JPS6412523A - Tube for heat treatment - Google Patents

Tube for heat treatment

Info

Publication number
JPS6412523A
JPS6412523A JP16907387A JP16907387A JPS6412523A JP S6412523 A JPS6412523 A JP S6412523A JP 16907387 A JP16907387 A JP 16907387A JP 16907387 A JP16907387 A JP 16907387A JP S6412523 A JPS6412523 A JP S6412523A
Authority
JP
Japan
Prior art keywords
main body
tube
edge part
opening
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16907387A
Other languages
Japanese (ja)
Other versions
JP2723110B2 (en
Inventor
Wataru Okase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Sagami Ltd
Original Assignee
Tokyo Electron Sagami Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Sagami Ltd filed Critical Tokyo Electron Sagami Ltd
Priority to JP62169073A priority Critical patent/JP2723110B2/en
Publication of JPS6412523A publication Critical patent/JPS6412523A/en
Application granted granted Critical
Publication of JP2723110B2 publication Critical patent/JP2723110B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To increase the specific heat of an opening while restraining heat conduction and simplifying the heat insulating structure for preventing any needless product from occurring by a method wherein a thick walled opaque edge part is fixed to the opening of a tube main body. CONSTITUTION:The title tube composed of a tube main body 4 containing a semiconductor wafer 2 and an edge part 6 is heated by a heater 10 in a furnace body. The main body 4 aud the edge part 6 are independently processed while the edge part 6 made of an opaque heat resisting material is bonded to an opening of the main body and formed into a thick walled flange 12 to hold the main body 4. Consequently, the tube can increase the thermal resistance to restrain the heat conduction.
JP62169073A 1987-07-07 1987-07-07 Heat treatment equipment Expired - Fee Related JP2723110B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62169073A JP2723110B2 (en) 1987-07-07 1987-07-07 Heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62169073A JP2723110B2 (en) 1987-07-07 1987-07-07 Heat treatment equipment

Publications (2)

Publication Number Publication Date
JPS6412523A true JPS6412523A (en) 1989-01-17
JP2723110B2 JP2723110B2 (en) 1998-03-09

Family

ID=15879825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62169073A Expired - Fee Related JP2723110B2 (en) 1987-07-07 1987-07-07 Heat treatment equipment

Country Status (1)

Country Link
JP (1) JP2723110B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470733U (en) * 1990-10-30 1992-06-23

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191040U (en) * 1981-05-29 1982-12-03
JPS607122A (en) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド Method and device for treating plural semiconductor wafers in furnace

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57191040U (en) * 1981-05-29 1982-12-03
JPS607122A (en) * 1983-06-01 1985-01-14 アムテック・システムズ・インコーポレーテッド Method and device for treating plural semiconductor wafers in furnace

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470733U (en) * 1990-10-30 1992-06-23

Also Published As

Publication number Publication date
JP2723110B2 (en) 1998-03-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees