JP2821310B2 - Conductive connection method for thin coils - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for electrically connecting thin coils. More specifically, the present invention relates to a method for connecting a thin coil to a terminal plate.

[0002]

2. Description of the Related Art As shown in FIG. 2, a large number of thin coils 1 and 2 are provided in a stator coil of a small 8 mm VTR motor.
, 1 are arranged densely in an annular shape. As this thin coil 1, in order to increase the space factor,
A thin coil obtained by slicing a substantially triangular conductive foil film roll is employed. The thin coils are held on a substrate 11 having a coil connection frame circuit 13 and are connected to each other using the corresponding connection terminals 14 of the coil connection frame 13.

As shown in FIG. 5, for example, a coil used in a conventional small 8 mm VTR motor has a very small outer shape with a size of about 10 mm on each side and a space inside the innermost layer of about 5 mm on a side. It is a triangle. This thin coil 1 has electrodes 103 and 104 protruding in the stacking direction at the corners of the outermost layer (triangular ridges) and near the corners of the innermost layer. Is attached. Therefore, conventionally, a worker manually performs soldering using a soldering iron or the like.

[0004]

However, there is a problem that the manual soldering has certainty but lacks mass productivity. In particular, in the case of a triangular thin coil as shown in FIG. 5, it is not easy to perform manual soldering on a narrow place between the outer wall and the inner wall of the coil, it takes time, and connection failure is liable to occur.

Furthermore, according to the conventional conductive connection method for thin coils, the electrodes 103 and 104 are required, which is not suitable for mass production.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of connecting a thin coil having good mass productivity.

[0007]

To achieve Means for Solving the Problems] Such purposes, conductive connection method of a thin coil of the present invention, thin coil
On each side wall surface of the inner and outer peripheral surfaces of the thin coil.
Dispenser nozzles are placed on the board so that they can be inserted.
Placed on the inner and outer side walls of the coil.
Disconnect the position lower than the upper axial end of the terminal moiety
Apply cream solder directly using the nozzle of the penser ,
Heating melts the cream solder and causes the side wall surface to flow down, thereby electrically connecting the terminal portion of the coil and the terminal of the substrate.

[0008]

Therefore, the cream solder directly applied to the outer peripheral surface and the inner peripheral surface of the terminal portion of the thin coil disposed on the frame circuit of the substrate is melted when heated through a reflow furnace or the like. It flows down the coil wall surface, flows down onto the terminals of the frame circuit, and connects the terminal portion of the coil to the terminal of the frame circuit.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the present invention will be described below in detail with reference to the embodiments shown in the drawings.

FIG. 1 shows an embodiment of a thin coil. For example, as shown in FIG. 3, the thin coil 1 is formed by applying an adhesive (not shown) to a foil film of a conductive material having a thickness of about 5 μm to 30 μm, for example, a copper foil 2 having one surface coated with an insulating material (not shown). It is wound in a substantially triangular shape and hardened. The surface connecting the corners of the innermost layer of the coil 1 is composed of a substantially flat surface, and the surface corresponding to the base of the triangle is composed of a curved surface having a large radius of curvature corresponding to the outer diameter of the motor. Have been. The thin coil 1 has a terminal formed by removing the insulating material layer at the corners indicated by hatching of the outermost copper foil and the surface indicated by hatching of the innermost copper foil. Partial / exposed electrodes 3 and 4 are formed.

As shown in FIG. 4, for example, the thin coil 1 has a substantially triangular shape obtained by winding a copper foil 2 coated with an insulating material 6 and an adhesive 7 on at least one side thereof around a core jig 5. It is obtained by cutting a rod-shaped copper foil roll. The core jig 5 is formed in a split mold, and is disassembled and taken out after the rod-shaped wound body of the copper foil 2 is hardened by the curing of the adhesive 7. Then, after slicing to a predetermined thickness using a wire saw or the like, burrs on the cut surface are removed by etching or the like, and a thin coil 1 as shown in FIG. 3 is obtained.

The thin coil 1 configured as described above is:
For example, as shown in FIG. 2, an integrated coil arranged in a predetermined positional relationship with respect to the rotor side is formed by being inserted into a concave portion 12 of a substrate 11 formed of a synthetic resin or the like. In the recess 12 of the substrate 11, each thin coil 1, 1,
For example, a coil connection frame circuit 13 for performing wiring of... 1 is provided in advance. On the frame circuit 13, the exposed electrode 3 portion of the outermost layer and the exposed electrode 4 portion of the innermost layer of each thin coil 1 are provided. The thin coils 1 are placed so as to be positioned. Therefore, the cream solder 10 is directly applied by a dispenser 8 using a nozzle 9 to the exposed electrodes 3 and 4 on the inner and outer peripheral surfaces of the coil 1 and to a position below the upper end in the axial direction, that is, the side wall surface. After that, it flows into a reflow furnace to connect wires.

Here, a dispenser 8 for directly applying the cream solder 10 to the side wall surface of the coil 1 includes a nozzle 9 opened toward the side wall surface of the thin coil 1 as shown in FIG. , 1, ..., 1 exposed electrodes 3,
Four pieces are arranged in a corresponding positional relationship. The nozzle 9 extends along the side wall of the coil 1 and its tip is opened toward the side wall. Therefore, the cream solder 10 extruded from the dispenser 8 is directly applied to the exposed electrodes 3 and 4 on the coil side wall. For example, the tip of the nozzle is cut obliquely or bent toward the coil side wall, so that the cream solder 10 is sprayed directly on the coil side wall. Thus, the dispenser 8 used in the present invention is different from a general dispenser that blows out air or the like.

Therefore, the dispenser 8 is connected to the substrate 11
After the nozzles 9 are inserted into the thin coils 1 or between the thin coils 1 and the thin coils 1, 1,...
When the cream solder 10 in the dispenser 8 is pushed out using a squeeze 5 or the like, the cream solder 10 is directly sprayed on the exposed electrodes 3 and 4 on the side wall surface of the coil 1 as shown in FIG. Cream solder is not applied to the upper end face or other non-terminal portions. In addition, even when the dispenser 8 is pulled away from the coil 1, the cream solder 10 applied to the exposed electrodes 3 and 4 on the side wall of the coil 1 adheres to the nozzle 9 as shown in FIG. Without leaving coil 1
Separate from the dispenser 8 while remaining attached to the coil 1 side. And if this is passed through a reflow furnace and heated,
Almost all of the cream solder 10 melts and flows along the exposed electrodes 3 and 4 forming the wall surface of the coil 1, and the coil 1
And the connection terminals 14 of the frame circuit 13 are connected. Therefore, the solder does not remain spherical on the coil 1.

The above embodiment is a preferred embodiment of the present invention, but the present invention is not limited to this embodiment, and includes a general dispenser and a method of applying by hand without departing from the gist of the present invention. Various modifications can be made. For example, in the present embodiment, as the terminal portion of the thin coil 1, an exposed electrode whose only insulating material layer has been removed has been mainly described. However, the present invention is not limited to this, and a rod-shaped electrode is fixed to the coil foil film. However, it is also possible to carry out the projection in the radial direction.

[0016]

As is apparent from the above description, the method for electrically connecting a thin coil according to the present invention uses the thin coil as a thin coil.
Dispensers are placed on the sides of the inner and outer peripheral side walls of the
The terminal part is formed on the inner peripheral surface and the outer peripheral surface of the coil.
Dispensers position lower than the upper axial end of the
The cream solder was directly applied using a nozzle and heated to melt the cream solder and flow down the side wall surface so that the terminal portion of the coil and the terminal of the board were conductively connected.For example, with a dispenser with a nozzle, etc. If the cream solder is applied directly to the side wall surface of the terminal portion of the coil and then heated by passing it through a reflow furnace or the like, the cream solder melts and flows down the coil wall surface to securely connect the coil and the frame circuit. Therefore, the mounting of the coil on the frame circuit can be automated, and the mass productivity is improved.

Further, according to the present invention, since the nozzle of the dispenser is opened toward the side wall surface of the coil so that the cream solder is directly applied to the side wall surface of the coil, the cream solder is applied to the side of the coil in a minimum area. It can be applied to the wall surface, the paste dispenser is separated well, and even after the temperature rises, due to its own weight drop and surface tension of the molten solder, it does not remain on the coil end surface, making it possible to connect with the bottom frame. .

[Brief description of the drawings]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing an outline of a conductive connection method for a thin coil according to the present invention. FIG. 1 (A) shows a state in which cream solder is applied to a coil side wall surface, and FIG. .

FIGS. 2A and 2B are views showing a stator coil of a small 8 mm VTR motor, wherein FIG. 2A is a plan view and FIG.

FIG. 3 is a plan view showing one embodiment of a thin coil.

FIG. 4 is a perspective view showing an example of a process for manufacturing a thin coil.

FIG. 5 is a perspective view showing an example of a conventional thin coil.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 thin coil 3 exposed electrode 4 exposed electrode 8 dispenser 9 nozzle 10 cream solder 13 coil connection frame circuit 14 coil connection frame circuit terminal

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-82045 (JP, A) JP-A-2-122552 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H02K 3/00-3/52 H02K 15/02-15/04 H01R 4/02

Claims (1)

(57) [Claims] 1. A thin coil wound one of the conductive foil from the inside to the outside a conductive connection method of a thin coil to be conductively connected to the terminals of the board for holding the coil, the thin carp
On the inner and outer peripheral side walls of the thin coil.
Make the above base so that the dispenser nozzle can be inserted.
Placed on a plate, each side wall surface of the inner and outer peripheral surfaces of the coil
Lower than the upper end in the axial direction of the terminal part formed in
Applying cream solder directly to the dispenser using the nozzle of the dispenser, and melting the cream solder by heating and flowing down the side wall surface to electrically connect the terminal portion of the coil and the terminal of the substrate. Characteristic conductive connection method for thin coils.