JPS6395276U - - Google Patents
Info
- Publication number
- JPS6395276U JPS6395276U JP19110586U JP19110586U JPS6395276U JP S6395276 U JPS6395276 U JP S6395276U JP 19110586 U JP19110586 U JP 19110586U JP 19110586 U JP19110586 U JP 19110586U JP S6395276 U JPS6395276 U JP S6395276U
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- printed circuit
- attached
- circuit board
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19110586U JPS6395276U (de) | 1986-12-11 | 1986-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19110586U JPS6395276U (de) | 1986-12-11 | 1986-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6395276U true JPS6395276U (de) | 1988-06-20 |
Family
ID=31144942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19110586U Pending JPS6395276U (de) | 1986-12-11 | 1986-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395276U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021077790A (ja) * | 2019-11-11 | 2021-05-20 | 三菱電機株式会社 | 半導体装置の製造方法 |
-
1986
- 1986-12-11 JP JP19110586U patent/JPS6395276U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021077790A (ja) * | 2019-11-11 | 2021-05-20 | 三菱電機株式会社 | 半導体装置の製造方法 |