JPS6411546U - - Google Patents
Info
- Publication number
- JPS6411546U JPS6411546U JP1987105901U JP10590187U JPS6411546U JP S6411546 U JPS6411546 U JP S6411546U JP 1987105901 U JP1987105901 U JP 1987105901U JP 10590187 U JP10590187 U JP 10590187U JP S6411546 U JPS6411546 U JP S6411546U
- Authority
- JP
- Japan
- Prior art keywords
- shape
- seal portion
- cavity
- sealing lid
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Die Bonding (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例を示
す断面図、第２図及び第３図はそれぞれ従来の半
導体装置用セラミツクケースの第１及び第２の例
を示す断面図である。 １，１ａ〜１ｃ…容器、２，２ａ，２ｂ…封止
用蓋、３，３ａ，３ｂ…シール部、４，４ａ〜４
ｃ…半導体素子、１１，１１ａ〜１１ｃ…キヤビ
テイ。
す断面図、第２図及び第３図はそれぞれ従来の半
導体装置用セラミツクケースの第１及び第２の例
を示す断面図である。 １，１ａ〜１ｃ…容器、２，２ａ，２ｂ…封止
用蓋、３，３ａ，３ｂ…シール部、４，４ａ〜４
ｃ…半導体素子、１１，１１ａ〜１１ｃ…キヤビ
テイ。
Claims (1)
- 半導体素子を載置収納するための所定の形状、
寸法のキヤビテイを備えたセラミツク製の容器と
、この容器の所定の位置に設けられたシール部と
、このシール部と接着し前記半導体素子を封止す
るための封止用蓋とを有する半導体装置用セラミ
ツクケースにおいて、前記シール部の位置、形状
及び封止用蓋の形状、寸法を前記キヤビテイの形
状及び寸法の大小にかかわらず一定としたことを
特徴とする半導体装置用セラミツクケース。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987105901U JPS6411546U (ja) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987105901U JPS6411546U (ja) | 1987-07-09 | 1987-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6411546U true JPS6411546U (ja) | 1989-01-20 |
Family
ID=31338928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987105901U Pending JPS6411546U (ja) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6411546U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04116148U (ja) * | 1991-03-29 | 1992-10-16 | 井関農機株式会社 | 移動農機におけるコントロ−ラの保護装置 |
-
1987
- 1987-07-09 JP JP1987105901U patent/JPS6411546U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04116148U (ja) * | 1991-03-29 | 1992-10-16 | 井関農機株式会社 | 移動農機におけるコントロ−ラの保護装置 |
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