JPS6411235A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS6411235A
JPS6411235A JP16719487A JP16719487A JPS6411235A JP S6411235 A JPS6411235 A JP S6411235A JP 16719487 A JP16719487 A JP 16719487A JP 16719487 A JP16719487 A JP 16719487A JP S6411235 A JPS6411235 A JP S6411235A
Authority
JP
Japan
Prior art keywords
semiconductor element
bumps
forming
ito
dispersing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16719487A
Other languages
Japanese (ja)
Other versions
JP2681931B2 (en
Inventor
Kazuyuki Shimada
Junichi Okamoto
Shigeru Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62167194A priority Critical patent/JP2681931B2/en
Publication of JPS6411235A publication Critical patent/JPS6411235A/en
Application granted granted Critical
Publication of JP2681931B2 publication Critical patent/JP2681931B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain sure connection by forming the electrode parts of a semiconductor element as Au bumps and providing a thermoadhesive sheet formed by dispersing conductive fillers having elasticity into a high-polymer material having thermoadhesiveness on a semiconductor element forming surface. CONSTITUTION:The bumps formed by electroplating of Au are provided on the semiconductor element and further, the thermoadhesive sheet formed by dispersing the conductive films is laminated over the entire surface of the semiconductor element. An LSI chip is, therefore, electrically connected without metallizing ITO. Namely, anisotropy is exhibited by forming the thermoadhesive sheet dispersed with the conductive fillers on the Au bumps and the connection onto the ITO is executed by thermocompression bonding. The electrical connection is thereby more surely executed.
JP62167194A 1987-07-03 1987-07-03 Semiconductor element Expired - Lifetime JP2681931B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62167194A JP2681931B2 (en) 1987-07-03 1987-07-03 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62167194A JP2681931B2 (en) 1987-07-03 1987-07-03 Semiconductor element

Publications (2)

Publication Number Publication Date
JPS6411235A true JPS6411235A (en) 1989-01-13
JP2681931B2 JP2681931B2 (en) 1997-11-26

Family

ID=15845171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62167194A Expired - Lifetime JP2681931B2 (en) 1987-07-03 1987-07-03 Semiconductor element

Country Status (1)

Country Link
JP (1) JP2681931B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998046811A1 (en) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225828A (en) * 1984-04-24 1985-11-11 Seiko Epson Corp Packaging method of liquid crystal panel
JPS61158163A (en) * 1984-12-29 1986-07-17 Matsushita Electric Ind Co Ltd Formation of bump
JPS6243138A (en) * 1985-08-21 1987-02-25 Seiko Instr & Electronics Ltd Ic mounting structure of liquid crystal display apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60225828A (en) * 1984-04-24 1985-11-11 Seiko Epson Corp Packaging method of liquid crystal panel
JPS61158163A (en) * 1984-12-29 1986-07-17 Matsushita Electric Ind Co Ltd Formation of bump
JPS6243138A (en) * 1985-08-21 1987-02-25 Seiko Instr & Electronics Ltd Ic mounting structure of liquid crystal display apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998046811A1 (en) * 1997-04-17 1998-10-22 Sekisui Chemical Co., Ltd. Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
US6562217B1 (en) * 1997-04-17 2003-05-13 Sekisui Chemical Co., Ltd. Method and device for manufacturing conductive particles
US6906427B2 (en) 1997-04-17 2005-06-14 Sekisui Chemical Co., Ltd. Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
KR100574215B1 (en) * 1997-04-17 2006-04-27 세키스이가가쿠 고교가부시키가이샤 Conductive particles
KR100589449B1 (en) * 1997-04-17 2006-06-14 세키스이가가쿠 고교가부시키가이샤 Electronic circuit components

Also Published As

Publication number Publication date
JP2681931B2 (en) 1997-11-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term