JPS6389240U - - Google Patents

Info

Publication number
JPS6389240U
JPS6389240U JP18567686U JP18567686U JPS6389240U JP S6389240 U JPS6389240 U JP S6389240U JP 18567686 U JP18567686 U JP 18567686U JP 18567686 U JP18567686 U JP 18567686U JP S6389240 U JPS6389240 U JP S6389240U
Authority
JP
Japan
Prior art keywords
fixed
mold plate
mold
plate
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18567686U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0642336Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986185676U priority Critical patent/JPH0642336Y2/ja
Publication of JPS6389240U publication Critical patent/JPS6389240U/ja
Application granted granted Critical
Publication of JPH0642336Y2 publication Critical patent/JPH0642336Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1986185676U 1986-12-01 1986-12-01 半導体素子の樹脂封止装置 Expired - Lifetime JPH0642336Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986185676U JPH0642336Y2 (ja) 1986-12-01 1986-12-01 半導体素子の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986185676U JPH0642336Y2 (ja) 1986-12-01 1986-12-01 半導体素子の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6389240U true JPS6389240U (ref) 1988-06-10
JPH0642336Y2 JPH0642336Y2 (ja) 1994-11-02

Family

ID=31134527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986185676U Expired - Lifetime JPH0642336Y2 (ja) 1986-12-01 1986-12-01 半導体素子の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0642336Y2 (ref)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576232U (ref) * 1980-06-11 1982-01-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576232U (ref) * 1980-06-11 1982-01-13

Also Published As

Publication number Publication date
JPH0642336Y2 (ja) 1994-11-02

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