JPS6398678U - - Google Patents
Info
- Publication number
- JPS6398678U JPS6398678U JP19388286U JP19388286U JPS6398678U JP S6398678 U JPS6398678 U JP S6398678U JP 19388286 U JP19388286 U JP 19388286U JP 19388286 U JP19388286 U JP 19388286U JP S6398678 U JPS6398678 U JP S6398678U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- main body
- printed circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000088 plastic resin Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 claims description 3
- 239000006223 plastic coating Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (xx) | 1986-12-16 | 1986-12-16 | |
| US07/116,662 US4833570A (en) | 1986-12-16 | 1987-11-03 | Electronic circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (xx) | 1986-12-16 | 1986-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398678U true JPS6398678U (xx) | 1988-06-25 |
| JPH0423343Y2 JPH0423343Y2 (xx) | 1992-05-29 |
Family
ID=31150326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19388286U Expired JPH0423343Y2 (xx) | 1986-12-16 | 1986-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423343Y2 (xx) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134945A (ja) * | 2009-12-25 | 2011-07-07 | Toshiba Corp | 電子機器 |
| WO2020059179A1 (ja) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子装置および電子装置における回路基板の絶縁材層形成方法 |
-
1986
- 1986-12-16 JP JP19388286U patent/JPH0423343Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134945A (ja) * | 2009-12-25 | 2011-07-07 | Toshiba Corp | 電子機器 |
| WO2020059179A1 (ja) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | 電子装置および電子装置における回路基板の絶縁材層形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423343Y2 (xx) | 1992-05-29 |