JPS6410697A - Method and apparatus for forming through hole in substrate - Google Patents

Method and apparatus for forming through hole in substrate

Info

Publication number
JPS6410697A
JPS6410697A JP16654187A JP16654187A JPS6410697A JP S6410697 A JPS6410697 A JP S6410697A JP 16654187 A JP16654187 A JP 16654187A JP 16654187 A JP16654187 A JP 16654187A JP S6410697 A JPS6410697 A JP S6410697A
Authority
JP
Japan
Prior art keywords
paint
holes
hole
thick
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16654187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463559B2 (enrdf_load_stackoverflow
Inventor
Osamu Itagaki
Katsuhiko Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP16654187A priority Critical patent/JPS6410697A/ja
Publication of JPS6410697A publication Critical patent/JPS6410697A/ja
Publication of JPH0463559B2 publication Critical patent/JPH0463559B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP16654187A 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate Granted JPS6410697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Publications (2)

Publication Number Publication Date
JPS6410697A true JPS6410697A (en) 1989-01-13
JPH0463559B2 JPH0463559B2 (enrdf_load_stackoverflow) 1992-10-12

Family

ID=15833191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16654187A Granted JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Country Status (1)

Country Link
JP (1) JPS6410697A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034591A (ja) * 1989-06-01 1991-01-10 Juki Corp 厚膜回路製造方法
JPH07221445A (ja) * 1994-01-27 1995-08-18 Sakae Denshi Kogyo Kk スルホールの導通化方法及び装置
EP0711106A1 (de) * 1994-11-02 1996-05-08 Lpkf Cad/Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119791A (ja) * 1982-12-25 1984-07-11 富士通株式会社 スル−ホ−ルの導体層形成方法
JPS59151493A (ja) * 1983-02-17 1984-08-29 日本電気アイシ−マイコンシステム株式会社 スル−ホ−ル加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119791A (ja) * 1982-12-25 1984-07-11 富士通株式会社 スル−ホ−ルの導体層形成方法
JPS59151493A (ja) * 1983-02-17 1984-08-29 日本電気アイシ−マイコンシステム株式会社 スル−ホ−ル加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034591A (ja) * 1989-06-01 1991-01-10 Juki Corp 厚膜回路製造方法
JPH07221445A (ja) * 1994-01-27 1995-08-18 Sakae Denshi Kogyo Kk スルホールの導通化方法及び装置
EP0711106A1 (de) * 1994-11-02 1996-05-08 Lpkf Cad/Cam Systeme Gmbh Verfahren zum Durchkontaktieren von Bohrungen in mehrlagigen Leiterplatten

Also Published As

Publication number Publication date
JPH0463559B2 (enrdf_load_stackoverflow) 1992-10-12

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