JPS64145A - Thermosetting resin composition, prepreg and laminate - Google Patents

Thermosetting resin composition, prepreg and laminate

Info

Publication number
JPS64145A
JPS64145A JP15354887A JP15354887A JPS64145A JP S64145 A JPS64145 A JP S64145A JP 15354887 A JP15354887 A JP 15354887A JP 15354887 A JP15354887 A JP 15354887A JP S64145 A JPS64145 A JP S64145A
Authority
JP
Japan
Prior art keywords
halogen
poly
formula
resin composition
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15354887A
Other languages
English (en)
Other versions
JPH01145A (ja
Inventor
Junichi Katagiri
Akira Nagai
Masao Suzuki
Akio Nishikawa
Akio Takahashi
Toshikazu Narahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15354887A priority Critical patent/JPS64145A/ja
Publication of JPH01145A publication Critical patent/JPH01145A/ja
Publication of JPS64145A publication Critical patent/JPS64145A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP15354887A 1987-06-22 1987-06-22 Thermosetting resin composition, prepreg and laminate Pending JPS64145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15354887A JPS64145A (en) 1987-06-22 1987-06-22 Thermosetting resin composition, prepreg and laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15354887A JPS64145A (en) 1987-06-22 1987-06-22 Thermosetting resin composition, prepreg and laminate

Publications (2)

Publication Number Publication Date
JPH01145A JPH01145A (ja) 1989-01-05
JPS64145A true JPS64145A (en) 1989-01-05

Family

ID=15564916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15354887A Pending JPS64145A (en) 1987-06-22 1987-06-22 Thermosetting resin composition, prepreg and laminate

Country Status (1)

Country Link
JP (1) JPS64145A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4681026A (en) * 1985-07-30 1987-07-21 Parker Arrester Co., Ltd. Spray coating chamber free from painting mist leakage
EP0364785B1 (en) * 1988-09-30 1995-03-01 Hitachi, Ltd. Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board
US6969478B1 (en) * 2000-10-12 2005-11-29 Lion Apparel, Inc. Fiberglass composite firefighting helmet and method for making a fiberglass composite firefighting helmet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4681026A (en) * 1985-07-30 1987-07-21 Parker Arrester Co., Ltd. Spray coating chamber free from painting mist leakage
EP0364785B1 (en) * 1988-09-30 1995-03-01 Hitachi, Ltd. Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board
US6969478B1 (en) * 2000-10-12 2005-11-29 Lion Apparel, Inc. Fiberglass composite firefighting helmet and method for making a fiberglass composite firefighting helmet

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