JPS6413130U - - Google Patents
Info
- Publication number
- JPS6413130U JPS6413130U JP10771187U JP10771187U JPS6413130U JP S6413130 U JPS6413130 U JP S6413130U JP 10771187 U JP10771187 U JP 10771187U JP 10771187 U JP10771187 U JP 10771187U JP S6413130 U JPS6413130 U JP S6413130U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- alignment mark
- view
- semiconductor substrate
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10771187U JPS6413130U (da) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10771187U JPS6413130U (da) | 1987-07-14 | 1987-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413130U true JPS6413130U (da) | 1989-01-24 |
Family
ID=31342368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10771187U Pending JPS6413130U (da) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413130U (da) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610944A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Division of semiconductor device |
| JPS6151845A (ja) * | 1984-08-21 | 1986-03-14 | Matsushita Electronics Corp | 半導体装置の切断方法 |
-
1987
- 1987-07-14 JP JP10771187U patent/JPS6413130U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5610944A (en) * | 1979-07-06 | 1981-02-03 | Mitsubishi Electric Corp | Division of semiconductor device |
| JPS6151845A (ja) * | 1984-08-21 | 1986-03-14 | Matsushita Electronics Corp | 半導体装置の切断方法 |