JPS6227111B2 - - Google Patents
Info
- Publication number
- JPS6227111B2 JPS6227111B2 JP55108532A JP10853280A JPS6227111B2 JP S6227111 B2 JPS6227111 B2 JP S6227111B2 JP 55108532 A JP55108532 A JP 55108532A JP 10853280 A JP10853280 A JP 10853280A JP S6227111 B2 JPS6227111 B2 JP S6227111B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- powder coating
- curing
- powder
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 62
- 229920000647 polyepoxide Polymers 0.000 claims description 62
- 239000000843 powder Substances 0.000 claims description 49
- 238000000576 coating method Methods 0.000 claims description 36
- 239000011248 coating agent Substances 0.000 claims description 27
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 14
- 230000008018 melting Effects 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 13
- 230000009257 reactivity Effects 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 6
- -1 amine compound Chemical class 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 238000007580 dry-mixing Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 125000002883 imidazolyl group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000047 product Substances 0.000 description 12
- 150000002460 imidazoles Chemical class 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 5
- 238000004898 kneading Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Description
本発明はエポキシ樹脂粉体塗料の製造法に関す
る。さらに詳しくは、ポツトライフの長い速硬化
性を有するエポキシ樹脂粉体塗料の製造法に関す
る。
エポキシ樹脂粉体塗料は、一般にエポキシ当量
400〜4000を有するビスフエノールＡ型エポキシ
樹脂と硬化剤および必要ならば充てん剤、流れ調
節剤、着色剤などとを80〜120℃で溶融混練りし
たのち急冷し、粉末化して製造される。
速硬化性エポキシ樹脂粉体塗料にあつては、そ
の塗装工程を短縮し、作業性を向上することがで
き広範に使用されている。
しかし速硬化性にするために用いられるエポキ
シ樹脂の硬化剤や硬化触媒には、アミン系化合
物、イミダゾール類またはそれらの付加物などが
あるが、それらの硬化剤や硬化触媒を用いるとき
はいずれも粉体塗料製造時の混練り温度条件が微
妙に影響すると共に、製造設備の保守点検が難し
く、長時間の運転が不可能であり、またえられる
粉体塗料も室温における貯蔵中に反応がすすみ、
融点が高くなり、ゲル化時間が短くなりすぎ、品
質も不安定なものとなるといつた欠点がある。ま
たそれらの硬化剤や硬化触媒をエポキシ樹脂と乾
式で混合してえられる粉体塗料にあつては、硬化
が速く、ポツトライフも長いが、硬化した硬化物
のすべての物性が溶融混練りしてえた硬化物の物
性に比べて劣り、とくに耐化学薬品性に劣る。
本発明者は鋭意研究を重ねた結果、ポツトライ
フが長くかつ速硬化性であり、しかも諸特性にす
ぐれた硬化物を与えうるエポキシ樹脂粉体塗料の
容易な製造法を見出し、本発明を完成するにいた
つた。
すなわち本発明はエポキシ当量200〜4000のエ
ポキシ樹脂１当量に対して該エポキシ樹脂との反
応性の低い融点40℃以上を有するフエノール樹
脂、ポリエステル樹脂およびポリエーテルの少な
くとも１種または該エポキシ樹脂との反応性の低
い硬化剤0.3〜１当量を溶融混合し、粉末にした
のち、該粉末100部（重量部、以下同様）に対し
て融点40℃以上のイミダゾール系硬化触媒の微粉
末0.01〜10部を乾式で混合してなることを特徴と
するエポキシ樹脂粉体塗料の製造法に関するもの
であつて、前記特定の性状を有する成分を用いる
ことにより、従来のエポキシ樹脂粉体塗料におけ
るごとく製造設備の保守点検が難しく、長時間の
運転が不可能であつたり、またえられる粉体塗料
が貯蔵中に反応してゲル化時間が短くなりすぎた
り、品質も不安定であるといつた叙上の欠点が排
除され、ポツトライフが長く、速硬化性であり、
しかも諸特性にすぐれた硬化物を与え、製造が簡
単であるというきわめて顕著な効果が奏される。
本発明のエポキシ樹脂粉体塗料に用いるエポキ
シ樹脂としては、たとえばビスフエノールＡ型エ
ポキシ樹脂、シクロ型エポキシ樹脂、フエノール
変成またはクレゾール変成エポキシ樹脂などのエ
ポキシ樹脂、好ましくはビスフエノールＡ型エポ
キシ樹脂を主成分とする樹脂があげられ、エポキ
シ当量200〜4000を有するものが用いられる。エ
ポキシ当量が4000より大きいエポキシ樹脂を用い
るときは融点が高くて溶融混合が難しくなり、ま
たエポキシ当量が200より小さいエポキシ樹脂を
用いるときは反応生成物が固体になりにくくな
り、いずれも好ましくない。
本発明のエポキシ樹脂粉体塗料には、エポキシ
樹脂との反応性の低い融点40℃以上を有するフエ
ノール樹脂、ポリエステル樹脂またはポリエーテ
ル（以下、エポキシ樹脂との反応性の低い成分と
いう）や、エポキシ樹脂との反応性の低い硬化剤
が用いられる。これらは単独で用いてもよく、２
種以上併用してもよい。前記フエノール、ポリエ
ステル樹脂またはポリエーテルの具体例として
は、たとえばノボラツク型またはレゾール型のフ
エノール樹脂、末端にカルボキシル基を有するポ
リエステル樹脂、ポリエチレングリコールなどの
融点40℃以上を有するものがあげられ、またエポ
キシ樹脂との反応性の低い硬化剤としては、たと
えばセバチン酸、アジピン酸、フタル酸などの有
機酸、無水フタル酸、無水マレイン酸、テトラヒ
ドロ酸無水物、無水コハク酸などの有機酸無水
物、ジシアンジアミド、ジアミノジフエニルメタ
ンなどのアミン系化合物などのエポキシ樹脂硬化
剤があげられる。エポキシ樹脂への前記成分また
は硬化剤の添加量としてはエポキシ樹脂１当量に
対して0.3〜１当量が採用され、それによりエポ
キシ樹脂と反応し、過剰のエポキシ基は、触媒に
より完全に硬化される。前記成分または硬化剤の
添加量が前記範囲をはずれるときにはえられる硬
化物の物性が劣り、好ましくない。
なお本発明のエポキシ樹脂粉体塗料において
は、エポキシ樹脂との反応性の低い成分として、
前記のごとく融点40℃以上を有するノボラツク型
またはレゾール型フエノール樹脂、ポリエステル
樹脂などを用いるのであるが、それによりエポキ
シ樹脂と均一に反応し、性質の良好な硬化物がえ
られる。融点が40℃より低い前記成分を用いると
きは、混合物が、融点40℃以下になりやすくな
り、好ましくない。
本発明のエポキシ樹脂粉体塗料に用いるイミダ
ゾール系硬化触媒としては、たとえば２−メチル
イミダゾール、２−エチルイミダゾール、２−フ
オニルイミダゾール、２−ウンデシルイミダゾー
ルなどのイミダゾール類やイミダゾール類のアジ
ン付加物などと前記イミダゾール類とのイミダゾ
ール付加物などの融点40℃以上を有するものがあ
げられる。イミダゾール付加物としては、たとえ
ば四国化成工業(株)製のキユアゾール2PZ−OK、
キユアゾール2MZ−OK、キユアゾール2PHZ、キ
ユアゾール2MZ−AZINE、キユアゾール2MZ−
CN（いずれも商品名）などがある。なお必要な
らばそれらの硬化触媒は粉砕機により微粉末化し
て用いられる。その粒子径は50μ以下が分散性が
良好である。融点が40℃より低い硬化触媒を用い
るときは粉未混合物がブロツキングしやすくな
り、好ましくない。
本発明のエポキシ樹脂粉体塗料を製造するにあ
たり、エポキシ樹脂と該エポキシ樹脂との反応性
の低い成分または硬化剤との溶融混合にあたつて
は、たとえば反応釜、ニーダ、エクストルーダな
どにより温度60〜200℃で混練りされる。またえ
られる混練り樹脂はハンマーミルやボールミルな
どを用いて粒子径500〜５μに粉砕され、この粉
末にイミダゾール系硬化触媒を添加し、ボールミ
ル、ヘンシエルミキサーなどにより乾式混合して
エポキシ樹脂粉体塗料が製造される。
本発明のエポキシ樹脂粉体塗料において、溶融
混合しかつ粉砕してえられる粉末に乾式混合され
る硬化触媒の添加量としては、粉末100部に対し
0.01〜10部が採用され、それにより反応性の低い
物質とエポキシ樹脂との反応を促進したり、過剰
のエポキシ樹脂と反応し、性質の良好なエポキシ
樹脂粉体塗料がえられる。硬化触媒の添加量が前
記粉末100部に対し10部より多いときはえられる
硬化物の物性がわるくなり、また0.01部より少な
いときはエポキシ樹脂粉体塗料の硬化が遅くな
り、いずれも好ましくない。
なお、本発明のエポキシ樹脂粉体塗料において
は、必要に応じて充てん剤、着色剤、流れ調節剤
などの添加剤を加えてもよい。
つぎに実施例および比較例をあげて本発明のエ
ポキシ樹脂粉体塗料を具体的に説明する。
実施例 １〜６
第１表に示すごとく、エポキシ樹脂、エポキシ
樹脂との反応性の低い成分（以下、Ａ成分とい
う）および（または）エポキシ樹脂との反応性の
低い硬化剤（以下、Ｂ成分という）をエクストル
ーダを用いて温度100℃で溶融混練りし、ついで
冷却したのちハンマーミルを用いてそれぞれ粉砕
した。ついでえられた粉末にイミダゾール系硬化
触媒（以下、Ｃ成分という）を添加し、ボールミ
ルを用いて約１時間乾式混合して、40メツシユパ
スのエポキシ樹脂粉体塗料をそれぞれえた。
えられたエポキシ樹脂粉体塗料のポツトライフ
および硬化時間をそれぞれ測定した。それらの測
定結果を第１表に示す。
またえられたエポキシ樹脂粉体塗料を用いて、
流動浸漬法により約0.5mm膜厚を塗布し180℃、１
時間硬化せしめ塗膜をはがした硬化物の曲げ強度
をそれぞれ測定した。それらの測定結果を第１表
に示す。なお曲げ強度はインストロン型引張り試
験機により測定した。
比較例 １〜３
第１表に示すごとく、エポキシ樹脂、Ｂ成分お
よび（または）Ｃ成分をエクストルーダを用いて
温度100℃で溶融混練りし、ついで冷却したのち
ハンマーミルを用いてそれぞれ粉砕して40メツシ
ユパスのエポキシ樹脂粉体塗料をえた。
えられたエポキシ樹脂粉体塗料のポツトライフ
および硬化時間をそれぞれ測定した。それらの測
定結果を第１表に示す。
またえられたエポキシ樹脂粉体塗料を実施例１
〜６と同様にしてそれぞれ硬化せしめ、かつえら
れた硬化物の曲げ強度を実施例１〜６と同様にし
てそれぞれ測定した。それらの測定結果を第１表
に示す。
比較例 ４
第１表に示すごとく、エポキシ樹脂およびＣ成
分をボールミルを用いて粉砕しかつ乾式混合し
て、40メツシユパスのエポキシ樹脂塗料をえた。
えられたエポキシ樹脂粉体塗料のポツトライフ
および硬化時間を測定した。その測定結果を第１
表に示す。
またえられたエポキシ樹脂粉体塗料を実施例１
〜６と同様にして硬化せしめ、かつえられた硬化
物の曲げ強度を実施例１〜６と同様にして測定し
た。その測定結果を第１表に示す。
The present invention relates to a method for producing an epoxy resin powder coating. More specifically, the present invention relates to a method for producing a fast-curing epoxy resin powder coating with a long pot life. Epoxy resin powder coatings generally have an epoxy equivalent
It is produced by melt-kneading a bisphenol A type epoxy resin having a molecular weight of 400 to 4000, a curing agent, and if necessary, a filler, a flow control agent, a coloring agent, etc. at 80 to 120°C, followed by rapid cooling and powdering. Fast-curing epoxy resin powder coatings are widely used because they shorten the coating process and improve workability. However, curing agents and curing catalysts for epoxy resins used to make them fast-cure include amine compounds, imidazoles, and their adducts; The kneading temperature conditions during the production of powder coatings have a subtle influence, maintenance and inspection of production equipment is difficult, long-term operation is impossible, and the resulting powder coatings undergo reactions during storage at room temperature. ,
The disadvantages are that the melting point becomes high, the gelation time becomes too short, and the quality becomes unstable. Powder coatings obtained by dry mixing these curing agents and curing catalysts with epoxy resins cure quickly and have a long pot life, but all the physical properties of the cured product are lost due to melt kneading. The physical properties of the cured product are inferior, especially the chemical resistance. As a result of extensive research, the present inventor has discovered an easy method for producing an epoxy resin powder coating that has a long pot life, is fast curing, and can provide a cured product with excellent properties, and has completed the present invention. I arrived. That is, the present invention uses at least one of phenolic resins, polyester resins, and polyethers having low reactivity with the epoxy resin and a melting point of 40°C or higher, or a combination thereof with the epoxy resin having an epoxy equivalent weight of 200 to 4,000. After melt-mixing 0.3 to 1 equivalent of a low-reactive curing agent and making it into powder, 0.01 to 10 parts of fine powder of an imidazole-based curing catalyst with a melting point of 40°C or higher is added to 100 parts (parts by weight, the same applies hereinafter) of the powder. This invention relates to a method for producing an epoxy resin powder coating characterized by dry mixing the above-mentioned components, and by using the components having the above-mentioned specific properties, the production equipment can be reduced as in the case of conventional epoxy resin powder coatings. It has been reported that maintenance and inspection are difficult, that long-term operation is impossible, that the resulting powder coatings react during storage, resulting in too short a gelation time, and that the quality is unstable. Eliminates defects, has a long pot life, and is fast curing.
Moreover, it provides a cured product with excellent properties and is easy to manufacture, which is a very remarkable effect. The epoxy resin used in the epoxy resin powder coating of the present invention includes epoxy resins such as bisphenol A epoxy resin, cyclo epoxy resin, phenol modified or cresol modified epoxy resin, preferably bisphenol A epoxy resin. The resin used as a component is listed, and those having an epoxy equivalent weight of 200 to 4000 are used. When an epoxy resin with an epoxy equivalent of more than 4000 is used, the melting point is high and melt mixing becomes difficult, and when an epoxy resin with an epoxy equivalent of less than 200 is used, the reaction product becomes difficult to solidify, both of which are not preferred. The epoxy resin powder coating of the present invention includes phenol resin, polyester resin, or polyether (hereinafter referred to as a component with low reactivity with epoxy resin) having a melting point of 40°C or higher that has low reactivity with epoxy resin, and epoxy resin. A curing agent with low reactivity with the resin is used. These may be used alone, or 2
More than one species may be used in combination. Specific examples of the phenol, polyester resin, or polyether include those having a melting point of 40°C or higher, such as novolac type or resol type phenol resin, polyester resin having a carboxyl group at the end, and polyethylene glycol. Examples of curing agents with low reactivity with resins include organic acids such as sebacic acid, adipic acid, and phthalic acid, organic acid anhydrides such as phthalic anhydride, maleic anhydride, tetrahydroanhydride, and succinic anhydride, and dicyandiamide. , epoxy resin curing agents such as amine compounds such as diaminodiphenylmethane. The amount of the above component or curing agent added to the epoxy resin is 0.3 to 1 equivalent per equivalent of the epoxy resin, so that it reacts with the epoxy resin, and the excess epoxy group is completely cured by the catalyst. . When the amount of the component or curing agent added is out of the range, the physical properties of the resulting cured product will be poor, which is not preferred. In addition, in the epoxy resin powder coating of the present invention, as a component with low reactivity with the epoxy resin,
As mentioned above, a novolac type or resol type phenol resin, polyester resin, etc. having a melting point of 40° C. or higher is used, which reacts uniformly with the epoxy resin and provides a cured product with good properties. When using the above components having a melting point lower than 40°C, the mixture tends to have a melting point of 40°C or lower, which is not preferable. Examples of the imidazole curing catalyst used in the epoxy resin powder coating of the present invention include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-phonylimidazole, and 2-undecylimidazole, and azine adducts of imidazoles. Examples include those having a melting point of 40° C. or higher, such as imidazole adducts of the above-mentioned imidazoles and the like. Examples of imidazole adducts include Kyuazole 2PZ-OK manufactured by Shikoku Kasei Kogyo Co., Ltd.
Kyuazol 2MZ-OK, Kyuazol 2PHZ, Kyuazol 2MZ-AZINE, Kyuazol 2MZ-
CN (all product names), etc. If necessary, these curing catalysts may be used after being pulverized using a pulverizer. When the particle size is 50μ or less, the dispersibility is good. When a curing catalyst with a melting point lower than 40°C is used, the unmixed powder tends to block, which is not preferable. In producing the epoxy resin powder coating of the present invention, the epoxy resin and a component with low reactivity with the epoxy resin or a curing agent are melt-mixed using a reaction vessel, kneader, extruder, etc. at a temperature of 60°C. Kneaded at ~200℃. The resulting kneaded resin is pulverized to a particle size of 500 to 5μ using a hammer mill or ball mill, and an imidazole curing catalyst is added to this powder, which is then dry mixed using a ball mill or Henschel mixer to form epoxy resin powder. Paint is manufactured. In the epoxy resin powder coating of the present invention, the amount of curing catalyst added is dry-mixed to the powder obtained by melt-mixing and pulverizing, based on 100 parts of the powder.
A content of 0.01 to 10 parts is adopted, which promotes the reaction between less reactive substances and the epoxy resin, or reacts with excess epoxy resin, resulting in an epoxy resin powder coating with good properties. If the amount of curing catalyst added is more than 10 parts per 100 parts of the powder, the physical properties of the resulting cured product will deteriorate, and if it is less than 0.01 part, the curing of the epoxy resin powder coating will be delayed, both of which are undesirable. . In addition, in the epoxy resin powder coating of the present invention, additives such as a filler, a coloring agent, a flow control agent, etc. may be added as necessary. Next, the epoxy resin powder coating of the present invention will be specifically explained with reference to Examples and Comparative Examples. Examples 1 to 6 As shown in Table 1, epoxy resin, a component with low reactivity with the epoxy resin (hereinafter referred to as component A), and/or a curing agent with low reactivity with the epoxy resin (hereinafter referred to as component B) ) were melt-kneaded using an extruder at a temperature of 100°C, cooled, and then ground using a hammer mill. An imidazole-based curing catalyst (hereinafter referred to as component C) was then added to the resulting powder and dry mixed for about 1 hour using a ball mill to obtain 40 mesh pass epoxy resin powder coatings. The pot life and curing time of the obtained epoxy resin powder coating were measured. The measurement results are shown in Table 1. Using the obtained epoxy resin powder coating,
Apply a film with a thickness of approximately 0.5 mm using the fluidized dipping method and heat at 180℃ for 1
The bending strength of each cured product after time curing and peeling off the coating was measured. The measurement results are shown in Table 1. The bending strength was measured using an Instron type tensile tester. Comparative Examples 1 to 3 As shown in Table 1, the epoxy resin, component B and/or component C were melt-kneaded using an extruder at a temperature of 100°C, cooled, and then ground using a hammer mill. I got 40 mesh passes of epoxy resin powder paint. The pot life and curing time of the obtained epoxy resin powder coating were measured. The measurement results are shown in Table 1. Example 1 of the obtained epoxy resin powder coating
The flexural strength of each cured product was measured in the same manner as in Examples 1 to 6. The measurement results are shown in Table 1. Comparative Example 4 As shown in Table 1, an epoxy resin and component C were ground using a ball mill and dry mixed to obtain a 40 mesh pass epoxy resin paint. The pot life and curing time of the obtained epoxy resin powder coating were measured. The first measurement result is
Shown in the table. Example 1 of the obtained epoxy resin powder coating
It was cured in the same manner as in Examples 1 to 6, and the bending strength of the cured product was measured in the same manner as in Examples 1 to 6. The measurement results are shown in Table 1.
【表】【table】
【表】
第１表から、本発明のエポキシ樹脂粉体塗料の
製造法にあつては、ポツトライフが長くかつ硬化
が速く、しかもえられる硬化物の物性が良好であ
ることが明らかである。
また本発明のエポキシ樹脂粉体塗料の製造にあ
つては、溶融混練り温度条件の巾が広く、製造設
備の連続運転性もきわめて良好であつた。[Table] It is clear from Table 1 that the method for producing the epoxy resin powder coating of the present invention has a long pot life, fast curing, and the resulting cured product has good physical properties. Furthermore, in the production of the epoxy resin powder coating of the present invention, a wide range of melt-kneading temperature conditions was available, and the continuous operation of the production equipment was extremely good.
Claims (1)
量に対して該エポキシ樹脂との反応性の低い融点
40℃以上を有するフエノール樹脂、ポリエステル
樹脂およびポリエーテルの少なくとも１種または
該エポキシ樹脂との反応性の低い硬化剤0.3〜１
当量を溶融混合し、粉末にしたのち、該粉末100
重量部に対して融点40℃以上のイミダゾール系硬
化触媒の微粉末0.01〜10重量部を乾式で混合して
なることを特徴とするエポキシ樹脂粉体塗料の製
造法。 ２ エポキシ樹脂との反応性の低い硬化剤が有機
酸、有機酸無水物またはアミン系化合物である特
許請求の範囲第１項記載の粉体塗料の製造法。 ３ イミダゾール系硬化触媒がイミダゾール類ま
たはイミダゾール付加物であり、かつ粒子径50μ
以下の微粉末である特許請求の範囲第１項記載の
粉体塗料の製造法。 ４ アミン系化合物がジシアンジアミドまたはジ
アノジフエニルメタンである特許請求の範囲第２
項記載の粉体塗料の製造法。[Claims] 1. A melting point with low reactivity with 1 equivalent of epoxy resin having an epoxy equivalent of 200 to 4000.
At least one kind of phenolic resin, polyester resin, and polyether having a temperature of 40°C or higher, or a curing agent with low reactivity with the epoxy resin 0.3 to 1
After melting and mixing equivalent amounts to powder, the powder 100
1. A method for producing an epoxy resin powder coating, which comprises dry mixing 0.01 to 10 parts by weight of fine powder of an imidazole curing catalyst having a melting point of 40° C. or more based on parts by weight. 2. The method for producing a powder coating according to claim 1, wherein the curing agent having low reactivity with the epoxy resin is an organic acid, an organic acid anhydride, or an amine compound. 3 The imidazole-based curing catalyst is an imidazole or an imidazole adduct, and the particle size is 50 μm.
A method for producing a powder coating according to claim 1, which is the following fine powder. 4 Claim 2 in which the amine compound is dicyandiamide or dianodiphenylmethane
Method for manufacturing the powder coating described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10853280A JPS5731966A (en) | 1980-08-04 | 1980-08-04 | Production of epoxy resin powdered paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10853280A JPS5731966A (en) | 1980-08-04 | 1980-08-04 | Production of epoxy resin powdered paint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5731966A JPS5731966A (en) | 1982-02-20 |
| JPS6227111B2 true JPS6227111B2 (en) | 1987-06-12 |
Family
ID=14487187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10853280A Granted JPS5731966A (en) | 1980-08-04 | 1980-08-04 | Production of epoxy resin powdered paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5731966A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924762A (en) * | 1982-07-31 | 1984-02-08 | Toto Kasei Kk | Quick-curing powdered paint composition |
| EP0348193A3 (en) * | 1988-06-24 | 1990-09-12 | Somar Corporation | Epoxy resin composition |
| TW401451B (en) * | 1997-04-07 | 2000-08-11 | Kao Corp | Powder coating |
| KR100710503B1 (en) * | 1999-12-30 | 2007-04-23 | 주식회사 케이씨씨 | Thermosetting powder coating composition for high temperature multilayer pipeline coating primer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504692A (en) * | 1973-05-17 | 1975-01-18 |
-
1980
- 1980-08-04 JP JP10853280A patent/JPS5731966A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504692A (en) * | 1973-05-17 | 1975-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5731966A (en) | 1982-02-20 |
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