JPS6417440A - Wafer transfer device - Google Patents

Wafer transfer device

Info

Publication number
JPS6417440A
JPS6417440A JP17279987A JP17279987A JPS6417440A JP S6417440 A JPS6417440 A JP S6417440A JP 17279987 A JP17279987 A JP 17279987A JP 17279987 A JP17279987 A JP 17279987A JP S6417440 A JPS6417440 A JP S6417440A
Authority
JP
Japan
Prior art keywords
wafer
cover
discharged
wafer transfer
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17279987A
Other languages
Japanese (ja)
Inventor
Koichi Asada
Toshio Suzuki
Kazuo Imahashi
Yoshika Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Naka Seiki Ltd
Original Assignee
Hitachi Ltd
Hitachi Naka Seiki Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Naka Seiki Ltd filed Critical Hitachi Ltd
Priority to JP17279987A priority Critical patent/JPS6417440A/en
Publication of JPS6417440A publication Critical patent/JPS6417440A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve quality of a wafer, by forming a wafer transfer path on an upper side of a device cover which covers a wafer cassette and a structure part and by equipping the device cover with an exhaustion means. CONSTITUTION:A wafer transfer path is formed on an upper side of a cover device 10 which covers a wafer cassette and a structure part. An exhaustion means, by which air inside the cover 10 is discharged to a maintenance region 15, is formed in the cover 10. Thereupon, dust generated upon the operating of an air cylinder 2, an air valve 3, a vacuum valve 4, and the like is collected in a tube connector 6 through an air tube 5, and it is attracted by a propeller fan 13, and it is discharged to the maintenance region 15 with the duct 16 in between. Accordingly the dust can be discharged without the dust stuck on the wafer 7. Quality of the wafer 7 can be hence improved.
JP17279987A 1987-07-13 1987-07-13 Wafer transfer device Pending JPS6417440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17279987A JPS6417440A (en) 1987-07-13 1987-07-13 Wafer transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17279987A JPS6417440A (en) 1987-07-13 1987-07-13 Wafer transfer device

Publications (1)

Publication Number Publication Date
JPS6417440A true JPS6417440A (en) 1989-01-20

Family

ID=15948582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17279987A Pending JPS6417440A (en) 1987-07-13 1987-07-13 Wafer transfer device

Country Status (1)

Country Link
JP (1) JPS6417440A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330380A (en) * 1995-05-31 1996-12-13 Nec Corp Substrate carrier

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08330380A (en) * 1995-05-31 1996-12-13 Nec Corp Substrate carrier

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