JPS6389264U - - Google Patents

Info

Publication number
JPS6389264U
JPS6389264U JP18517586U JP18517586U JPS6389264U JP S6389264 U JPS6389264 U JP S6389264U JP 18517586 U JP18517586 U JP 18517586U JP 18517586 U JP18517586 U JP 18517586U JP S6389264 U JPS6389264 U JP S6389264U
Authority
JP
Japan
Prior art keywords
pad
board
bond pad
ceramic sub
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18517586U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18517586U priority Critical patent/JPS6389264U/ja
Publication of JPS6389264U publication Critical patent/JPS6389264U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP18517586U 1986-12-01 1986-12-01 Pending JPS6389264U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18517586U JPS6389264U (cs) 1986-12-01 1986-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18517586U JPS6389264U (cs) 1986-12-01 1986-12-01

Publications (1)

Publication Number Publication Date
JPS6389264U true JPS6389264U (cs) 1988-06-10

Family

ID=31133553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18517586U Pending JPS6389264U (cs) 1986-12-01 1986-12-01

Country Status (1)

Country Link
JP (1) JPS6389264U (cs)

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