JPS6384941U - - Google Patents
Info
- Publication number
- JPS6384941U JPS6384941U JP1986178957U JP17895786U JPS6384941U JP S6384941 U JPS6384941 U JP S6384941U JP 1986178957 U JP1986178957 U JP 1986178957U JP 17895786 U JP17895786 U JP 17895786U JP S6384941 U JPS6384941 U JP S6384941U
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- conductive adhesive
- substrate
- groove
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986178957U JPH0440277Y2 (en:Method) | 1986-11-20 | 1986-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986178957U JPH0440277Y2 (en:Method) | 1986-11-20 | 1986-11-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6384941U true JPS6384941U (en:Method) | 1988-06-03 |
| JPH0440277Y2 JPH0440277Y2 (en:Method) | 1992-09-21 |
Family
ID=31121578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986178957U Expired JPH0440277Y2 (en:Method) | 1986-11-20 | 1986-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0440277Y2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103439A (ja) * | 2005-09-30 | 2007-04-19 | Optrex Corp | 半導体集積回路 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1298612C (zh) * | 1999-03-31 | 2007-02-07 | 精工爱普生株式会社 | 狭窄间距用连接器、静电传动机构、压电传动机构、喷墨头、喷墨打印机、微型机、液晶盘、电子机器 |
-
1986
- 1986-11-20 JP JP1986178957U patent/JPH0440277Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103439A (ja) * | 2005-09-30 | 2007-04-19 | Optrex Corp | 半導体集積回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440277Y2 (en:Method) | 1992-09-21 |