JPS6411066A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS6411066A JPS6411066A JP16453887A JP16453887A JPS6411066A JP S6411066 A JPS6411066 A JP S6411066A JP 16453887 A JP16453887 A JP 16453887A JP 16453887 A JP16453887 A JP 16453887A JP S6411066 A JPS6411066 A JP S6411066A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- solder
- soldered
- chucks
- sagging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To prevent solder from sagging by providing bearings to turn chucks to hold a jig to hold and convey an object to be soldered and a rotation actuator to actuate a rotating action to solder surely even the end face of the object to be soldered. CONSTITUTION:The chuck 13b fitted to a slide shaft 24 via a bearing block 15b and the chuck 13a fitted to a slide pipe 25 via a bearing block 15a are operated vertically and a substrate 11 held by the jig 12 held by the chucks 13a and 13b is immersed in a solder tank 26. At that time, since the soldering substrate 11 can be immersed therein with a gradient at an optional angle, even the end face of the substrate 11 can be soldered easily. Moreover, when the substrate 11 is withdrawn from the solder tank 26, the substrate 11 is withdrawn while returning the inclined substrate 11 to its original state, by which liquid running-out of the solder is improved and the solder can be prevented from sagging.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16453887A JPS6411066A (en) | 1987-07-01 | 1987-07-01 | Soldering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16453887A JPS6411066A (en) | 1987-07-01 | 1987-07-01 | Soldering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6411066A true JPS6411066A (en) | 1989-01-13 |
Family
ID=15795062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16453887A Pending JPS6411066A (en) | 1987-07-01 | 1987-07-01 | Soldering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6411066A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7631796B2 (en) | 2007-12-04 | 2009-12-15 | Sony Corporation | Selective soldering system |
US7648056B1 (en) * | 2008-07-03 | 2010-01-19 | Sony Corporation | Selective soldering bath |
CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
CN103747631A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating hot-pressing jig |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57679A (en) * | 1980-06-02 | 1982-01-05 | Ricoh Co Ltd | Destaticizer for copying machine |
-
1987
- 1987-07-01 JP JP16453887A patent/JPS6411066A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57679A (en) * | 1980-06-02 | 1982-01-05 | Ricoh Co Ltd | Destaticizer for copying machine |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7631796B2 (en) | 2007-12-04 | 2009-12-15 | Sony Corporation | Selective soldering system |
US7648056B1 (en) * | 2008-07-03 | 2010-01-19 | Sony Corporation | Selective soldering bath |
CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
CN103747631A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB locating hot-pressing jig |
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