JPS638603B2 - - Google Patents

Info

Publication number
JPS638603B2
JPS638603B2 JP57088701A JP8870182A JPS638603B2 JP S638603 B2 JPS638603 B2 JP S638603B2 JP 57088701 A JP57088701 A JP 57088701A JP 8870182 A JP8870182 A JP 8870182A JP S638603 B2 JPS638603 B2 JP S638603B2
Authority
JP
Japan
Prior art keywords
synthetic resin
coil
electrode
resin layer
bobbin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57088701A
Other languages
Japanese (ja)
Other versions
JPS58206113A (en
Inventor
Mototsugu Shiga
Masashi Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EASTERN STEEL
Original Assignee
EASTERN STEEL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EASTERN STEEL filed Critical EASTERN STEEL
Priority to JP8870182A priority Critical patent/JPS58206113A/en
Publication of JPS58206113A publication Critical patent/JPS58206113A/en
Publication of JPS638603B2 publication Critical patent/JPS638603B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【発明の詳細な説明】 本発明は、チツプ型インダクタ等に好適なコイ
ル端末の固定方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of fixing a coil terminal suitable for a chip type inductor or the like.

近時、各種の電子部品と同様に固定インダクタ
も小型化されており、本体の表面に設けた板状電
極をプリント基板の導電パターンに面接触させて
半田付けする、いわゆるチツプ型インダクタが用
いられつつある。チツプ化される以前のインダク
タは、コイルの端末を、ベース等に植設した端子
ピンに巻きつけることによつて一旦仮止めした
後、この巻きつけ部分を溶融半田に浸漬するなど
して、コイル端末を端子ピンに接続固定してい
た。ところが、チツプ型インダクタの場合は、外
部との接続用電極が本体表面に印刷焼付け等によ
つて形成される平面状のものであるため、コイル
端末を巻きつけることが不可能で、仮止めするこ
とができない。しかし、巻線を終えたコイルの両
端末を、仮止めすることなく一挙に電極に半田付
けするのは、きわめて作業性が悪く手数のかかる
ものであり、巻線工程を自動化する場合にも大き
な障害となつていた。もつとも、チツプ型インダ
クタの電極の一部を本体から突出させ、この突出
部にコイル端末を巻きつけるようにすれば、従来
同様にコイルの端末を仮止めすることは可能であ
る。しかしながら、チツプ型のインダクタは一辺
が3〜4mm程度のきわめて小さなものであるの
で、そのように構成した場合には、電極の突出部
にコイル端末を巻きつける作業が困難になるばか
りでなく、電極の突出部のためにインダクタ全体
が大型化してしまうという問題が生じてくる。
In recent years, fixed inductors, like various electronic components, have become smaller, and so-called chip-type inductors are now being used, in which plate-shaped electrodes provided on the surface of the main body are brought into surface contact with the conductive pattern on a printed circuit board and soldered. It's coming. Before inductors were made into chips, the end of the coil was temporarily fixed by winding it around a terminal pin implanted in a base, etc., and then the coil was assembled by dipping this wound part in molten solder. The terminal was connected and fixed to the terminal pin. However, in the case of chip-type inductors, the electrodes for connection with the outside are flat and formed by printing and baking on the surface of the main body, so it is impossible to wrap the coil terminals and it is necessary to temporarily fix them. I can't. However, soldering both ends of a coil after winding to the electrodes at once without temporarily fixing them is extremely inefficient and time-consuming, and it is also difficult to automate the winding process. It was becoming an obstacle. However, if a part of the electrode of the chip-type inductor is made to protrude from the main body and the coil end is wound around this protrusion, it is possible to temporarily secure the end of the coil as in the conventional case. However, since a chip-type inductor is extremely small with a side of about 3 to 4 mm, if it is configured in this way, it will not only be difficult to wind the coil end around the protruding part of the electrode, but also the electrode A problem arises in that the entire inductor becomes larger due to the protrusion.

本発明は、上記の問題点に鑑みてなされたもの
であり、コイル端末を電極に巻きつけることなく
仮止めすることができるコイル端末の固定方法を
提供することを目的とする。
The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a method for fixing a coil terminal, which can temporarily fix the coil terminal without winding the coil terminal around an electrode.

この目的を達成するための本発明の特徴は、高
温で熱分解を起こして気化する合成樹脂を有機溶
剤に溶かして生成した合成樹脂溶液を電極の表面
に塗布することによつて、電極の表面を被う合成
樹脂層を形成し、この合成樹脂層自体の接着機能
を利用してコイルの端末を仮止めすることにあ
る。
A feature of the present invention for achieving this purpose is that a synthetic resin solution that is produced by dissolving a synthetic resin that thermally decomposes and vaporizes at high temperatures in an organic solvent is applied to the surface of the electrode. The purpose of this method is to form a synthetic resin layer covering the coil, and use the adhesive function of this synthetic resin layer itself to temporarily fix the ends of the coil.

以下、本発明について図示の実施例により説明
する。第1図イ〜ニは各工程を順を追つて示すも
ので、イにはチツプ型インダクタのボビンの一例
が示してある。ボビン10は、磁性体から成り、
巻き軸12の上下に一体形成された四角形のフラ
ンジ14を有している。一方のフランジ14の上
面には、銀などから成る電極20が印刷焼付けや
蒸着等の手段によつて設けてある。
Hereinafter, the present invention will be explained with reference to illustrated embodiments. Figures 1A to 1D show each step in order, and Figure 1A shows an example of a bobbin for a chip-type inductor. The bobbin 10 is made of a magnetic material,
It has rectangular flanges 14 integrally formed above and below the winding shaft 12. An electrode 20 made of silver or the like is provided on the upper surface of one flange 14 by printing, baking, vapor deposition, or other means.

本発明によるコイル端末の固定方法において
は、まず、このようなボビン10に設けられた電
極20の表面に、合成樹脂溶液を塗布して乾燥す
ることにより、ロに図示したように合成樹脂層3
0を形成する。この合成樹脂溶液としては、好ま
しくは100℃〜150℃程度に加熱することによつて
接着機能を生じ、かつさらに高温(300℃程度)
に熱することにより熱分解を起こして気化する合
成樹脂、例えばポリアミド樹脂を有機溶剤に溶か
したものを用いる。ポリアミド樹脂の場合の有機
溶剤としては、エチレングリコールやベンジルア
ルコール等が適している。合成樹脂層30は、電
極20の表面のみに被着すればよいのであるが、
ボビン10自体の寸法が小さいので、ロに示すよ
うにボビン10上部の全面に合成樹脂溶液を塗布
した方が作業性の上から有利である。次に、この
乾燥した合成樹脂層30を有するボビン10の巻
き軸12にコイル40を巻回し、その端末42を
ボビン10の上方まで引き出す。そして、合成樹
脂層30を被着した電極20の上面にコイルの端
末42を押しつけた状態で、熱した鏝を当てる
か、あるいは電流溶接などの手段により、合成樹
脂層30のコイル端末42に接した部分を100℃
〜150℃程度に加熱して溶かし、この溶けた合成
樹脂層30の表面でコイルの巻き始め及び巻き終
わりの端末42を電極20上に接着して、コイル
端末42の余つた部分を切除する。そうするとハ
のようになり、コイル40の端末42が電極20
の上に仮止めされた状態となる。このときの断面
を拡大して示すと第2図のようになる。すなわ
ち、コイル線材42aはポリウレタン等の合成樹
脂被膜42bで被覆されているが、この被膜42
bと合成樹脂層30とが接着された状態になつて
いる。次いで、このボビン10をさかさまにして
電極20部分を溶融半田に浸漬すれば、合成樹脂
層30は300℃前後の高温に熱せられることによ
り熱分解を起こして気化してしまい、第1図ニの
ようにコイル40の端末42が電極20に半田5
0によつて接続固定されたチツプ型インダクタが
完成する。この高温処理の際、被膜42bも溶け
て除去されてしまうので、第3図に拡大して示す
ようにコイル線材42aが半田50によつて電極
20上に固定されることになる。
In the method for fixing a coil terminal according to the present invention, first, a synthetic resin solution is applied to the surface of the electrode 20 provided on the bobbin 10 and dried, thereby forming a synthetic resin layer 3 as shown in FIG.
form 0. This synthetic resin solution preferably has an adhesive function when heated to about 100°C to 150°C, and is heated to an even higher temperature (about 300°C).
A synthetic resin that undergoes thermal decomposition and vaporizes when heated to, for example, a polyamide resin dissolved in an organic solvent is used. Ethylene glycol, benzyl alcohol, and the like are suitable as organic solvents for polyamide resins. The synthetic resin layer 30 only needs to be applied to the surface of the electrode 20, but
Since the size of the bobbin 10 itself is small, it is advantageous from the viewpoint of workability to apply the synthetic resin solution to the entire upper part of the bobbin 10 as shown in FIG. Next, the coil 40 is wound around the winding shaft 12 of the bobbin 10 having the dried synthetic resin layer 30, and the end 42 of the coil 40 is pulled out above the bobbin 10. Then, with the end 42 of the coil pressed against the upper surface of the electrode 20 covered with the synthetic resin layer 30, the end 42 of the coil is connected to the end 42 of the synthetic resin layer 30 by applying a heated iron or by current welding. 100℃
The synthetic resin layer 30 is heated to about 150 DEG C. to melt it, and the ends 42 of the coil at the beginning and end of the winding are adhered onto the electrode 20 on the surface of the melted synthetic resin layer 30, and the excess portions of the ends 42 of the coil are cut off. Then, it becomes as shown in C, and the terminal 42 of the coil 40 is connected to the electrode 20.
It will be in a state where it is temporarily fixed on top. An enlarged cross-section at this time is shown in FIG. 2. That is, the coil wire 42a is coated with a synthetic resin coating 42b such as polyurethane;
b and the synthetic resin layer 30 are in a bonded state. Next, when this bobbin 10 is turned upside down and the electrode 20 portion is immersed in molten solder, the synthetic resin layer 30 is heated to a high temperature of around 300°C, causing thermal decomposition and vaporization, as shown in FIG. The terminal 42 of the coil 40 is soldered 5 to the electrode 20 as shown in FIG.
A chip type inductor connected and fixed by 0 is completed. During this high-temperature treatment, the coating 42b is also melted and removed, so that the coil wire 42a is fixed onto the electrode 20 by the solder 50, as shown in an enlarged view in FIG.

なお、上記の実施例では、合成樹脂層を加熱す
ることによりその表面を溶かしてコイルの端末を
接着するようにしたが、合成樹脂層の上に有機溶
剤を重ねて塗布することによつても合成樹脂層の
表面が軟化して接着機能が生じ、その後急速に乾
燥し硬化するので、同様にコイル端末の仮止めを
行なうことができる。また、合成樹脂溶液の材料
は、ポリアミド樹脂に限られるものではなく、ポ
リウレタン樹脂やポリカーボネート樹脂等でもよ
い。以上はチツプ型のインダクタを例にとつて説
明したが、本発明はコイルを有する他の電子部品
にも適用できることはいうまでもない。
In the above example, the synthetic resin layer was heated to melt its surface and bond the end of the coil. However, it is also possible to apply an organic solvent on top of the synthetic resin layer. The surface of the synthetic resin layer softens to provide an adhesive function, and then quickly dries and hardens, so that coil terminals can be temporarily fixed in the same way. Furthermore, the material of the synthetic resin solution is not limited to polyamide resin, but may also be polyurethane resin, polycarbonate resin, or the like. Although the above description has been made using a chip type inductor as an example, it goes without saying that the present invention can be applied to other electronic components having coils.

上述のように本発明によれば、電極上に被着し
た合成樹脂層にコイル端末を押しつけ、熱した鏝
を当てるなどの簡単な操作でコイル端末を迅速に
仮止めすることができ、その後は例えば溶融半田
に浸漬するだけで電極に接続固定できる。したが
つて、チツプ型インダクタ等の製造工程を容易に
自動化することが可能であり、量産性を著しく向
上し得るものである。また、電極を合成樹脂層で
被覆した後のボビンは、そのまま長期間保存して
も電極表面の酸化や硫化が防止されるので、製造
上きわめて好都合である。
As described above, according to the present invention, the coil terminal can be quickly temporarily fixed by a simple operation such as pressing the coil terminal against the synthetic resin layer coated on the electrode and applying a heated iron. For example, it can be connected and fixed to an electrode simply by immersing it in molten solder. Therefore, it is possible to easily automate the manufacturing process of chip-type inductors, etc., and mass productivity can be significantly improved. Further, the bobbin after the electrode is coated with a synthetic resin layer is extremely convenient for manufacturing, since oxidation and sulfidation of the electrode surface are prevented even if the bobbin is stored for a long period of time.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図イ〜ニは本発明を適用したチツプ型イン
ダクタの製造工程を示す図、第2図は第1図ハに
おけるインダクタの拡大正面断面図、第3図は第
1図ニのインダクタの拡大正面断面図である。 10…ボビン、20…電極、30…合成樹脂
層、40…コイル、42…コイル端末、50…半
田。
Figures 1A to 2D are diagrams showing the manufacturing process of a chip-type inductor to which the present invention is applied, Figure 2 is an enlarged front sectional view of the inductor in Figure 1C, and Figure 3 is an enlarged view of the inductor in Figure 1D. FIG. DESCRIPTION OF SYMBOLS 10... Bobbin, 20... Electrode, 30... Synthetic resin layer, 40... Coil, 42... Coil terminal, 50... Solder.

Claims (1)

【特許請求の範囲】[Claims] 1 高温で熱分解を起こして気化する合成樹脂を
有機溶剤に溶かして生成した合成樹脂溶液を、ボ
ビン上に設けられた電極に塗布し乾燥して、電極
の表面を被う合成樹脂層を形成し、次いで、ボビ
ンにコイルを巻回し、該合成樹脂層の表面を溶か
して、コイルの巻き始め及び巻き終わりの端末
を、溶かした合成樹脂層で電極上に接着して仮り
止めした後、合成樹脂層を加熱して除去すると同
時にコイルの端末を電極に半田付けすることを特
徴とするコイル端末の固定方法。
1 A synthetic resin solution that is created by dissolving a synthetic resin that thermally decomposes and vaporizes at high temperatures in an organic solvent is applied to an electrode installed on a bobbin and dried to form a synthetic resin layer that covers the surface of the electrode. Next, the coil is wound around a bobbin, the surface of the synthetic resin layer is melted, and the ends of the winding start and end of the coil are temporarily fixed by adhering the melted synthetic resin layer onto the electrode. A method for fixing a coil terminal, characterized by heating and removing the resin layer and simultaneously soldering the coil terminal to an electrode.
JP8870182A 1982-05-25 1982-05-25 Fixing method of coil end Granted JPS58206113A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8870182A JPS58206113A (en) 1982-05-25 1982-05-25 Fixing method of coil end

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8870182A JPS58206113A (en) 1982-05-25 1982-05-25 Fixing method of coil end

Publications (2)

Publication Number Publication Date
JPS58206113A JPS58206113A (en) 1983-12-01
JPS638603B2 true JPS638603B2 (en) 1988-02-23

Family

ID=13950172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8870182A Granted JPS58206113A (en) 1982-05-25 1982-05-25 Fixing method of coil end

Country Status (1)

Country Link
JP (1) JPS58206113A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62192611U (en) * 1986-05-27 1987-12-08

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151822A (en) * 1978-05-22 1979-11-29 Matsushita Electric Ind Co Ltd Production of voice coil
JPS55124296A (en) * 1979-03-19 1980-09-25 Matsushita Electric Ind Co Ltd Soldering method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52167515U (en) * 1976-06-14 1977-12-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54151822A (en) * 1978-05-22 1979-11-29 Matsushita Electric Ind Co Ltd Production of voice coil
JPS55124296A (en) * 1979-03-19 1980-09-25 Matsushita Electric Ind Co Ltd Soldering method

Also Published As

Publication number Publication date
JPS58206113A (en) 1983-12-01

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