JPS639723B2 - - Google Patents
Info
- Publication number
- JPS639723B2 JPS639723B2 JP57092214A JP9221482A JPS639723B2 JP S639723 B2 JPS639723 B2 JP S639723B2 JP 57092214 A JP57092214 A JP 57092214A JP 9221482 A JP9221482 A JP 9221482A JP S639723 B2 JPS639723 B2 JP S639723B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- resistor
- case
- mold
- variable resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
本発明は、抵抗体及び電極部が表面に形成され
た抵抗体基板と基板の表面を除く領域を覆うケー
スと基板及びケースに対して固定されて電極部に
接続されたリード端子とを有する可変抵抗器用基
体を製造する方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention is characterized in that a resistor and an electrode part are connected to a resistor substrate formed on the surface thereof, a case covering an area other than the surface of the substrate, and a case that is fixed to the substrate and the case and connected to the electrode part. The present invention relates to a method for manufacturing a variable resistor substrate having lead terminals.
一般に可変抵抗器は、表面に抵抗体と電極部と
を形成した抵抗体基板と、この基板に対して回転
自在に設けられた回転軸と、この回転軸に支持さ
れて基板上の抵抗体に接触しつつ回動する摺動子
とを備えており、耐湿性及び防塵性を要求される
場合には、これらの各部をシーケング内に配置し
た密閉型の可変抵抗器が用いられている。密閉型
の可変抵抗器を構成する場合、抵抗体基板の表面
を除く領域を覆うケースを設けて、該ケースと抵
抗体基板とにより基体を形成し、この基体のケー
スの周辺部に基板表面を覆うカバーを接合して、
該カバーに摺動子を保持した回転軸を支持する構
造が多く採用されている。従来この種の可変抵抗
器の基体を製造する場合には、先ず、第１図ｂに
示すようにリード端子１を保持位置に保持したケ
ース２を成形し、次いでこのケース内に同図ａに
示す抵抗体基板３を挿入して、同図ｃに示すよう
にケース２と基板３との間に形成された間隙ｄ内
に接着剤を注入することにより基板とケースとを
一体化していた。そして基板３に形成された孔３
ａを貫通させたリード端子１を基板の表面側に折
曲げて半田４により各リード端子を基板表面の電
極部に接続し、これらのケース２、リード端子１
及び基板３により可変抵抗器用基体５を構成して
いた。しかしながら、上記のような方法により可
変抵抗器用基体を製造するには、ケースとリード
端子とを一体に成形する工程と、ケース内に基板
を固着する工程とを行なう必要があるため、工数
が多くなつてコストが高くなる欠点があつた。ま
たケースと抵抗体基板とを接着剤により固着する
ので、両者の結合強度にばらつきを生じ、製品の
品質が不均一になる欠点があつた。 In general, a variable resistor consists of a resistor substrate with a resistor and an electrode formed on its surface, a rotating shaft that is rotatably provided with respect to this substrate, and a resistor that is supported by this rotating shaft and that is connected to the resistor on the substrate. The variable resistor is equipped with a slider that rotates while making contact with the resistor, and when moisture resistance and dust resistance are required, a sealed variable resistor is used in which each of these parts is arranged in a sequence. When configuring a sealed variable resistor, a case is provided that covers the area other than the surface of the resistor substrate, the case and the resistor substrate form a base, and the surface of the substrate is covered around the periphery of the case of the base. Join the cover to cover the
A structure in which the cover supports a rotating shaft holding a slider is often adopted. Conventionally, when manufacturing the base of this type of variable resistor, first, a case 2 holding the lead terminal 1 in a holding position is formed as shown in FIG. The resistor substrate 3 shown in the figure was inserted, and the substrate and the case were integrated by injecting adhesive into the gap d formed between the case 2 and the substrate 3, as shown in FIG. And a hole 3 formed in the substrate 3
The lead terminals 1 that have been passed through a are bent to the front side of the board, and each lead terminal is connected to the electrode part on the board surface with solder 4, and these cases 2 and lead terminals 1 are
and the substrate 3 constituted a variable resistor base 5. However, manufacturing a variable resistor substrate using the method described above requires a process of integrally molding the case and lead terminals, and a process of fixing the board inside the case, which requires a large number of man-hours. The drawback was that the cost would increase over time. Furthermore, since the case and the resistor substrate are fixed with adhesive, there is a drawback that the strength of the bond between the two varies, resulting in non-uniform product quality.
本発明は、上記に鑑み、ケースの成形と該ケー
スに対するリード端子の固定とケースと抵抗体基
板との固定とを同時に一工程で行なうことによ
り、工数の削減を図り、ケースと抵抗体基板との
結合強度を均一にすることができるようにした可
変抵抗器用基体を製造する方法を提案したもので
ある。 In view of the above, the present invention aims to reduce the number of man-hours by molding the case, fixing the lead terminals to the case, and fixing the case and the resistor board at the same time in one process, and connects the case and the resistor board. This paper proposes a method for manufacturing a variable resistor substrate that can make the bonding strength uniform.
以下本発明の可変抵抗器用基体を製造する方法
を図面を参照して詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a variable resistor substrate according to the present invention will be explained in detail below with reference to the drawings.
第２図ａ，ｂは、本発明の製造方法を実施する
成形装置の一例を示したもので、同図に示した成
形装置は、金型Ａとこの金型に絶縁性の合成樹脂
を供給する樹脂供給機構Ｂとからなつている。金
型Ａは、樹脂供給機構Ｂが接続される第１の金型
A1と、抵抗体基体１１を所定位置に位置決め固
定する第２の型A2と、第１の型A1及び第２の型
A2とともにリードフレーム１２を位置決め固定
する第３の型A3とからなつており、この金型Ａ
内には第１乃至第３の型A1乃至A3により囲まれ
たキヤビテイＣが構成されるようになつている。
樹脂供給機構Ｂは、第１の型A1に接続された本
体B1内にスクリユーB2を配設したもので、本体
B1に取付けられたホツパB3内の樹脂をスクリユ
ーB2を駆動してキヤビテイＣ内に給送するよう
になつている。 Figures 2a and 2b show an example of a molding apparatus for carrying out the manufacturing method of the present invention. and a resin supply mechanism B. Mold A is the first mold to which resin supply mechanism B is connected.
A 1 , a second mold A 2 for positioning and fixing the resistor base 11 in a predetermined position, a first mold A 1 and a second mold
It consists of a third mold A 3 that positions and fixes the lead frame 12 together with A 2 , and this mold A
A cavity C surrounded by first to third molds A 1 to A 3 is formed inside.
The resin supply mechanism B has a screw B 2 arranged inside the main body B 1 connected to the first mold A 1.
The resin in the hopper B3 attached to B1 is fed into the cavity C by driving the screw B2 .
上記の成形装置を用いて本発明の方法を実施す
るには、先ず、第２図ａに示すように抵抗体基板
１１を金型Ａ内に位置決めする。抵抗体基板１１
はセラミツク等の絶縁基板１１ａの表面に円弧状
のパターンを有する抵抗体１１ｂと、中間電極１
１ｃと、端子電極１１ｄ〜１１ｆとを形成したも
ので、中間電極１１ｃは抵抗体１１ｂのパターン
の内側の中央部に形成されている。また端子電極
１１ｄ〜１１ｆは基体１１の表面の一端部に設け
られていて両側の端子電極１１ｄ及び１１ｆは抵
抗体１１ｂの両端に、また中央の端子電極１１ｅ
は中間電極１１ｃにそれぞれ接続されている。こ
の抵抗体基板１１を第２の型A2内に位置決めす
る場合、抵抗体基板１１の表面を第２の型A2の
底面に密接させて、抵抗体基板の表面に樹脂を付
着させないようしておく。次いで、上記端子電極
１１ｄ〜１１ｆにそれぞれ接続されるリード端子
１２ａ〜１２ｃをフレーム１２ｄ，１２ｄにより
連結したリードフレーム１２を用意して、このリ
ードフレーム１２のリード端子１２ａ〜１２ｃを
それぞれ端子電極１１ｄ〜１１ｆに対応させて基
板１１の一端部側面に添わせ、第１の型A1を第
２の型A2に合わせるとともに第３の型A3を第１
及び第２の型A1及びA2に合わせてこれらの型を
相互に結合する。しかる後キヤビテイＣ内に絶縁
性樹脂を注入し、該樹脂を硬化させる。キヤビテ
イＣ内の樹脂が硬化した後、第２図ｂに示すよう
に各型を相互に離反させて抵抗体基板１１とリー
ドフレーム１２とケース１３とからなる成形物Ｄ
を取出す。この成形物Ｄにおいては第３図ａ乃至
ｃに示されているように抵抗体基板１１の各端子
電極１１ｄ〜１１ｆに対応するリード端子１２ａ
〜１２ｃがフレーム１２ｄ，１２ｄによつて連結
されているので、第３図ｃに示す一点鎖線イ及び
ロに示す位置で切断してフレーム１２ｄ，１２ｄ
を各リード端子１２ａ〜１２ｃから切り離す。次
に成形物Ｄの各リード端子１２ａ〜１２ｃの端子
電極１１ｄ〜１１ｆに対応する端部を折曲げ、半
田１４により対応するリード端子１２ａ〜１２ｃ
と端子電極１１ｄ〜１１ｆとを電気的に接続して
可変抵抗器用基体１５を完成する（第４図参
照。）。 To carry out the method of the present invention using the above molding apparatus, first, the resistor substrate 11 is positioned within the mold A as shown in FIG. 2a. Resistor board 11
A resistor 11b having an arc-shaped pattern on the surface of an insulating substrate 11a made of ceramic or the like, and an intermediate electrode 1
1c and terminal electrodes 11d to 11f are formed, and the intermediate electrode 11c is formed at the center inside the pattern of the resistor 11b. Further, the terminal electrodes 11d to 11f are provided at one end of the surface of the base 11, the terminal electrodes 11d and 11f on both sides are provided on both ends of the resistor 11b, and the terminal electrode 11e in the center is provided on both ends of the resistor 11b.
are respectively connected to the intermediate electrode 11c. When positioning this resistor board 11 inside the second mold A 2 , the surface of the resistor board 11 should be brought into close contact with the bottom surface of the second mold A 2 to prevent resin from adhering to the surface of the resistor board. I'll keep it. Next, a lead frame 12 is prepared in which the lead terminals 12a to 12c connected to the terminal electrodes 11d to 11f, respectively, are connected by frames 12d, 12d, and the lead terminals 12a to 12c of this lead frame 12 are connected to the terminal electrodes 11d to 11f, respectively. 11f, align the first mold A1 with the second mold A2 , and align the third mold A3 with the first mold A3.
and combining these molds with each other according to the second molds A 1 and A 2 . After that, an insulating resin is injected into the cavity C and the resin is hardened. After the resin in the cavity C has hardened, the molds are separated from each other as shown in FIG.
Take out. In this molded product D, as shown in FIGS.
~12c are connected by the frames 12d, 12d, so they are cut at the positions indicated by the dashed lines A and B shown in FIG.
are separated from each lead terminal 12a to 12c. Next, the ends of the lead terminals 12a to 12c of the molded product D corresponding to the terminal electrodes 11d to 11f are bent, and solder 14 is applied to the corresponding lead terminals 12a to 12c.
and the terminal electrodes 11d to 11f are electrically connected to complete the variable resistor base 15 (see FIG. 4).
上記のようにして製造された可変抵抗器用基体
を用いて組立てた可変抵抗器の一例を第５図に示
す。同図において、１６は絶縁性樹脂からなるカ
バーで、このカバーはその下端がケース１３の周
辺部に接着されてケースに一体化され、カバー１
６及びケース１３により可変抵抗器を密封するケ
ーシングが構成されている。カバー１６は断面円
形の中空部を有し、この中空部内に回転体１７が
回転自在に嵌合されている。回転体１７は端部に
軸部１７ａを有していてこの軸部１７ａがカバー
１６の底壁部に設けられた孔１６ａに嵌合され、
軸部１７ａの端面にドライバのビツトを係入する
スロツト１７ｂが形成されている。カバー１６の
孔１６ａ付近には回転体１７との間にＯリング１
８が介在されており、このＯリング１８によつて
カバー１６内が密閉されている。カバー１６には
摺動子１９が保持されており、この摺動子が抵抗
体基板１１上の抵抗体１１ｂと中間端子電極１１
ｃとに接触しつつ基板１１上を摺動するようにな
つている。リード端子１２ａ〜１２ｃのうち両端
のリード端子１２ａ，１２ｃは基板１１の板面と
平行な方向に折曲げられ、中央のリード端子１２
ｂは基板１１の板面と直角な方向に折曲げられた
後基板の板面と平行な方向に折曲げられている。 FIG. 5 shows an example of a variable resistor assembled using the variable resistor base manufactured as described above. In the figure, reference numeral 16 denotes a cover made of insulating resin, the lower end of which is glued to the peripheral part of the case 13 and integrated with the case.
6 and case 13 constitute a casing that seals the variable resistor. The cover 16 has a hollow portion having a circular cross section, and a rotating body 17 is rotatably fitted into the hollow portion. The rotating body 17 has a shaft portion 17a at its end, and this shaft portion 17a is fitted into a hole 16a provided in the bottom wall of the cover 16.
A slot 17b into which a bit of a driver is inserted is formed in the end face of the shaft portion 17a. An O-ring 1 is installed near the hole 16a of the cover 16 between it and the rotating body 17.
8 is interposed therebetween, and the inside of the cover 16 is hermetically sealed by this O-ring 18. A slider 19 is held on the cover 16, and this slider connects the resistor 11b on the resistor substrate 11 and the intermediate terminal electrode 11.
It is designed to slide on the substrate 11 while making contact with the substrate 11. Among the lead terminals 12a to 12c, the lead terminals 12a and 12c at both ends are bent in a direction parallel to the plate surface of the board 11, and the lead terminal 12a at the center
b is bent in a direction perpendicular to the plate surface of the substrate 11, and then bent in a direction parallel to the plate surface of the substrate.
上記実施例のように、可変抵抗器用基体を製造
する方法においては、リードフレームを抵抗体基
板の端部に添わせてケースを成形するようにする
と、抵抗体基板に従来のようにリード端子挿入用
の孔を形成する必要がないので、セラミツク等の
孔あけ加工が困難な材質の基板を用いることがで
きる。 As in the above example, in the method of manufacturing a variable resistor substrate, if the case is molded with the lead frame aligned with the end of the resistor substrate, the lead terminals can be inserted into the resistor substrate as in the conventional method. Since there is no need to form a hole for this purpose, a substrate made of a material such as ceramic, which is difficult to drill, can be used.
尚上記の実施例で用いた樹脂供給機構Ｂは樹脂
の押出機であるが、この樹脂供給機構Ｂを、樹脂
のキヤビテイ内に射出する射出機としてもよいの
は勿論である。 Although the resin supply mechanism B used in the above embodiment is a resin extruder, it goes without saying that the resin supply mechanism B may also be an injection machine that injects resin into a cavity.
以上のように本発明の製造方法によれば、ケー
スを成形する際にケースと抵抗体基板とリード端
子とを同時に一体成形するので、工数の削減を図
つてコストを引下げることができる。またケース
と抵抗体基板との結合強度が均一になるので、機
械的強度及び寸法的な面で品質の安定化を図るこ
とができる利点がある。 As described above, according to the manufacturing method of the present invention, when molding the case, the case, the resistor board, and the lead terminal are integrally molded at the same time, so that it is possible to reduce the number of man-hours and reduce costs. Further, since the bonding strength between the case and the resistor substrate becomes uniform, there is an advantage that quality can be stabilized in terms of mechanical strength and dimensions.
第１図ａは従来の抵抗体基板を示す斜視図、第
１図ｂは従来のリード端子を有するケースの斜視
図、第１図ｃは従来の可変抵抗器用基体の縦断面
図、第２図ａ及びｂはそれぞれ本発明の製造方法
を説明する説明図、第３図ａ，ｂ及びｃはそれぞ
れ第２図ａ，ｂに示す成形装置により製造された
成形物を示す平面図、同図ａのｂ−ｂ線断面
図及び同図ａのｃ−ｃ線断面図、第４図は本
発明の製造方法により製作された可変抵抗器用基
体の平面図、第５図は本発明の製造方法により製
作された可変抵抗器用基体を用いて組立てた可変
抵抗器の一例を示す縦断面図である。
１１……抵抗体基板、１１ｂ……抵抗体、１１
ｄ〜１１ｆ……端子電極、１２ａ〜１２ｃ……リ
ード端子、１３……ケース、１５……可変抵抗器
用基体、Ａ……金型。
Fig. 1a is a perspective view of a conventional resistor substrate, Fig. 1b is a perspective view of a case with a conventional lead terminal, Fig. 1c is a longitudinal sectional view of a conventional variable resistor substrate, and Fig. 2 a and b are explanatory diagrams for explaining the manufacturing method of the present invention, respectively; FIGS. 3 a, b, and c are plan views showing molded products manufactured by the molding apparatus shown in FIGS. 2 a and b, respectively; and FIG. 4 is a plan view of a variable resistor base manufactured by the manufacturing method of the present invention, and FIG. 5 is a sectional view taken along the line cc of FIG. FIG. 3 is a longitudinal cross-sectional view showing an example of a variable resistor assembled using the manufactured variable resistor base. 11...Resistor board, 11b...Resistor, 11
d to 11f...Terminal electrode, 12a to 12c...Lead terminal, 13...Case, 15...Variable resistor base, A...Mold.
Claims (1)
された抵抗体基板と該基板の表面を除く領域を覆
う絶縁樹脂製のケースと前記基板及びケースに対
して固定されて前記電極部に接続されたリード端
子とを有する可変抵抗器用基体を製造する方法に
おいて、前記抵抗体基板と前記リード端子とを前
記ケースを成形する金型内に挿入し、前記金型内
に樹脂を注入して前記ケースを成形すると同時に
前記リード端子及び基板と該ケースと一体化する
ことを特徴とする可変抵抗器用基体を製造する方
法。1. A resistor substrate on which a resistor for a variable resistor and an electrode portion are formed, a case made of an insulating resin that covers an area other than the surface of the substrate, and a case that is fixed to the substrate and the case and connected to the electrode portion. In the method for manufacturing a variable resistor substrate having lead terminals, the resistor substrate and the lead terminals are inserted into a mold for molding the case, and a resin is injected into the mold to form the case. A method for manufacturing a variable resistor substrate, characterized in that the lead terminals and the substrate are integrated with the case at the same time as the molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57092214A JPS58210603A (en) | 1982-06-01 | 1982-06-01 | Method of producing substrate for variable resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57092214A JPS58210603A (en) | 1982-06-01 | 1982-06-01 | Method of producing substrate for variable resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58210603A JPS58210603A (en) | 1983-12-07 |
| JPS639723B2 true JPS639723B2 (en) | 1988-03-01 |
Family
ID=14048185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57092214A Granted JPS58210603A (en) | 1982-06-01 | 1982-06-01 | Method of producing substrate for variable resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58210603A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101800U (en) * | 1983-12-16 | 1985-07-11 | アルプス電気株式会社 | Connection of electrical parts |
| JPS62112303A (en) * | 1985-11-11 | 1987-05-23 | 株式会社村田製作所 | Electronic parts |
| JPS62125603A (en) * | 1985-11-26 | 1987-06-06 | 株式会社村田製作所 | Electronic parts |
| JPS6312104A (en) * | 1986-07-02 | 1988-01-19 | 株式会社村田製作所 | Electronic parts |
| JPH01305502A (en) * | 1988-06-03 | 1989-12-08 | Murata Mfg Co Ltd | Semifixed rheostat |
| JPH02105502A (en) * | 1988-10-14 | 1990-04-18 | Nec Corp | Variable resistor |
| JP2531009B2 (en) * | 1988-11-05 | 1996-09-04 | 株式会社村田製作所 | Variable resistor |
| JPH02168601A (en) * | 1989-10-17 | 1990-06-28 | Alps Electric Co Ltd | Manufacture of connected body of electronic parts |
| JPH03204904A (en) * | 1989-10-20 | 1991-09-06 | Murata Mfg Co Ltd | Variable resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3380011A (en) * | 1967-04-06 | 1968-04-23 | Bourns Inc | Adjustable resistor |
| JPS55151305A (en) * | 1979-05-15 | 1980-11-25 | Nippon Electric Co | Variable resistor |
| US4323293A (en) * | 1980-06-30 | 1982-04-06 | Bourns, Inc. | Terminal lead with labyrinthine clip |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838599Y2 (en) * | 1978-03-27 | 1983-09-01 | 株式会社村田製作所 | variable capacitor |
| JPS5834721Y2 (en) * | 1979-01-12 | 1983-08-04 | 太陽誘電株式会社 | Molded electrical parts |
| JPS5771306U (en) * | 1980-10-17 | 1982-04-30 |
-
1982
- 1982-06-01 JP JP57092214A patent/JPS58210603A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3380011A (en) * | 1967-04-06 | 1968-04-23 | Bourns Inc | Adjustable resistor |
| JPS55151305A (en) * | 1979-05-15 | 1980-11-25 | Nippon Electric Co | Variable resistor |
| US4323293A (en) * | 1980-06-30 | 1982-04-06 | Bourns, Inc. | Terminal lead with labyrinthine clip |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58210603A (en) | 1983-12-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4974120A (en) | IC card | |
| JPS639723B2 (en) | ||
| US4012579A (en) | Encapsulated microcircuit package and method for assembly thereof | |
| US5357662A (en) | Method of manufacturing chip-type piezoelectric-resonator | |
| JPH0714114B2 (en) | Case mounting method for electronic parts using flexible board | |
| US20030085794A1 (en) | Efficiently manufacturable electrical part with connector housing and manufacturing method therefor | |
| JP3581839B2 (en) | Manufacturing method of small antenna | |
| JPH0720625Y2 (en) | Magnetoresistive sensor | |
| JPH0727631Y2 (en) | Semiconductor package structure | |
| DE3380586D1 (en) | Electrode-comb manufacturing device | |
| JP2604054B2 (en) | Method for manufacturing semiconductor device | |
| JPH0689944A (en) | Method and device for manufacturing electronic element mounting body and its terminal block structure | |
| JPH0520969A (en) | Mould assembly method for drip-proof type switch | |
| KR19980086402A (en) | Electronic components with piezoelectric two-terminal components | |
| JPS6215142B2 (en) | ||
| JPH06334109A (en) | Lead frame for semiconductor device and manufacture of semiconductor device | |
| JPS6233641B2 (en) | ||
| JP2968007B2 (en) | Magnetic sensor fixing holder and method of manufacturing magnetic sensor fixing holder | |
| JPH0621123A (en) | Manufacture of molded part | |
| JPS55107252A (en) | Manufacture of semiconductor device | |
| JPH0158845B2 (en) | ||
| JP2705099B2 (en) | Electrical circuit components | |
| JPS6434145A (en) | Stator for motor and manufacture thereof | |
| JPH05275915A (en) | Production of antenna module | |
| JPH053721B2 (en) |