JPS6411701B2 - - Google Patents
Info
- Publication number
- JPS6411701B2 JPS6411701B2 JP8501482A JP8501482A JPS6411701B2 JP S6411701 B2 JPS6411701 B2 JP S6411701B2 JP 8501482 A JP8501482 A JP 8501482A JP 8501482 A JP8501482 A JP 8501482A JP S6411701 B2 JPS6411701 B2 JP S6411701B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- present
- copper
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000956 alloy Substances 0.000 claims description 36
- 229910045601 alloy Inorganic materials 0.000 claims description 33
- 239000010949 copper Substances 0.000 claims description 14
- 238000000137 annealing Methods 0.000 claims description 12
- 239000002131 composite material Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 239000012535 impurity Substances 0.000 claims description 4
- 238000005097 cold rolling Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 25
- 239000011651 chromium Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 239000006185 dispersion Substances 0.000 description 10
- 230000005496 eutectics Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005098 hot rolling Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000003483 aging Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910017813 Cu—Cr Inorganic materials 0.000 description 5
- 230000032683 aging Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 229910000599 Cr alloy Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- GXDVEXJTVGRLNW-UHFFFAOYSA-N [Cr].[Cu] Chemical compound [Cr].[Cu] GXDVEXJTVGRLNW-UHFFFAOYSA-N 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- 239000000788 chromium alloy Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000001556 precipitation Methods 0.000 description 4
- 239000006104 solid solution Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- VRPUOTOZHIXZOB-UHFFFAOYSA-N [Cr].[Cu].[Sn] Chemical compound [Cr].[Cu].[Sn] VRPUOTOZHIXZOB-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8501482A JPS58202558A (ja) | 1982-05-21 | 1982-05-21 | 集積回路用導体合金及びその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8501482A JPS58202558A (ja) | 1982-05-21 | 1982-05-21 | 集積回路用導体合金及びその製造法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2539288A Division JPS63283050A (ja) | 1988-02-05 | 1988-02-05 | 集積回路用導体合金及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58202558A JPS58202558A (ja) | 1983-11-25 |
| JPS6411701B2 true JPS6411701B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-02-27 |
Family
ID=13846884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8501482A Granted JPS58202558A (ja) | 1982-05-21 | 1982-05-21 | 集積回路用導体合金及びその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58202558A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-05-21 JP JP8501482A patent/JPS58202558A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58202558A (ja) | 1983-11-25 |
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