin composition for semiconductor sealing use - Google Patents

Epoxy resin composition for semiconductor sealing use

Info

Publication number
JPS641754A
JPS641754A JP15559087A JP15559087A JPS641754A JP S641754 A JPS641754 A JP S641754A JP 15559087 A JP15559087 A JP 15559087A JP 15559087 A JP15559087 A JP 15559087A JP S641754 A JPS641754 A JP S641754A
Authority
JP
Japan
Prior art keywords
epoxy resin
polynorbornene
formula
resin composition
incorporating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15559087A
Other languages
Japanese (ja)
Other versions
JPH0681801B2 (en
JPH011754A (en
Inventor
Yoshio Fujieda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP15559087A priority Critical patent/JPH0681801B2/en
Publication of JPS641754A publication Critical patent/JPS641754A/en
Publication of JPH011754A publication Critical patent/JPH011754A/en
Publication of JPH0681801B2 publication Critical patent/JPH0681801B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)

Abstract

PURPOSE: To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound.
CONSTITUTION: The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5W10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000≤m≤80,000; 3≤n≤300; 0≤p≤5; 0≤q≤5) prepared by reaction between B1: polynorbornene produced by ring opening polymerization of norbornene synthesized from ethylene and cyclopentadiene and B2: an organic silicone compound with reactive functional group (e.g. vinyl group) at the end of polysiloxane and methyl, phenyl etc. group in the side chain at 20W200°C for 0.1W8hr by application of shear force through kneading etc.
COPYRIGHT: (C)1989,JPO&Japio
JP15559087A 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation Expired - Fee Related JPH0681801B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15559087A JPH0681801B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15559087A JPH0681801B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Publications (3)

Publication Number Publication Date
JPS641754A true JPS641754A (en) 1989-01-06
JPH011754A JPH011754A (en) 1989-01-06
JPH0681801B2 JPH0681801B2 (en) 1994-10-19

Family

ID=15609360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15559087A Expired - Fee Related JPH0681801B2 (en) 1987-06-24 1987-06-24 Epoxy resin composition for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPH0681801B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021192822A1 (en) * 2020-03-27 2021-09-30 京セラ株式会社 Resin composition for semiconductor encapsulation, and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021192822A1 (en) * 2020-03-27 2021-09-30 京セラ株式会社 Resin composition for semiconductor encapsulation, and semiconductor device

Also Published As

Publication number Publication date
JPH0681801B2 (en) 1994-10-19

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees