JPS61200649U - - Google Patents
Info
- Publication number
- JPS61200649U JPS61200649U JP8426085U JP8426085U JPS61200649U JP S61200649 U JPS61200649 U JP S61200649U JP 8426085 U JP8426085 U JP 8426085U JP 8426085 U JP8426085 U JP 8426085U JP S61200649 U JPS61200649 U JP S61200649U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- thread
- sucking
- tip
- button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図は本考案の糸半田付半田吸取機の実施例の半
田吸取状態説明図である。
１……半田吸取口、２……半田吸取部分、３…
…半田送出釦、４……半田送出ヘツド、５……半
田吸取レバー、６……糸半田、７……糸半田リン
グ、８……ボデイ、９……半田吸取部材、１０…
…手。
The figure is an explanatory diagram of the solder blotting state of the embodiment of the solder blotting machine with thread soldering of the present invention. 1...Solder sucking port, 2...Solder sucking part, 3...
...Solder feed button, 4...Solder feed head, 5...Solder sucking lever, 6...Solder thread, 7...Solder thread ring, 8...Body, 9...Solder sucking member, 10...
…hand.
Claims (1)
のにおいて、把持された状態で操作される半田送
出釦及び半田吸取レバーを有するボデイと、該ボ
デイに固定され先端に加熱部が一体形成された半
田吸取口を有する半田吸取部材と、該ボデイに取
り付けられた糸半田リングから上記半田送出釦を
操作することにより送り出される糸半田の先端を
上記半田吸取口位置に隣接するように保持する半
田送出ヘツドとを設けたことを特徴とする糸半田
付半田吸取紙。 A device for sucking and removing excess solder from a soldered part, which includes a body having a solder feed button and a solder sucking lever that are operated while being held, and a solder sucker that is fixed to the body and has a heating part integrally formed at its tip. a solder sucking member having a mouth, and a solder feeding head that holds a tip of thread solder fed out by operating the solder feeding button from a thread solder ring attached to the body so as to be adjacent to the position of the solder sucking port. A solder blotting paper with thread soldering, characterized in that it is provided with a solder thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8426085U JPS61200649U (en) | 1985-06-04 | 1985-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8426085U JPS61200649U (en) | 1985-06-04 | 1985-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61200649U true JPS61200649U (en) | 1986-12-16 |
Family
ID=30633618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8426085U Pending JPS61200649U (en) | 1985-06-04 | 1985-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61200649U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008527A1 (en) * | 1988-03-17 | 1989-09-21 | Apollo Seiko Ltd. | Method and apparatus for removing defective solder |
-
1985
- 1985-06-04 JP JP8426085U patent/JPS61200649U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989008527A1 (en) * | 1988-03-17 | 1989-09-21 | Apollo Seiko Ltd. | Method and apparatus for removing defective solder |