JPS6398648U - - Google Patents
Info
- Publication number
- JPS6398648U JPS6398648U JP19315386U JP19315386U JPS6398648U JP S6398648 U JPS6398648 U JP S6398648U JP 19315386 U JP19315386 U JP 19315386U JP 19315386 U JP19315386 U JP 19315386U JP S6398648 U JPS6398648 U JP S6398648U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- leads
- lead
- extending
- dam part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19315386U JPS6398648U (pt-PT) | 1986-12-17 | 1986-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19315386U JPS6398648U (pt-PT) | 1986-12-17 | 1986-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6398648U true JPS6398648U (pt-PT) | 1988-06-25 |
Family
ID=31148913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19315386U Pending JPS6398648U (pt-PT) | 1986-12-17 | 1986-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398648U (pt-PT) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122154A (en) * | 1980-02-28 | 1981-09-25 | Mitsubishi Electric Corp | Semiconductor device |
-
1986
- 1986-12-17 JP JP19315386U patent/JPS6398648U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122154A (en) * | 1980-02-28 | 1981-09-25 | Mitsubishi Electric Corp | Semiconductor device |