JPS6412037U - - Google Patents

Info

Publication number
JPS6412037U
JPS6412037U JP10523587U JP10523587U JPS6412037U JP S6412037 U JPS6412037 U JP S6412037U JP 10523587 U JP10523587 U JP 10523587U JP 10523587 U JP10523587 U JP 10523587U JP S6412037 U JPS6412037 U JP S6412037U
Authority
JP
Japan
Prior art keywords
wafer transfer
support member
arm
transfer device
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10523587U
Other languages
Japanese (ja)
Other versions
JPH0636582Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10523587U priority Critical patent/JPH0636582Y2/en
Publication of JPS6412037U publication Critical patent/JPS6412037U/ja
Application granted granted Critical
Publication of JPH0636582Y2 publication Critical patent/JPH0636582Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Specific Conveyance Elements (AREA)
  • Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例のウエハ搬送装置の
平面図、第２図はその搬送方法を説明する側面図
、第３図は直進アームへの支持部材の配置方法を
説明する平面図、第４図は旋回アームへの支持部
材の配置方法を説明する平面図、第５図はロード
ロツク室への支持部材の配置方法を説明する平面
図、第６図は第５図のＤ―Ｄ断面図である。 ４……ロード側ロードロツク室、５……アンロ
ード側ロードロツク室、９……ロード用直進アー
ム、１０……ロード用旋回アーム、１１……アン
ロード用旋回アーム、１２……アンロード用直進
アーム、１８，１９，２０……支持部材。 Fig. 1 is a plan view of a wafer transfer device according to an embodiment of the present invention, Fig. 2 is a side view illustrating the transfer method thereof, and Fig. 3 is a plan view illustrating the method of arranging the support member on the rectilinear arm. Figure 4 is a plan view explaining how to arrange the support member on the swing arm, Figure 5 is a plan view explaining how to arrange the support member in the load lock chamber, and Figure 6 is the DD cross section in Figure 5. It is a diagram. 4... Load side load lock chamber, 5... Unload side load lock chamber, 9... Straight arm for loading, 10... Swivel arm for load, 11... Swivel arm for unload, 12... Straight arm for unload. , 18, 19, 20...Supporting member.

Claims (1)

【実用新案登録請求の範囲】 １ 直進搬送と旋回搬送の組み合せによりウエハ
を１枚単位で処理室まで搬送するウエハ受け渡し
ステーシヨンを有するウエハ搬送装置において、
アンロード用直進アームの支持部材の取り付け位
置をロード用直進アームの支持部材の取り付け位
置と同一円周上で旋回アームによる搬送時のウエ
ハの回転角度分だけ回転したことを特徴とするウ
エハ搬送装置。 ２ 実用新案登録請求の範囲第１項において、ロ
ード用およびアンロード用旋回アームの支持部材
を各旋回アーム処理室に停止した時に同一位置に
なるように配置したウエハ搬送装置。 ３ 実用新案登録請求の範囲第１項または第２項
において、各ウエハ受け渡しステーシヨンの支持
部材の取り付け位置を、各旋回アームがウエハ受
け渡しステーシヨンに停止した時の旋回アームの
支持部材の取り付け位置をウエハ受け渡しステー
シヨン上に投影した位置としたウエハ搬送装置。[Claims for Utility Model Registration] 1. A wafer transfer device having a wafer transfer station that transfers wafers one by one to a processing chamber by a combination of straight transfer and rotational transfer,
A wafer transfer device characterized in that the mounting position of the support member of the straight arm for unloading is rotated on the same circumference as the mounting position of the support member of the straight arm for loading by the rotation angle of the wafer during transport by the swing arm. . 2 Utility Model Registration Claim 1: The wafer transfer device according to claim 1, in which the supporting members of the loading and unloading rotating arms are arranged so that they are in the same position when stopped in each rotating arm processing chamber. 3. In claim 1 or 2 of the utility model registration claim, the attachment position of the support member of each wafer transfer station is determined by the attachment position of the support member of each swivel arm when the swivel arm stops at the wafer transfer station. Wafer transfer device with the position projected onto the transfer station.
JP10523587U 1987-07-10 1987-07-10 Etching equipment Expired - Lifetime JPH0636582Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10523587U JPH0636582Y2 (en) 1987-07-10 1987-07-10 Etching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10523587U JPH0636582Y2 (en) 1987-07-10 1987-07-10 Etching equipment

Publications (2)

Publication Number Publication Date
JPS6412037U true JPS6412037U (en) 1989-01-23
JPH0636582Y2 JPH0636582Y2 (en) 1994-09-21

Family

ID=31337665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10523587U Expired - Lifetime JPH0636582Y2 (en) 1987-07-10 1987-07-10 Etching equipment

Country Status (1)

Country Link
JP (1) JPH0636582Y2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107281A (en) * 1990-08-27 1992-04-08 Nec Corp Method and device for etching fe-containing material
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395648B1 (en) * 2000-02-25 2002-05-28 Wafermasters, Inc. Wafer processing system

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04107281A (en) * 1990-08-27 1992-04-08 Nec Corp Method and device for etching fe-containing material
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39776E1 (en) 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
USRE39775E1 (en) * 1990-08-29 2007-08-21 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39823E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US7367135B2 (en) 1990-08-29 2008-05-06 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor

Also Published As

Publication number Publication date
JPH0636582Y2 (en) 1994-09-21

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