JPS641754A - Epoxy resin composition for semiconductor sealing use - Google Patents
Epoxy resin composition for semiconductor sealing useInfo
- Publication number
- JPS641754A JPS641754A JP15559087A JP15559087A JPS641754A JP S641754 A JPS641754 A JP S641754A JP 15559087 A JP15559087 A JP 15559087A JP 15559087 A JP15559087 A JP 15559087A JP S641754 A JPS641754 A JP S641754A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- polynorbornene
- formula
- resin composition
- incorporating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
Abstract
PURPOSE: To obtain the titled composition outstanding in moldability and crack and moisture resistances, by incorporating an epoxy resin with a reaction product from polynorbornene and organic silicone compound.
CONSTITUTION: The objective composition can be obtained by incorporating (A) an epoxy resin with (B) pref. 0.5W10wt.%, based on the component A, of a silicone-modified polynorbornene of formula I (R1 is CH2, S, of formula II, etc.; R2 is H, of formula III, etc.; 10,000≤m≤80,000; 3≤n≤300; 0≤p≤5; 0≤q≤5) prepared by reaction between B1: polynorbornene produced by ring opening polymerization of norbornene synthesized from ethylene and cyclopentadiene and B2: an organic silicone compound with reactive functional group (e.g. vinyl group) at the end of polysiloxane and methyl, phenyl etc. group in the side chain at 20W200°C for 0.1W8hr by application of shear force through kneading etc.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15559087A JPH0681801B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15559087A JPH0681801B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Publications (3)
Publication Number | Publication Date |
---|---|
JPS641754A true JPS641754A (en) | 1989-01-06 |
JPH011754A JPH011754A (en) | 1989-01-06 |
JPH0681801B2 JPH0681801B2 (en) | 1994-10-19 |
Family
ID=15609360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15559087A Expired - Fee Related JPH0681801B2 (en) | 1987-06-24 | 1987-06-24 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0681801B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021192822A1 (en) * | 2020-03-27 | 2021-09-30 | 京セラ株式会社 | Resin composition for semiconductor encapsulation, and semiconductor device |
-
1987
- 1987-06-24 JP JP15559087A patent/JPH0681801B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021192822A1 (en) * | 2020-03-27 | 2021-09-30 | 京セラ株式会社 | Resin composition for semiconductor encapsulation, and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0681801B2 (en) | 1994-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |