JPS6398630U - - Google Patents
Info
- Publication number
- JPS6398630U JPS6398630U JP1986194749U JP19474986U JPS6398630U JP S6398630 U JPS6398630 U JP S6398630U JP 1986194749 U JP1986194749 U JP 1986194749U JP 19474986 U JP19474986 U JP 19474986U JP S6398630 U JPS6398630 U JP S6398630U
- Authority
- JP
- Japan
- Prior art keywords
- syringe
- resin adhesive
- needles
- semiconductor chip
- bonding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986194749U JPS6398630U (enExample) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986194749U JPS6398630U (enExample) | 1986-12-18 | 1986-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6398630U true JPS6398630U (enExample) | 1988-06-25 |
Family
ID=31152009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986194749U Pending JPS6398630U (enExample) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398630U (enExample) |
-
1986
- 1986-12-18 JP JP1986194749U patent/JPS6398630U/ja active Pending