JPS6395630A - Manufacturing equipment for semiconductor device - Google Patents

Abstract

PURPOSE:To make etchant spread over the whole fully and uniformly by causing a carrier housing a semiconductor substrate to be held in a state having an inclination so that etchant can run smoothly along an etching plane of the semiconductor substrate. CONSTITUTION:A mounting pedestal 1 is installed on the bottom of an etching vessel 5 where etchant 4 is housed and its upper plane is formed at an inclined plane 1a. The mounting pedestal 1 is used as a holder of a carrier and it supports the carrier 2 in a state having an inclination by supporting it at a protrusion 1b located at the end of the inclined plane 1a. Accordingly, the semiconductor substrate 3 in the carrier 2 that is in the state having the inclination is tilted in the same direction and the rear of its substrate is so in contact with one side of the inside walls of a groove 2a that a space of an etching plane side 3a becomes wider all the more. Its space condition permits etchant to improve its fluidity along the etching plane 3a and the whole plane is uniformly treated by etching.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing semiconductor devices, and particularly to an apparatus for etching a semiconductor substrate with chemicals.

[Prior Art] Conventionally, when etching a semiconductor substrate with chemicals, as shown in FIGS. 3 and 4, the semiconductor substrates 3, 3, . . .
was placed vertically on a carrier 2, and this carrier 2 was held on a stand 1 or a hanger 6 in a tank 5 containing an etching solution 4 and set horizontally.

[Problems to be Solved by the Invention] When etching a semiconductor substrate with chemicals, conventionally the semiconductor substrate was stood vertically on a carrier and the carrier was set horizontally in an apparatus containing an etching solution. The gap between the periphery of the surface to be etched and the groove of the carrier is narrow, and in some cases it may come into contact with the groove, so a highly viscous etching solution cannot fully enter the gap, and a highly reactive etching solution cannot be used. In this case, there was a drawback that uneven etching occurred due to the adhesion of bubbles.

An object of the present invention is to provide a semiconductor device manufacturing apparatus that prevents uneven etching of a semiconductor substrate.

[Differences between the invention and the prior art] In contrast to the above-mentioned conventional apparatus, the present invention sets the carrier containing the semiconductor substrate obliquely in the etching bath, thereby making it possible to align the surface of the semiconductor substrate to be etched with the groove of the carrier. Since the gap can be maintained at the maximum at all times, even a highly viscous etching solution can easily enter the gap, and even a highly reactive etching solution can prevent bubbles from adhering, which is an original feature.

[Means for Solving the Problems] The present invention provides an apparatus for etching a semiconductor substrate by eutectic etching, which is equipped with a holder for holding a carrier in which a semiconductor substrate is vertically propped up and held in an inclined position in an etching tank. This is a semiconductor device manufacturing apparatus characterized by:

[Function] As mentioned above, the wafer storage carrier 2 holds the semiconductor substrate 3.
Grooves 28 are provided in the vertical direction for holding the semiconductor substrates 2a in parallel with each other, and the semiconductor substrates 3 are vertically placed in each groove 2a and held in parallel. Therefore, when the carrier 2 is set horizontally as shown in FIG. 3, the semiconductor substrate 3 is placed vertically, so the semiconductor substrate 3 is located approximately at the center of the groove 2a, and there is a gap on both sides of the semiconductor substrate. As a result, the gap between the etched surface 3a of the semiconductor substrate 3 and the inner wall 2b of the semiconductor substrate 3 becomes narrower. As shown in FIG. 1, when the carrier 2 is tilted and the back surface of the semiconductor substrate 3 opposite to the etched surface 3a is brought into contact with one inner wall 2b of the $2a, the gap on the back surface side of the semiconductor substrate 3 is eliminated, and the gap is removed by that amount. The gap on the etched surface side of the raw conductor substrate 3 becomes wider.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) As shown in FIG. 1, in this example, the upper surface of the mounting table 1 provided at the bottom of the etching tank 5 that stores the etching liquid 4 is formed into an inclined surface 1a, and the mounting table 1 is used to hold the carrier. As a tool, the carrier 2 is supported by the inclined surface 1a of the mounting base 1 and the protrusion 1b located at the end of the inclined surface 1a to hold the carrier 2 in an inclined posture. The slope 1a is, for example, 10 to 1
Set at 5°. As a result, the semiconductor substrates 3 in the inclined carrier 2 are tilted in the same direction, and their back surfaces contact one of the inner walls 2b of the grooves 2a. Therefore, the fluidity of the etching solution along the etching surface 3a of the semiconductor substrate 3 is improved, and the etching surface 3a of the substrate 3 becomes wider.
The entire surface will be uniformly etched.

(Example 2) FIG. 2 shows a second embodiment of the invention.

This embodiment shows an example of a structure in which a hanger is used as a holder, and a carrier 3 containing a semiconductor substrate is held by a hanger 6 and set in an etching tank 5. In this embodiment, one arm 6a of the hanger 6 is extended downward from the other arm 6b, and the lower ends of the two long and short arms 6a, 6b support both ends of the carrier 2, tilting the carrier 2 at an angle of 10 to 15 degrees.
The device is held in a tilted position. In this embodiment, the same effects as in the first embodiment can be obtained except that the carrier 2 is suspended.

[Effects of the Invention] As explained above, the present invention maintains the carrier containing the semiconductor substrate in an inclined position and improves the fluidity of the etching solution along the etching surface of the semiconductor substrate. This has the effect that the etching solution can be sufficiently spread over the entire area and can be etched uniformly.

[Brief explanation of the drawing]

1 and 2 are sectional views showing an embodiment of the present invention, and FIGS. 3 and 4 are sectional views showing a conventional example.

Claims (1)

[Claims] (1) A semiconductor device manufacturing apparatus for etching a semiconductor substrate with chemicals, characterized in that the apparatus is equipped with a holder for holding a carrier in which a semiconductor substrate is vertically propped up and held in an inclined position in an etching tank.