JPS6410633A - Method and metal mold apparatus for formation of plastic seal of semiconductor element and lead frame therefor - Google Patents
Method and metal mold apparatus for formation of plastic seal of semiconductor element and lead frame thereforInfo
- Publication number
- JPS6410633A JPS6410633A JP16634487A JP16634487A JPS6410633A JP S6410633 A JPS6410633 A JP S6410633A JP 16634487 A JP16634487 A JP 16634487A JP 16634487 A JP16634487 A JP 16634487A JP S6410633 A JPS6410633 A JP S6410633A
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- resin material
- passage
- molds
- transfer use
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE:To prevent a resin burr from adhering to both faces of molds and to the surface of lead frames by a method wherein a pot and a passage for transfer use are arranged inside the lead frames and a molten resin material is injected and filled into a cavity. CONSTITUTION:A metal mold apparatus A is equipped with the following: an upper mold 11 on the fixed side; a lower mold 12 on the movable side; two or more required number of pots 13 which are arranged at the upper mold 11 and are used to supply a resin material; a plunger 14 for pressurizing the resin material; the required number of cavities 15 which are formed on P.L parting line faces at both molds; a passage 16 for transfer use of the molten resin material interlinking the individual pots 13 and the required cavities 15; groove parts 17 for mounting lead frames on a P.L face of the lower mold 12. The individual pots 13 and the passage 16 for transfer use are constituted in such a way that they are arranged at the inside of the lead frames 19, 19a, 19b when the lead frames are mounted on the groove parts 17. By this setup, even when one part of the molten resin material which has been pressurized and transferred flows out to the outside of the passage 16 for transfer use, the material is blocked by an insertion-mounting part 192; it is possible to prevent a resin burr from adhering to faces of both molds and to the surface of the lead frames due to the penetration of the material into the P.L face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16634487A JP2575718B2 (en) | 1987-07-02 | 1987-07-02 | Resin encapsulation molding method for semiconductor element, mold apparatus for molding and lead frame used in the method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16634487A JP2575718B2 (en) | 1987-07-02 | 1987-07-02 | Resin encapsulation molding method for semiconductor element, mold apparatus for molding and lead frame used in the method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6410633A true JPS6410633A (en) | 1989-01-13 |
| JP2575718B2 JP2575718B2 (en) | 1997-01-29 |
Family
ID=15829634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16634487A Expired - Lifetime JP2575718B2 (en) | 1987-07-02 | 1987-07-02 | Resin encapsulation molding method for semiconductor element, mold apparatus for molding and lead frame used in the method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2575718B2 (en) |
-
1987
- 1987-07-02 JP JP16634487A patent/JP2575718B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2575718B2 (en) | 1997-01-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071107 Year of fee payment: 11 |