JPS6393691U - - Google Patents
Info
- Publication number
- JPS6393691U JPS6393691U JP1986188644U JP18864486U JPS6393691U JP S6393691 U JPS6393691 U JP S6393691U JP 1986188644 U JP1986188644 U JP 1986188644U JP 18864486 U JP18864486 U JP 18864486U JP S6393691 U JPS6393691 U JP S6393691U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- insertion hole
- electronic component
- circuit board
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986188644U JPS6393691U (US06330241-20011211-M00004.png) | 1986-12-08 | 1986-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986188644U JPS6393691U (US06330241-20011211-M00004.png) | 1986-12-08 | 1986-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393691U true JPS6393691U (US06330241-20011211-M00004.png) | 1988-06-17 |
Family
ID=31140199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986188644U Pending JPS6393691U (US06330241-20011211-M00004.png) | 1986-12-08 | 1986-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393691U (US06330241-20011211-M00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06220880A (ja) * | 1993-01-28 | 1994-08-09 | Komatsu Ltd | 建設機械等用ブーム構造物 |
| JP2019054017A (ja) * | 2017-09-12 | 2019-04-04 | アイシン精機株式会社 | 電子部品 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940760B1 (US06330241-20011211-M00004.png) * | 1971-05-14 | 1974-11-05 | ||
| JPS525703A (en) * | 1976-06-25 | 1977-01-17 | Rhone Poulenc Ind | Method of producing primary alcohol |
| JPS52102678A (en) * | 1976-02-25 | 1977-08-29 | Nikkan Ind | Heat conductive electric insulation sheet and method of manufacture thereof |
-
1986
- 1986-12-08 JP JP1986188644U patent/JPS6393691U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4940760B1 (US06330241-20011211-M00004.png) * | 1971-05-14 | 1974-11-05 | ||
| JPS52102678A (en) * | 1976-02-25 | 1977-08-29 | Nikkan Ind | Heat conductive electric insulation sheet and method of manufacture thereof |
| JPS525703A (en) * | 1976-06-25 | 1977-01-17 | Rhone Poulenc Ind | Method of producing primary alcohol |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06220880A (ja) * | 1993-01-28 | 1994-08-09 | Komatsu Ltd | 建設機械等用ブーム構造物 |
| JP2019054017A (ja) * | 2017-09-12 | 2019-04-04 | アイシン精機株式会社 | 電子部品 |
