JPS6412523A - Tube for heat treatment - Google Patents
Tube for heat treatmentInfo
- Publication number
- JPS6412523A JPS6412523A JP16907387A JP16907387A JPS6412523A JP S6412523 A JPS6412523 A JP S6412523A JP 16907387 A JP16907387 A JP 16907387A JP 16907387 A JP16907387 A JP 16907387A JP S6412523 A JPS6412523 A JP S6412523A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- tube
- edge part
- opening
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To increase the specific heat of an opening while restraining heat conduction and simplifying the heat insulating structure for preventing any needless product from occurring by a method wherein a thick walled opaque edge part is fixed to the opening of a tube main body. CONSTITUTION:The title tube composed of a tube main body 4 containing a semiconductor wafer 2 and an edge part 6 is heated by a heater 10 in a furnace body. The main body 4 aud the edge part 6 are independently processed while the edge part 6 made of an opaque heat resisting material is bonded to an opening of the main body and formed into a thick walled flange 12 to hold the main body 4. Consequently, the tube can increase the thermal resistance to restrain the heat conduction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62169073A JP2723110B2 (en) | 1987-07-07 | 1987-07-07 | Heat treatment equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62169073A JP2723110B2 (en) | 1987-07-07 | 1987-07-07 | Heat treatment equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6412523A true JPS6412523A (en) | 1989-01-17 |
JP2723110B2 JP2723110B2 (en) | 1998-03-09 |
Family
ID=15879825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62169073A Expired - Fee Related JP2723110B2 (en) | 1987-07-07 | 1987-07-07 | Heat treatment equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2723110B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0470733U (en) * | 1990-10-30 | 1992-06-23 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57191040U (en) * | 1981-05-29 | 1982-12-03 | ||
JPS607122A (en) * | 1983-06-01 | 1985-01-14 | アムテック・システムズ・インコーポレーテッド | Method and device for treating plural semiconductor wafers in furnace |
-
1987
- 1987-07-07 JP JP62169073A patent/JP2723110B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57191040U (en) * | 1981-05-29 | 1982-12-03 | ||
JPS607122A (en) * | 1983-06-01 | 1985-01-14 | アムテック・システムズ・インコーポレーテッド | Method and device for treating plural semiconductor wafers in furnace |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0470733U (en) * | 1990-10-30 | 1992-06-23 |
Also Published As
Publication number | Publication date |
---|---|
JP2723110B2 (en) | 1998-03-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |