JPS6411538U - - Google Patents

Info

Publication number
JPS6411538U
JPS6411538U JP10379687U JP10379687U JPS6411538U JP S6411538 U JPS6411538 U JP S6411538U JP 10379687 U JP10379687 U JP 10379687U JP 10379687 U JP10379687 U JP 10379687U JP S6411538 U JPS6411538 U JP S6411538U
Authority
JP
Japan
Prior art keywords
semiconductor element
electrode pattern
light beam
bump electrodes
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10379687U
Other languages
English (en)
Japanese (ja)
Other versions
JP2522796Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987103796U priority Critical patent/JP2522796Y2/ja
Publication of JPS6411538U publication Critical patent/JPS6411538U/ja
Application granted granted Critical
Publication of JP2522796Y2 publication Critical patent/JP2522796Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
JP1987103796U 1987-07-08 1987-07-08 半導体素子の取付構造 Expired - Lifetime JP2522796Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987103796U JP2522796Y2 (ja) 1987-07-08 1987-07-08 半導体素子の取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987103796U JP2522796Y2 (ja) 1987-07-08 1987-07-08 半導体素子の取付構造

Publications (2)

Publication Number Publication Date
JPS6411538U true JPS6411538U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-01-20
JP2522796Y2 JP2522796Y2 (ja) 1997-01-16

Family

ID=31334946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987103796U Expired - Lifetime JP2522796Y2 (ja) 1987-07-08 1987-07-08 半導体素子の取付構造

Country Status (1)

Country Link
JP (1) JP2522796Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02249247A (ja) * 1989-03-23 1990-10-05 Casio Comput Co Ltd 集積回路チップのボンディング方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023977A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-07-04 1975-03-14
JPS5387170A (en) * 1977-01-11 1978-08-01 Sharp Corp Mounting method and mounting device of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023977A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-07-04 1975-03-14
JPS5387170A (en) * 1977-01-11 1978-08-01 Sharp Corp Mounting method and mounting device of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02249247A (ja) * 1989-03-23 1990-10-05 Casio Comput Co Ltd 集積回路チップのボンディング方法

Also Published As

Publication number Publication date
JP2522796Y2 (ja) 1997-01-16

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