JPS6410366U - - Google Patents
Info
- Publication number
- JPS6410366U JPS6410366U JP10196187U JP10196187U JPS6410366U JP S6410366 U JPS6410366 U JP S6410366U JP 10196187 U JP10196187 U JP 10196187U JP 10196187 U JP10196187 U JP 10196187U JP S6410366 U JPS6410366 U JP S6410366U
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- solder
- solder supply
- iron
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案のはんだ供給装置が、はんだ
付け作業が可能状態にある時の全体概略図。第２
図は、はんだ送り機構図。第３図は、使用可能温
度時Ａと常温時Ｂのこて先、及びガイド板の状態
図。
１…はんだごて本体、２…はんだ供給装置本体
、３…ハンドル、４…ローラ、６…シヤフト、７
…ガイド板（形状記憶合金などの温度により変形
する合金）、８…はんだ供給装置先端可動部、９
…はんだ、１０…はんだごてこて先。
FIG. 1 is an overall schematic diagram of the solder supply device of the present invention when it is ready for soldering work. Second
The figure is a diagram of the solder feeding mechanism. FIG. 3 is a diagram showing the state of the soldering iron tip and guide plate at usable temperature A and at normal temperature B. 1...Soldering iron main body, 2...Solder supply device main body, 3...Handle, 4...Roller, 6...Shaft, 7
... Guide plate (alloy that deforms depending on temperature, such as shape memory alloy), 8 ... Solder supply device tip movable part, 9
...Solder, 10...Soldering iron tip.
Claims (1)
状記憶合金で構成したガイドは一端をはんだごて
の発熱部、或いは発熱部近傍に取り付け、他端を
前記はんだ供給部に取り付けて橋絡するようにし
、はんだごてが加熱時にはこてとはんだとが近接
し、はんだごてが冷えきつた時はこてとはんだと
が遠ざかるようにし、構成したことを特徴とした
はんだ供給装置。 The guide is equipped with a soldering iron and a thread solder supply part, and is made of a shape memory alloy. One end of the guide is attached to the heat generating part of the soldering iron or near the heat generating part, and the other end is attached to the solder supply part to form a bridge. The solder supply device is characterized in that the soldering iron and the solder are close to each other when the soldering iron is heated, and the iron and the solder are moved away from each other when the soldering iron has cooled down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10196187U JPS6410366U (en) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10196187U JPS6410366U (en) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6410366U true JPS6410366U (en) | 1989-01-19 |
Family
ID=31331430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10196187U Pending JPS6410366U (en) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6410366U (en) |
-
1987
- 1987-07-01 JP JP10196187U patent/JPS6410366U/ja active Pending
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