JPS6398647U - - Google Patents

Info

Publication number
JPS6398647U
JPS6398647U JP19476086U JP19476086U JPS6398647U JP S6398647 U JPS6398647 U JP S6398647U JP 19476086 U JP19476086 U JP 19476086U JP 19476086 U JP19476086 U JP 19476086U JP S6398647 U JPS6398647 U JP S6398647U
Authority
JP
Japan
Prior art keywords
metal substrates
insulating film
conductive path
circuit elements
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19476086U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442937Y2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19476086U priority Critical patent/JPH0442937Y2/ja
Publication of JPS6398647U publication Critical patent/JPS6398647U/ja
Application granted granted Critical
Publication of JPH0442937Y2 publication Critical patent/JPH0442937Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19105Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP19476086U 1986-12-18 1986-12-18 Expired JPH0442937Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19476086U JPH0442937Y2 (fr) 1986-12-18 1986-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19476086U JPH0442937Y2 (fr) 1986-12-18 1986-12-18

Publications (2)

Publication Number Publication Date
JPS6398647U true JPS6398647U (fr) 1988-06-25
JPH0442937Y2 JPH0442937Y2 (fr) 1992-10-12

Family

ID=31152030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19476086U Expired JPH0442937Y2 (fr) 1986-12-18 1986-12-18

Country Status (1)

Country Link
JP (1) JPH0442937Y2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151173A (ja) * 2011-01-17 2012-08-09 Nec Corp 3次元実装型半導体装置、および電子機器
JP2016219715A (ja) * 2015-05-26 2016-12-22 住友ベークライト株式会社 絶縁ゲートバイポーラトランジスタ素子、樹脂組成物およびサージ対策部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151173A (ja) * 2011-01-17 2012-08-09 Nec Corp 3次元実装型半導体装置、および電子機器
JP2016219715A (ja) * 2015-05-26 2016-12-22 住友ベークライト株式会社 絶縁ゲートバイポーラトランジスタ素子、樹脂組成物およびサージ対策部材

Also Published As

Publication number Publication date
JPH0442937Y2 (fr) 1992-10-12

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