JPS6413144U - - Google Patents
Info
- Publication number
- JPS6413144U JPS6413144U JP10542987U JP10542987U JPS6413144U JP S6413144 U JPS6413144 U JP S6413144U JP 10542987 U JP10542987 U JP 10542987U JP 10542987 U JP10542987 U JP 10542987U JP S6413144 U JPS6413144 U JP S6413144U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat sink
- chip
- hole
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10542987U JPH0610718Y2 (ja) | 1987-07-09 | 1987-07-09 | 集積回路素子の保持構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10542987U JPH0610718Y2 (ja) | 1987-07-09 | 1987-07-09 | 集積回路素子の保持構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413144U true JPS6413144U (Direct) | 1989-01-24 |
| JPH0610718Y2 JPH0610718Y2 (ja) | 1994-03-16 |
Family
ID=31338034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10542987U Expired - Lifetime JPH0610718Y2 (ja) | 1987-07-09 | 1987-07-09 | 集積回路素子の保持構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610718Y2 (Direct) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009466A (ja) * | 2014-11-20 | 2019-01-17 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
| JP2024547003A (ja) * | 2021-12-17 | 2024-12-26 | メイコム テクノロジー ソリューションズ ホールディングス インコーポレイテッド | マルチタイプ集積型パッシブデバイス（ｉｐｄ）構成要素及びこれを実施するデバイス及びプロセス |
| US12417966B2 (en) | 2021-12-17 | 2025-09-16 | Macom Technology Solutions Holdings, Inc. | IPD components having SiC substrates and devices and processes implementing the same |
| US12620530B2 (en) | 2022-09-23 | 2026-05-05 | Wolfspeed, Inc. | Device and process for implementing silicon carbide (SiC) surface mount devices |
-
1987
- 1987-07-09 JP JP10542987U patent/JPH0610718Y2/ja not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019009466A (ja) * | 2014-11-20 | 2019-01-17 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
| JP2019009465A (ja) * | 2014-11-20 | 2019-01-17 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
| JP2019041110A (ja) * | 2014-11-20 | 2019-03-14 | 日本精工株式会社 | 電子部品搭載用放熱基板 |
| JP2024547003A (ja) * | 2021-12-17 | 2024-12-26 | メイコム テクノロジー ソリューションズ ホールディングス インコーポレイテッド | マルチタイプ集積型パッシブデバイス（ｉｐｄ）構成要素及びこれを実施するデバイス及びプロセス |
| US12417966B2 (en) | 2021-12-17 | 2025-09-16 | Macom Technology Solutions Holdings, Inc. | IPD components having SiC substrates and devices and processes implementing the same |
| US12620530B2 (en) | 2022-09-23 | 2026-05-05 | Wolfspeed, Inc. | Device and process for implementing silicon carbide (SiC) surface mount devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610718Y2 (ja) | 1994-03-16 |