JPH0483476U - - Google Patents
Info
- Publication number
- JPH0483476U JPH0483476U JP12711190U JP12711190U JPH0483476U JP H0483476 U JPH0483476 U JP H0483476U JP 12711190 U JP12711190 U JP 12711190U JP 12711190 U JP12711190 U JP 12711190U JP H0483476 U JPH0483476 U JP H0483476U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering iron
- solder material
- tip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 238000005476 soldering Methods 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 13
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は、本考案の第１実施例に係るはんだ供
給装置の構成を示す断面図、第２図は、前記はん
だ供給装置がはんだごてに装着された例を示す斜
視図、第３図は、本考案の第２実施例の構成を示
す要部斜視図、第４図は、本考案の第３実施例の
構成を示す斜視図、第５図は、前記第３実施例の
作用を説明するための要部斜視図である。
１０……はんだホルダ、１２……操作部、１４
……供給部、１６……外装部、１８……はんだ材
、２０，２２，３４，５４，５６……孔部、２４
……供給部のはんだ供給側、２４Ａ……絞り部、
２４Ｂ……爪部、２４Ｃ……切り込み、２８……
リング部材、３０……ばね部材、３２……ばね止
め部材、４０……はんだごて、４１……はんだご
てのこて先、４２……第１実施例のはんだ供給装
置、４４……固定部材、４６……外被部材、４８
……摺動支持部、５０……ノツク部、５２……支
持軸受け。
FIG. 1 is a sectional view showing the configuration of a solder supply device according to a first embodiment of the present invention, FIG. 2 is a perspective view showing an example in which the solder supply device is attached to a soldering iron, and FIG. 4 is a perspective view showing the structure of the third embodiment of the present invention, and FIG. 5 is a perspective view showing the structure of the third embodiment of the present invention. FIG. 2 is a perspective view of a main part for explanation. 10...Solder holder, 12...Operation unit, 14
... Supply part, 16 ... Exterior part, 18 ... Solder material, 20, 22, 34, 54, 56 ... Hole, 24
... Solder supply side of the supply section, 24A ... Squeezed section,
24B...Claw portion, 24C...Notch, 28...
Ring member, 30...Spring member, 32...Spring stop member, 40...Soldering iron, 41...Soldering iron tip, 42...Solder supply device of the first embodiment, 44...Fixation Member, 46... Outer covering member, 48
...Sliding support part, 50...Knot part, 52...Support bearing.
Claims (1)
ための装置であつて、 はんだ材を貯えておくためのはんだホルダと、 はんだごて使用者の操作を供給部に伝達して該
供給部を前進動させるための操作部と、 前進動したときに、はんだ材を挾持し、且つ、
はんだ材長手方向に送ることにより、該はんだ材
をはんだごてのこて先へ供給するための供給部と
、 を備えたことを特徴とするはんだ供給装置。 (2) 請求項１のはんだ供給装置において、 供給部がはんだごての外被部材内に設けられて
いて、はんだ材にはんだごての熱が伝導するのを
防止する構造のものになつていることを特徴とす
るはんだ供給装置。 (3) はんだごてのこて先にはんだ材を供給する
ための装置であつて、 はんだ材を貯えておくためのはんだホルダと、 はんだ材を、はんだごて使用者の操作により送
り出すためのはんだ送り部と、 送り出されたはんだ材を、はんだごてに沿つて
こて先方向に導くと共に、はんだ材使用時にはは
んだ材をはんだごて先に接触させるためのノツク
部と、 を備えたことを特徴とするはんだ供給装置。[Scope of Claim for Utility Model Registration] (1) A device for supplying solder material to the tip of a soldering iron, including a solder holder for storing solder material and operations for a soldering iron user. an operating section for transmitting the information to the supply section to move the supply section forward; and an operation section for clamping the solder material when moving forward;
A solder supply device comprising: a supply section for supplying the solder material to a tip of a soldering iron by feeding the solder material in the longitudinal direction. (2) In the solder supply device of claim 1, the supply portion is provided within the outer jacket member of the soldering iron, and has a structure that prevents heat from the soldering iron from being conducted to the soldering material. A solder supply device characterized by: (3) A device for supplying solder material to the tip of a soldering iron, which includes a solder holder for storing solder material and a device for delivering solder material by operation of the soldering iron user. A solder feeding part; a notch part for guiding the delivered solder material along the soldering iron toward the tip of the soldering iron and for bringing the solder material into contact with the tip of the soldering iron when using the soldering material; A solder supply device featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12711190U JPH0483476U (en) | 1990-11-29 | 1990-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12711190U JPH0483476U (en) | 1990-11-29 | 1990-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0483476U true JPH0483476U (en) | 1992-07-21 |
Family
ID=31874626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12711190U Pending JPH0483476U (en) | 1990-11-29 | 1990-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0483476U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200483142Y1 (en) * | 2015-10-30 | 2017-04-10 | 대우조선해양 주식회사 | The assist device for supply of electrode |
-
1990
- 1990-11-29 JP JP12711190U patent/JPH0483476U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200483142Y1 (en) * | 2015-10-30 | 2017-04-10 | 대우조선해양 주식회사 | The assist device for supply of electrode |
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