JPS6384950U - - Google Patents
Info
- Publication number
- JPS6384950U JPS6384950U JP17991486U JP17991486U JPS6384950U JP S6384950 U JPS6384950 U JP S6384950U JP 17991486 U JP17991486 U JP 17991486U JP 17991486 U JP17991486 U JP 17991486U JP S6384950 U JPS6384950 U JP S6384950U
- Authority
- JP
- Japan
- Prior art keywords
- protrusions
- suction hole
- familiar
- collection
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991486U JPS6384950U (US20050075337A1-20050407-C00081.png) | 1986-11-21 | 1986-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17991486U JPS6384950U (US20050075337A1-20050407-C00081.png) | 1986-11-21 | 1986-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6384950U true JPS6384950U (US20050075337A1-20050407-C00081.png) | 1988-06-03 |
Family
ID=31123397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17991486U Pending JPS6384950U (US20050075337A1-20050407-C00081.png) | 1986-11-21 | 1986-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6384950U (US20050075337A1-20050407-C00081.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275664A (ja) * | 1993-03-22 | 1994-09-30 | Rohm Co Ltd | 半導体チップピックアップ装置 |
| JP2004087677A (ja) * | 2002-08-26 | 2004-03-18 | Nitto Denko Corp | コレットおよびそれを用いてチップ部品をピックアップする方法 |
| WO2005112537A1 (ja) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | 部品供給ヘッド装置及び部品実装ヘッド装置 |
| JP2012028594A (ja) * | 2010-07-26 | 2012-02-09 | Shinko Electric Ind Co Ltd | 電子部品実装装置及び電子部品の実装方法 |
| JP2020053457A (ja) * | 2018-09-25 | 2020-04-02 | 株式会社東芝 | ピックアップツール、および半導体モジュールの製造方法 |
-
1986
- 1986-11-21 JP JP17991486U patent/JPS6384950U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275664A (ja) * | 1993-03-22 | 1994-09-30 | Rohm Co Ltd | 半導体チップピックアップ装置 |
| JP2004087677A (ja) * | 2002-08-26 | 2004-03-18 | Nitto Denko Corp | コレットおよびそれを用いてチップ部品をピックアップする方法 |
| WO2005112537A1 (ja) * | 2004-05-17 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | 部品供給ヘッド装置及び部品実装ヘッド装置 |
| JP2012028594A (ja) * | 2010-07-26 | 2012-02-09 | Shinko Electric Ind Co Ltd | 電子部品実装装置及び電子部品の実装方法 |
| JP2020053457A (ja) * | 2018-09-25 | 2020-04-02 | 株式会社東芝 | ピックアップツール、および半導体モジュールの製造方法 |
