JPS6381155A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS6381155A JPS6381155A JP22371486A JP22371486A JPS6381155A JP S6381155 A JPS6381155 A JP S6381155A JP 22371486 A JP22371486 A JP 22371486A JP 22371486 A JP22371486 A JP 22371486A JP S6381155 A JPS6381155 A JP S6381155A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- speed
- inorganic filler
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 title claims description 17
- 229920000647 polyepoxide Polymers 0.000 title claims description 17
- 239000011256 inorganic filler Substances 0.000 claims abstract description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 17
- 238000009775 high-speed stirring Methods 0.000 claims abstract description 9
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 8
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000945 filler Substances 0.000 abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 2
- 238000011109 contamination Methods 0.000 abstract description 2
- 239000000454 talc Substances 0.000 abstract description 2
- 229910052623 talc Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 238000004062 sedimentation Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- -1 antimony trioxide Chemical compound 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003349 gelling agent Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 230000007803 itching Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は、無機質充填剤の分散性、沈降防止性に優れた
エポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Objective of the Invention (Field of Industrial Application) The present invention relates to an epoxy resin composition that has excellent dispersibility and anti-settling properties for inorganic fillers.
（従来の技術）
液状エポキシ樹脂は、フライバックトランス、イグニッ
ションコイル、リレー、ハイブリッドＩＣ１ＩＣ−ＬＳ
Ｉ等の電気・電子部品の封入、封止、ディッピング等と
して広く使用されている。(Prior art) Liquid epoxy resin is used for flyback transformers, ignition coils, relays, hybrid IC1IC-LS
It is widely used for encapsulation, sealing, dipping, etc. of electrical and electronic components such as I.
そして、これらいずれの場合にも、熱Ｖ６ ｎＮ率の低
下、熱伝導性の向上、耐燃性の付与等の目的で無機質充
填剤が混合使用されている。In any of these cases, an inorganic filler is mixed and used for the purpose of lowering the thermal V6 nN ratio, improving thermal conductivity, imparting flame resistance, etc.
しかしながら、これらの無機質充１１１！剤を混合させ
ると樹脂の粘喰が著しく上昇し、作業性が悪くなるとい
う欠点がある。 この粘（９）上昇を小さくするため一
般的には粒度の荒い充遁剤を用いるが、この場合、樹脂
組成物の保管中に充１１１！剤がよく分散されずに沈降
し、組成物が不均一になるという問題点がめった。 充
遁剤の沈降を防止するため、粒子の細かいチクソ性の出
る充填剤を併用したり、ゲル化剤等の添加剤を用いる方
法が行われている。However, these inorganic substances are 111! There is a drawback that when the agents are mixed, the viscosity of the resin increases significantly, resulting in poor workability. In order to reduce this increase in viscosity (9), a filler with coarse particle size is generally used; The problem often occurred that the agent was not well dispersed and settled, resulting in a non-uniform composition. In order to prevent the sedimentation of the filler, methods are used in which a filler with fine particles exhibiting thixotropic properties is used in combination, or an additive such as a gelling agent is used.
しかしこれらは作業性のすぐれた低粘度の樹脂組成物に
は効果が少なく、また用いられる充ｌＩ口稈１が限られ
たり、添加剤の混入によって不純物が混入されるという
問題点があった。However, these methods are less effective for low-viscosity resin compositions with excellent workability, and there are also problems in that the type of filler culm 1 that can be used is limited and that impurities are mixed in due to the mixing of additives.
（発明が解決しようとする問題点）
本発明は、上記の問題点を解決するためになされたもの
で、無機質充填剤の分散性、沈降防止性にゆれ、不純物
等の混入がなく、作業性のよい工ボキシ樹脂組成物を提
供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made to solve the above-mentioned problems, and has the advantage that there is no fluctuation in the dispersibility and anti-sedimentation properties of the inorganic filler, there is no contamination of impurities, and the workability is improved. The purpose of this invention is to provide a highly engineered boxy resin composition.
［発明の構成］
ｃ問題点を解決するための手段）
本発明者らは、上記の目的を達成しようと鋭意研究を重
ねた結梁、液状エポキシ樹脂および無機質充填剤牧存下
で高速度＠痒させることにより、かなり荒い無機質充填
剤でも著しく沈降しにくくなることを見いだし、本発明
を完成させたものである。 即ち、本発明は、液状エポ
キシ樹脂および無機質充填剤を高速度攪拌させてなるこ
とを特徴とするエポキシ樹脂組成物である。 そして高
速度攪拌とはディスパースの周速として５ｍ／秒以上で
、かつ１０分間以上攪拌するものである。[Structure of the Invention] c) Means for Solving the Problems) In order to achieve the above object, the present inventors have conducted extensive research to achieve high speed @ The present invention was completed based on the discovery that even a fairly rough inorganic filler becomes significantly difficult to settle by causing it to itch. That is, the present invention is an epoxy resin composition characterized in that it is made by stirring a liquid epoxy resin and an inorganic filler at high speed. High-speed stirring means stirring at a peripheral speed of the disperser of 5 m/sec or more and for 10 minutes or more.
本発明に用いる液状エポキシ樹脂としては、例えばビス
フェノールＡ若しくはビスフェノールＦ又はそれらのハ
ロゲン化合物とエピクロルヒドリンとの重縮合によって
得られるエポキシ樹脂、エポキシ化ノボラック樹脂、エ
ポキシ化クレゾール樹脂、エポキシ変性ポリブタジェン
ゴム、脂環式エポキシ樹脂等が挙げられ、これらは１種
又は２種以上の混合系として使用できる。 更に必要に
応じてブチルグリシジルエーテル、フェニルグリシジル
エーテル等の低粘度の反応性希釈剤等を併用することが
できる。Liquid epoxy resins used in the present invention include, for example, epoxy resins obtained by polycondensation of bisphenol A or bisphenol F or their halogen compounds with epichlorohydrin, epoxidized novolak resins, epoxidized cresol resins, epoxy-modified polybutadiene rubbers, Examples include alicyclic epoxy resins, and these can be used alone or as a mixture of two or more. Furthermore, if necessary, a low-viscosity reactive diluent such as butyl glycidyl ether or phenyl glycidyl ether can be used in combination.
本発明に用いる無機質充填剤としては、結晶性シリカ、
溶融シリカ、水酸化アルミニウム、タルク、炭酸カルシ
ウム等が挙げられ、これらはいずれも単独もしくは２種
以上混合して使用される。Inorganic fillers used in the present invention include crystalline silica,
Examples include fused silica, aluminum hydroxide, talc, calcium carbonate, etc., and any of these may be used alone or in a mixture of two or more.
無機質充填剤の配合割合は、エポキシ樹脂組成物に対し
て１０〜８０１量％配合することが望ましい。The blending ratio of the inorganic filler is preferably 10 to 801% by weight based on the epoxy resin composition.
配合割合が１０重量％未満では、無機質充填剤の添加効
果が小さく、また８０重１％を超えると粘度が高くなり
好ましくない。If the blending ratio is less than 10% by weight, the effect of adding the inorganic filler will be small, and if it exceeds 80% by weight, the viscosity will increase, which is not preferable.
本発明のエポキシ樹脂組成物は、液状エポキシ樹１指、
無機質充填剤を含むが必要に応じて硬化剤、硬化促進剤
、カップリング剤、染料、顔料等の着色剤、三酸化アン
チモン等の難燃剤などを適宜添加配合することができる
。The epoxy resin composition of the present invention comprises one liquid epoxy resin,
Although it contains an inorganic filler, a curing agent, a curing accelerator, a coupling agent, a coloring agent such as a dye or a pigment, a flame retardant such as antimony trioxide, etc. can be appropriately added and blended as necessary.
本発明のエポキシ樹脂組成物は、前述した液状エポキシ
樹脂と無機質充填剤を高速度攪拌することが最も重要な
ことである。 高速喰攪拌はディスパースで行うが、デ
ィスパースの周速として５１１／秒以上であることが望
ましい。 周速が５ｎ／秒未満では分散性が悪く好まし
くない。 また高速度攪拌を行う時間は、ディスパース
の能力と樹脂量によって異なるが１０分間以上であるこ
とが望ましい、、１０分間未満では分散性が悪く好まし
くないからである。The most important thing for the epoxy resin composition of the present invention is to stir the above-mentioned liquid epoxy resin and inorganic filler at high speed. High-speed stirring is performed by dispersing, and it is desirable that the circumferential speed of the dispersing is 511/sec or more. If the circumferential speed is less than 5 n/sec, the dispersibility will be poor and this is not preferable. The time for high-speed stirring varies depending on the dispersing ability and the amount of resin, but it is preferably 10 minutes or more, because if it is less than 10 minutes, the dispersibility will be poor.
本発明で行う高速度攪拌は無機質充填剤だけでなく、ニ
ッケル、銅、銀等の金属充填剤にも有効である。 また
用いる樹脂としてはエポキシ樹脂以外のポリイミド、ポ
リエステル、ウレタン、アクリル等の樹脂系にも応用す
ることが可能である。The high-speed stirring performed in the present invention is effective not only for inorganic fillers but also for metal fillers such as nickel, copper, and silver. Further, as the resin used, other than epoxy resin, resin systems such as polyimide, polyester, urethane, acrylic, etc. can also be applied.
（作用）
高速度攪拌によって、なぜ無機質充填剤の分散性がよく
沈降性が小さくなるかは明らかでないが、エポキシオリ
ゴマー共存下で無機質充填剤に高速度Ｗ！痒の機械的作
用を加えると無機質表面とエポキシオリゴマーとの間に
化学反応が起こり、無機質表面が改質され濡れ性等が大
幅に変化するためと推定される。(Function) It is not clear why high-speed stirring improves the dispersibility of the inorganic filler and reduces sedimentation, but it is not clear why high-speed stirring improves the dispersibility of the inorganic filler and reduces sedimentation. It is presumed that this is because when the mechanical effect of itching is applied, a chemical reaction occurs between the inorganic surface and the epoxy oligomer, modifying the inorganic surface and significantly changing its wettability.
（実施例）
次に本発明を実施例によって説明するが本発明はこれら
の実施例によって限定されるものではない。(Examples) Next, the present invention will be explained by examples, but the present invention is not limited by these examples.
実施例 １
エポン８２８（油化シェルエポキシ礼装ビスフェノール
Ａ型エポキシ樹脂、商品名） ６００ｇに、クリスタラ
イトＶＸ−８（間食社製結晶性シリカ、商品名） ４０
０Ｑを配合し、これをディスパース（羽根径５０ｍｍ）
５０００ｒ、ｐ、ｍで４０分間攪拌し均一なエポキシ
樹脂組成物を得た。 この組成物を１１！の広口ポリエ
チレンビンで２５℃、３０日間保管後、沈降性を試験し
たが全く充填剤が沈降せず、従って均一な組成物であり
、本発明の優れた効果が確認された。Example 1 To 600 g of Epon 828 (oiled shell epoxy formal wear bisphenol A type epoxy resin, trade name), 40 g of Crystallite VX-8 (crystalline silica manufactured by Snashoku Co., Ltd., trade name)
Blend 0Q and disperse it (blade diameter 50mm)
A uniform epoxy resin composition was obtained by stirring at 5000 r, p, m for 40 minutes. This composition is 11! After being stored in a wide-mouth polyethylene bottle at 25° C. for 30 days, the sedimentation property was tested, but the filler did not sediment at all, and the composition was therefore uniform, confirming the excellent effects of the present invention.
実施例 ２〜４
第１表に示した組成で実施例１と同様にしてエポキシ樹
脂組成物を得た。 この組成物について実施例１と同様
に沈降性の試験を行ったところ、全く沈降は見られず、
本発明の優れた効果が確認された。Examples 2 to 4 Epoxy resin compositions were obtained in the same manner as in Example 1 with the compositions shown in Table 1. When this composition was subjected to a sedimentation test in the same manner as in Example 1, no sedimentation was observed.
The excellent effects of the present invention were confirmed.
比較例１〜４
第１表に示した組成で実施例１と同様にしてエポキシ樹
脂組成物を得た。 この組成物について実施例１と同様
に沈降性の試験を行ったところ、第１表に示したように
それぞれ沈降しており、従って均一な組成物ではなかっ
た。Comparative Examples 1 to 4 Epoxy resin compositions were obtained in the same manner as in Example 1 with the compositions shown in Table 1. When this composition was subjected to a sedimentation test in the same manner as in Example 1, it was found that each of the compositions had sedimented as shown in Table 1, and therefore it was not a uniform composition.
〔発明の効渠Ｊ
以上の説明および第１表から明らかなように、本発明の
エポキシ樹脂組成物は、高速度攪拌を行うことによって
無機質充填剤が均一に分散し、かつ沈降は全くみられず
、作業性のよいものである。[Effects of the Invention J As is clear from the above explanation and Table 1, in the epoxy resin composition of the present invention, the inorganic filler is uniformly dispersed by high-speed stirring, and no sedimentation is observed. First, it is easy to work with.
従って、このエポキシ樹脂組成物を用いることによって
優れた電気・電子部品を得ることができる。Therefore, by using this epoxy resin composition, excellent electrical/electronic parts can be obtained.
Claims (1)
させてなることを特徴とするエポキシ樹脂組成物。 ２ 高速度攪拌は、ディスパースの周速として５ｍ／秒
以上、攪拌時間が１０分間以上である特許請求の範囲第
１項記載のエポキシ樹脂組成物。[Scope of Claims] 1. An epoxy resin composition comprising a liquid epoxy resin and an inorganic filler stirred at high speed. 2. The epoxy resin composition according to claim 1, wherein the high-speed stirring is performed at a peripheral speed of disperser of 5 m/sec or more and a stirring time of 10 minutes or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61223714A JPH0717815B2 (en) | 1986-09-24 | 1986-09-24 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61223714A JPH0717815B2 (en) | 1986-09-24 | 1986-09-24 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381155A true JPS6381155A (en) | 1988-04-12 |
| JPH0717815B2 JPH0717815B2 (en) | 1995-03-01 |
Family
ID=16802517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61223714A Expired - Fee Related JPH0717815B2 (en) | 1986-09-24 | 1986-09-24 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717815B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008184529A (en) * | 2007-01-30 | 2008-08-14 | Tosoh Corp | Method for producing polymer solution |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4072592A (en) * | 1974-05-20 | 1978-02-07 | Mobil Oil Corporation | Radiation curable coating |
| JPS5751427A (en) * | 1980-09-12 | 1982-03-26 | Toyobo Co Ltd | Preparation of polyamide laminated film |
| US4383061A (en) * | 1981-06-25 | 1983-05-10 | The United States Of America As Represented By The Secretary Of The Navy | Epoxy smoothing compound |
| JPS5765744A (en) * | 1981-08-03 | 1982-04-21 | Mitsui Toatsu Chem Inc | Prevention of spotting of vinyl chloride resin product |
| JPS58213018A (en) * | 1982-06-03 | 1983-12-10 | Mitsubishi Electric Corp | Epoxy resin composition |
| JPS6126622A (en) * | 1984-07-13 | 1986-02-05 | Matsushita Electric Works Ltd | Preparation of molding material for commutator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008184529A (en) * | 2007-01-30 | 2008-08-14 | Tosoh Corp | Method for producing polymer solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717815B2 (en) | 1995-03-01 |
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