JPS6411235A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS6411235A JPS6411235A JP16719487A JP16719487A JPS6411235A JP S6411235 A JPS6411235 A JP S6411235A JP 16719487 A JP16719487 A JP 16719487A JP 16719487 A JP16719487 A JP 16719487A JP S6411235 A JPS6411235 A JP S6411235A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- bumps
- forming
- ito
- dispersing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To obtain sure connection by forming the electrode parts of a semiconductor element as Au bumps and providing a thermoadhesive sheet formed by dispersing conductive fillers having elasticity into a high-polymer material having thermoadhesiveness on a semiconductor element forming surface. CONSTITUTION:The bumps formed by electroplating of Au are provided on the semiconductor element and further, the thermoadhesive sheet formed by dispersing the conductive films is laminated over the entire surface of the semiconductor element. An LSI chip is, therefore, electrically connected without metallizing ITO. Namely, anisotropy is exhibited by forming the thermoadhesive sheet dispersed with the conductive fillers on the Au bumps and the connection onto the ITO is executed by thermocompression bonding. The electrical connection is thereby more surely executed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167194A JP2681931B2 (en) | 1987-07-03 | 1987-07-03 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62167194A JP2681931B2 (en) | 1987-07-03 | 1987-07-03 | Semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6411235A true JPS6411235A (en) | 1989-01-13 |
JP2681931B2 JP2681931B2 (en) | 1997-11-26 |
Family
ID=15845171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62167194A Expired - Lifetime JP2681931B2 (en) | 1987-07-03 | 1987-07-03 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2681931B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998046811A1 (en) * | 1997-04-17 | 1998-10-22 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225828A (en) * | 1984-04-24 | 1985-11-11 | Seiko Epson Corp | Packaging method of liquid crystal panel |
JPS61158163A (en) * | 1984-12-29 | 1986-07-17 | Matsushita Electric Ind Co Ltd | Formation of bump |
JPS6243138A (en) * | 1985-08-21 | 1987-02-25 | Seiko Instr & Electronics Ltd | Ic mounting structure of liquid crystal display apparatus |
-
1987
- 1987-07-03 JP JP62167194A patent/JP2681931B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60225828A (en) * | 1984-04-24 | 1985-11-11 | Seiko Epson Corp | Packaging method of liquid crystal panel |
JPS61158163A (en) * | 1984-12-29 | 1986-07-17 | Matsushita Electric Ind Co Ltd | Formation of bump |
JPS6243138A (en) * | 1985-08-21 | 1987-02-25 | Seiko Instr & Electronics Ltd | Ic mounting structure of liquid crystal display apparatus |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998046811A1 (en) * | 1997-04-17 | 1998-10-22 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
US6562217B1 (en) * | 1997-04-17 | 2003-05-13 | Sekisui Chemical Co., Ltd. | Method and device for manufacturing conductive particles |
US6906427B2 (en) | 1997-04-17 | 2005-06-14 | Sekisui Chemical Co., Ltd. | Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same |
KR100574215B1 (en) * | 1997-04-17 | 2006-04-27 | 세키스이가가쿠 고교가부시키가이샤 | Conductive particles |
KR100589449B1 (en) * | 1997-04-17 | 2006-06-14 | 세키스이가가쿠 고교가부시키가이샤 | Electronic circuit components |
Also Published As
Publication number | Publication date |
---|---|
JP2681931B2 (en) | 1997-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860007735A (en) | Semiconductor device, manufacturing method thereof, and lead frame used in manufacturing method | |
MY113991A (en) | Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto. | |
KR900005587A (en) | Semiconductor device and manufacturing method | |
TW428214B (en) | Semiconductor device, method making the same, and electronic device using the same | |
CA2115553A1 (en) | Plated compliant lead | |
JPS6428930A (en) | Semiconductor device | |
EP0827191A3 (en) | Semiconductor device mounting structure | |
MY118453A (en) | Method of forming an electrode structure for a semiconductor device | |
MY112280A (en) | Electrically connecting structure | |
JPS5840728B2 (en) | liquid crystal display device | |
EP0330372A3 (en) | Hybrid ic with heat sink | |
MY126602A (en) | Electronic device and manufacture thereof | |
US4538143A (en) | Light-emitting diode displayer | |
JPS6411235A (en) | Semiconductor element | |
JPH0368149A (en) | Ic mounting film carrier | |
HK103693A (en) | Integrated circuit with an electroconductive flat element | |
JPS622628A (en) | Semiconductor device | |
KR910005518A (en) | Conductive binder, conductive connection structure and conductive connection method | |
JPS5779681A (en) | Light emitting chip parts | |
EP0081419A3 (en) | High lead count hermetic mass bond integrated circuit carrier | |
JPS6432655A (en) | Substrate for loading semiconductor element | |
JPS626652B2 (en) | ||
JPH0249460A (en) | Semiconductor device | |
JPS5635451A (en) | Semiconductor device | |
JPS57147262A (en) | Manufacture of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |