JPS6397235U - - Google Patents
Info
- Publication number
- JPS6397235U JPS6397235U JP1986193175U JP19317586U JPS6397235U JP S6397235 U JPS6397235 U JP S6397235U JP 1986193175 U JP1986193175 U JP 1986193175U JP 19317586 U JP19317586 U JP 19317586U JP S6397235 U JPS6397235 U JP S6397235U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- metal foil
- holes
- hole
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986193175U JPS6397235U (de) | 1986-12-15 | 1986-12-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986193175U JPS6397235U (de) | 1986-12-15 | 1986-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6397235U true JPS6397235U (de) | 1988-06-23 |
Family
ID=31148954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986193175U Pending JPS6397235U (de) | 1986-12-15 | 1986-12-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6397235U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998018163A1 (en) * | 1996-10-22 | 1998-04-30 | Seiko Epson Corporation | Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance |
| WO1998033212A1 (en) * | 1997-01-23 | 1998-07-30 | Seiko Epson Corporation | Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment |
-
1986
- 1986-12-15 JP JP1986193175U patent/JPS6397235U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998018163A1 (en) * | 1996-10-22 | 1998-04-30 | Seiko Epson Corporation | Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, its manufacturing method, package substrate, and electronic appliance |
| KR100455492B1 (ko) * | 1996-10-22 | 2005-01-13 | 세이코 엡슨 가부시키가이샤 | 필름캐리어테이프및그제조방법,테이프캐리어반도체장치어셈블리의제조방법,반도체장치및그제조방법,실장기판및전자기기 |
| SG165145A1 (en) * | 1996-10-22 | 2010-10-28 | Seiko Epson Corp | Film carrier tape |
| WO1998033212A1 (en) * | 1997-01-23 | 1998-07-30 | Seiko Epson Corporation | Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment |