JPS639028B2 - - Google Patents
Info
- Publication number
- JPS639028B2 JPS639028B2 JP6668280A JP6668280A JPS639028B2 JP S639028 B2 JPS639028 B2 JP S639028B2 JP 6668280 A JP6668280 A JP 6668280A JP 6668280 A JP6668280 A JP 6668280A JP S639028 B2 JPS639028 B2 JP S639028B2
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- plating
- strike
- plated
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 146
- 238000007747 plating Methods 0.000 claims description 75
- 229910052763 palladium Inorganic materials 0.000 claims description 73
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- -1 nitrite compound Chemical class 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 150000002941 palladium compounds Chemical class 0.000 claims description 7
- 239000003792 electrolyte Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 235000010288 sodium nitrite Nutrition 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002826 nitrites Chemical class 0.000 description 2
- 150000002940 palladium Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 235000010289 potassium nitrite Nutrition 0.000 description 1
- 239000004304 potassium nitrite Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6668280A JPS56163295A (en) | 1980-05-20 | 1980-05-20 | Palladium plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6668280A JPS56163295A (en) | 1980-05-20 | 1980-05-20 | Palladium plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56163295A JPS56163295A (en) | 1981-12-15 |
JPS639028B2 true JPS639028B2 (zh) | 1988-02-25 |
Family
ID=13322937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6668280A Granted JPS56163295A (en) | 1980-05-20 | 1980-05-20 | Palladium plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56163295A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6503159B2 (ja) * | 2014-04-22 | 2019-04-17 | Jx金属株式会社 | 電子部品用金属材料、それを用いたコネクタ端子、コネクタ及び電子部品 |
-
1980
- 1980-05-20 JP JP6668280A patent/JPS56163295A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56163295A (en) | 1981-12-15 |
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