JPS6315846A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS6315846A JPS6315846A JP15797286A JP15797286A JPS6315846A JP S6315846 A JPS6315846 A JP S6315846A JP 15797286 A JP15797286 A JP 15797286A JP 15797286 A JP15797286 A JP 15797286A JP S6315846 A JPS6315846 A JP S6315846A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyether sulfone
- weight
- parts
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 title abstract description 8
- 239000011342 resin composition Substances 0.000 title description 7
- 229920005989 resin Polymers 0.000 claims abstract description 54
- 239000011347 resin Substances 0.000 claims abstract description 54
- 239000004695 Polyether sulfone Substances 0.000 claims abstract description 21
- 229920006393 polyether sulfone Polymers 0.000 claims abstract description 21
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 12
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 7
- 239000004643 cyanate ester Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 abstract description 15
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 7
- 239000004917 carbon fiber Substances 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002148 esters Chemical class 0.000 abstract 2
- 150000003457 sulfones Chemical class 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- -1 molecular weight 380 Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、耐熱性を損なうことなく、耐衝撃性、耐水性
に優れた熱硬化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a thermosetting resin composition that has excellent impact resistance and water resistance without impairing heat resistance.
最近、カーボン繊維に樹脂を含浸させ、硬化させること
により得られる複合材、いわゆるカーボン繊維強化プラ
スチックス（以下、ＣＦＲＰという）が航空機の一次構
造材等として広範囲に亘って使用されるようになった。Recently, composite materials obtained by impregnating carbon fibers with resin and curing them, so-called carbon fiber reinforced plastics (hereinafter referred to as CFRP), have come to be widely used as primary structural materials for aircraft. .
従来、カーボン繊維含浸用樹脂としては、主としてエポ
キシ樹脂組成物が用いられており、特に耐熱性を目的と
する場合にはテトラグリシジルジアミノジフェニルメタ
ン（ＴＧＤＤＭ）のエポキシ樹脂に硬化剤としてジアミ
ノジフェニＪレスＪレホン（ｒ）ＤＳ）を力■えてなる
エポキシ樹脂組成物が広く用いられてきた。しかし、こ
のＴＧＤＤＭ／ＤＤＳ系のエポキシ樹脂組成物は、優れ
た初期耐熱性およびカーボン繊維との接着性を有するが
、吸湿により耐熱性が著しく低下すること及び衝撃後の
圧縮強度が低い等の欠点がある。このように従来のエポ
キシ樹脂組成物は、高い耐熱性、耐衝撃性を必要とする
等の航空機用−次槽造材としての用途には満足的なもの
ではない。更に、シアン酸エステル成分とビスマレイミ
ド成分で構成される熱硬化性樹脂（特公昭５２−３１２
７９号、５４−３０４４０号の各公報参照）は、優れた
耐熱性を有するものの耐衝撃性が十分ではないという問
題がある。Conventionally, epoxy resin compositions have been mainly used as resins for impregnating carbon fibers, and in particular when heat resistance is desired, epoxy resins such as tetraglycidyl diaminodiphenylmethane (TGDDM) and diaminodiphenylene J-less are added as a curing agent. Epoxy resin compositions prepared by using J.Rehon (r) DS) have been widely used. However, although this TGDDM/DDS-based epoxy resin composition has excellent initial heat resistance and adhesion with carbon fibers, it has drawbacks such as a significant decrease in heat resistance due to moisture absorption and low compressive strength after impact. There is. As described above, conventional epoxy resin compositions are not satisfactory for use as materials for building secondary tanks for aircraft, which require high heat resistance and impact resistance. Furthermore, a thermosetting resin composed of a cyanate ester component and a bismaleimide component (Japanese Patent Publication No. 52-312
No. 79 and No. 54-30440) have excellent heat resistance, but have a problem of insufficient impact resistance.
本発明は、耐熱性、耐衝撃性に優れた、高伸度カーボン
繊維の含浸用として好適なプリプレグ用熱硬化性樹脂組
成物を桿供することを目的とする。An object of the present invention is to provide a thermosetting resin composition for prepreg that has excellent heat resistance and impact resistance and is suitable for impregnating high elongation carbon fibers.
このため、本発明は、シアン酸エステル成分とビスマレ
イミド成分とから構成される樹脂９０〜３０重量部と、
液状エポキシ樹脂１０〜７０重量部と、ポリエーテルサ
ルフォン樹脂２〜７５重量部とからなり、前記ポリエー
テルザルフオン樹脂が分散状態で分散したことを特徴と
する熱硬化性樹脂組成物を要旨とする。Therefore, the present invention provides 90 to 30 parts by weight of a resin composed of a cyanate ester component and a bismaleimide component;
The gist is a thermosetting resin composition comprising 10 to 70 parts by weight of a liquid epoxy resin and 2 to 75 parts by weight of a polyether sulfone resin, characterized in that the polyether sulfone resin is dispersed in a dispersed state. do.
以下、本発明の構成について詳しく説明する。Hereinafter, the configuration of the present invention will be explained in detail.
（１） シアン酸エステル成分とビスマレイミド成分
とから構成される樹脂。(1) A resin composed of a cyanate ester component and a bismaleimide component.
シアン酸エステル成分とビスマレイミド成分とから構成
される樹脂は公知である（例えば、特公昭５２−３１２
７９号、特公昭５４−３０４４０号）。この樹脂として
、市販品（ＢＴ樹脂、三菱瓦斯化学社製）を使用するこ
とができる。Resins composed of a cyanate ester component and a bismaleimide component are known (for example, Japanese Patent Publication No. 52-312
No. 79, Special Publication No. 54-30440). As this resin, a commercial product (BT resin, manufactured by Mitsubishi Gas Chemical Co., Ltd.) can be used.
（２）液状エポキシ樹脂。(2) Liquid epoxy resin.
本発明において使用するエポキシ樹脂［Ｊ：、？Ｉ０状
でなければならない。これ６才、１以下の理由による。Epoxy resin used in the present invention [J:,? Must be in I0 condition. This is 6 years old, due to reasons below 1.
シアン酸エステル成分とビスマレイミド成分とから構成
される樹脂それ自身シ１゛、タンクが少なく、更に、ポ
リエーテルサルフォン樹脂を混合すると全くタックがな
くなり、プリプレグ用樹脂としではプリプレグを積層す
る成形上、治具形状にフィン］・シない問題があり、好
ましくない。また、エポキシ樹脂は、シアン酸エステル
成分とビスマレイミド成分から構成される樹脂と反応す
るため、硬化時間を短縮できる。The resin itself, which is composed of a cyanate ester component and a bismaleimide component, has a small tank capacity, and when mixed with polyether sulfone resin, there is no tack at all. , there is a problem that the jig shape does not have fins, which is not preferable. Furthermore, since the epoxy resin reacts with the resin composed of the cyanate ester component and the bismaleimide component, the curing time can be shortened.
それ故、エポキシ樹脂は、タックをあげ、短時間で硬化
するために好都合である。Therefore, epoxy resins are advantageous because they increase tack and cure in a short time.
本発明において効果的に使用し得る液状エポキシ樹脂と
しては、分子量５００以下、エポキシ当量３００以下の
ものが好ましく、例えば、次のようなビスフェノ−１１
丈ｎのジコニボギシドがある。The liquid epoxy resin that can be effectively used in the present invention preferably has a molecular weight of 500 or less and an epoxy equivalent of 300 or less. For example, the following bispheno-11
There is a ziconibogicid of length n.
シェル化学社：エピコ−１−８０１，Ｆ２Ｏ３，８０７
゜８０８、 ８１５． ８１９． ８２７． ８２８．
８７１゜ダウケミカル社： ｒｌ、Ｅ、Ｒ，３１７
，３３０，３３＋。Shell Chemical Company: Epicor-1-801, F2O3, 807
゜808, 815. 819. 827. 828.
871゜Dow Chemical Company: rl, E, R, 317
, 330, 33+.
３３２、 ３３３． ３３７． ３８３． ３２４．
３２５゜３６１．３６５゜
チハガイギー社： ＾ｒａｌｄｉｔｅ ＧＹ ２５０．
２６０゜２８０ 。332, 333. 337. 383. 324.
325゜361.365゜Chiha Geigy: ^raldite GY 250.
260°280.
住友化学工業社： １ＥＬＡ１１５．１１７．１２１．
１．２７゜１２８．１３４゜
本発明に使用される液状エポキシ樹脂の量は、十、述の
夕・７りを出すために、シアン酸エステル成分とビスマ
レイミド成分から構成される樹脂９０〜３０重量部に対
し１０〜７０重量部である。Sumitomo Chemical Industries: 1ELA115.117.121.
1.27゜128.134゜The amount of liquid epoxy resin used in the present invention is 90 to 30. The amount is 10 to 70 parts by weight.
（３） ポリエーテルサルフオン樹脂。(3) Polyether sulfone resin.
本発明で使用されるポリエーテルサルフオン樹脂は、耐
衝撃性を向上させるために添加される。このポリエーテ
ルサルフオン樹脂は、下記一般式で示されるものであり
、例えばＰＥ５４１００、４８００．５００３ （住友
化学工業社製）がある。The polyether sulfone resin used in the present invention is added to improve impact resistance. This polyether sulfone resin is represented by the following general formula, and examples include PE54100 and 4800.5003 (manufactured by Sumitomo Chemical Industries, Ltd.).
ｉｌｌ常、ポリエーテルサルフォン樹脂を他の樹脂に混
合するには、溶融状態あるいしよ塩化メチレン、Ｎ−メ
チルピロリドン、Ｎ、Ｎ′−ジメチルホルムアミドなど
の極性溶剤に熔解させて混合あるいは予備反応される。In order to mix polyether sulfone resins with other resins, they are usually mixed in a molten state or dissolved in a polar solvent such as methylene chloride, N-methylpyrrolidone, N,N'-dimethylformamide, or pre-reacted. be done.
溶融状態でシアン酸エステル成分とビスマレイミド成分
で構成される樹脂にポリエーテルサルフオン樹脂を混合
するためには、高温（１５０〜２００℃、あるい６才そ
れ以」二）をかけるため、予備反応が併発し、樹脂がか
だ（なり、タンクもなくなり、プリプレグ用としては不
向きになる。極性溶剤で溶解させて混合すると、プリプ
レグ作製後乾燥しても少量の溶剤が残留し、硬化後の機
械的特性を低下させる。そこで、本発明では、ポリエー
テルサルフォン樹脂を５０μｍ以下に微粉末化して樹脂
への分散性をよくする。また、シアン酸エステル成分と
ビスマレイミド成分から構成される樹脂の予備反応がお
こりにくい比較的低温（６０〜９０℃）で、粉末状ポリ
エーテルサルフオン樹脂を分散混合させ、溶剤を用いず
にシー１〜化し、それを繊維に含浸させてプリプレグを
作製した。In order to mix the polyether sulfone resin with the resin composed of the cyanate ester component and the bismaleimide component in the molten state, it is necessary to prepare the Reactions occur simultaneously, and the resin becomes bulky (no longer has a tank), making it unsuitable for use in prepregs. Therefore, in the present invention, the polyether sulfone resin is finely powdered to a size of 50 μm or less to improve its dispersibility in the resin. A prepreg was produced by dispersing and mixing powdered polyether sulfone resin at a relatively low temperature (60 to 90°C) where preliminary reactions are difficult to occur, forming a sheet 1 without using a solvent, and impregnating it into fibers. .
本発明で使用されるポリエーテルグールフォン樹脂の量
は、２〜７５重早部、好ましくは５〜５０重量部である
。The amount of polyether goulphone resin used in the present invention is from 2 to 75 parts by weight, preferably from 5 to 50 parts by weight.
（４）本発明の樹脂Ｓ、■成物酸物それ自体加熱により
硬化して耐熱性樹脂となる性質を有しているが、硬化を
促進させる目的でｊｍ常は触媒を含有さ〜口で使用する
。このような触媒としては公知のもの（例えば、特公昭
５２−３１２７９号公ｔｔｉ記載のトリエチルアミン等
の第三級アミン、オクチル酸鉛等の有機金属化合物）を
用いる。(4) The resin S of the present invention, the compound oxide itself, has the property of curing by heating to become a heat-resistant resin, but it usually contains a catalyst for the purpose of accelerating curing. use. As such a catalyst, a known catalyst is used (for example, a tertiary amine such as triethylamine described in Japanese Patent Publication No. 52-31279, an organometallic compound such as lead octylate).
本発明の樹脂組成物を硬化させるための温度は、硬化剤
や触媒の有無、組成成分の種類などによっても変化する
が、通常１５０〜３００℃の範囲で選ばれればよい。加
熱硬化に際しては圧力を加えることが好ましく、圧力は
Ｏ１１〜５００ｋｇ／ｃＪの範囲で適宜に選ばれる。The temperature for curing the resin composition of the present invention varies depending on the presence or absence of a curing agent and catalyst, the types of composition components, etc., but it may be generally selected within the range of 150 to 300°C. It is preferable to apply pressure during heat curing, and the pressure is appropriately selected within the range of O11 to 500 kg/cJ.
本発明の８、■酸物に４１、樹脂組成物本来の性能が１
１４なわれ７Ｈい範囲で難燃剤等公知の各種添加剤が含
まれる。8 of the present invention, ■ 41 for the acid, the original performance of the resin composition is
Various known additives such as flame retardants are included in the range of 14 to 7H.
以下に実施例および比較例を示して本発明の効果を具体
的に説明する。EXAMPLES The effects of the present invention will be specifically explained below with reference to Examples and Comparative Examples.
実施例、ＪＬ較例
（１）実施例１゜
下記表１に示す配合でＢＴ’２１６４ （三菱瓦斯化学
社製、ビスマレイミド１−リアジン樹脂）とＥｌ、、Ａ
！２Ｂ（住人化学工業″ｆ１製、液状エポキシ樹脂、分
子量３８０、エポキシ当１１９０）を８０℃で混合し、
これにポリエーテルサルフォン樹脂粉末（平均粒径５μ
「）をあらかじめ１５０°Ｃで乾燥後徐々に加え、よく
混合した。更に、所定頃の触媒を加え、この樹脂混合物
を５０μｍでシート化した。Examples, JL Comparative Examples (1) Example 1゜BT'2164 (manufactured by Mitsubishi Gas Chemical Co., Ltd., bismaleimide 1-riazine resin) and El, A
! 2B (manufactured by Sumima Kagaku Kogyo "f1, liquid epoxy resin, molecular weight 380, epoxy weight 1190) was mixed at 80 ° C.
Add polyether sulfone resin powder (average particle size 5μ) to this.
) was gradually added after drying at 150°C and mixed well.Furthermore, a predetermined amount of catalyst was added, and this resin mixture was formed into a sheet with a thickness of 50 μm.
その樹脂シートを炭素繊維に含浸さ−ｌ！、一方向炭素
繊維ブリプレグを作製した。このプリプレグを３６プラ
イ積層させ、表１に示す条件で硬化さセた。The resin sheet is impregnated with carbon fiber-l! , a unidirectional carbon fiber Bripreg was fabricated. 36 plies of this prepreg were laminated and cured under the conditions shown in Table 1.
そのサンプルを吸湿させた後のガラス転移温度と衝撃後
の圧縮強度を表１に示した。Table 1 shows the glass transition temperature of the sample after absorbing moisture and the compressive strength after impact.
（２）実施例２゜
表１に示す配合で実施例１吉同様にして勺ンプルを作製
し、その評価結果を表１に示した。(2) Example 2 Samples were prepared in the same manner as in Example 1 using the formulations shown in Table 1, and the evaluation results are shown in Table 1.
（３）実施例３゜
表１（７）配合７ Ｂ Ｔ２１６４とＢＴ２１６０（三
菱瓦斯化学社製）をブレンドし、実施例１と同様にして
サンプルを作製し、その評価結果を表１．４に示した。(3) Example 3 Table 1 (7) Formulation 7 B A sample was prepared by blending T2164 and BT2160 (manufactured by Mitsubishi Gas Chemical Co., Ltd.) in the same manner as in Example 1, and the evaluation results are shown in Table 1.4. Indicated.
（４）実施例４゜
表１の配合でＢＴ２５６２Ｆ （三菱瓦斯化学社製）を
実施例１と同様にしてサンプルを作製し、その評価結果
を表１に示した。(4) Example 4 A sample of BT2562F (manufactured by Mitsubishi Gas Chemical Co., Ltd.) was prepared in the same manner as in Example 1 with the formulation shown in Table 1, and the evaluation results are shown in Table 1.
これら実施例１〜４で作製したプリプレグはタンクも良
好であった。The prepregs produced in Examples 1 to 4 had good tank properties.
（５）比較例１゜
表１の配合で実施例１と同様にサンプルを作製し、その
評価結果を表１に示した。実施例１あるいは実施例２と
比較するとポリエーテルサルフＡン樹脂を加えることに
より耐衝撃性が改良されている。(5) Comparative Example 1 Samples were prepared in the same manner as in Example 1 using the formulations shown in Table 1, and the evaluation results are shown in Table 1. When compared with Example 1 or Example 2, the impact resistance is improved by adding polyethersulfur A resin.
（６）比較例２゜
表１の配合で実施例１と同様にサンプルを作製し、その
評価結果を表１に示した。(6) Comparative Example 2 Samples were prepared in the same manner as in Example 1 using the formulations shown in Table 1, and the evaluation results are shown in Table 1.
実施例４と比較してもポリエーテルサルフォン樹脂を添
加することによりホソトウェソ１下での耐衝撃性が大幅
に向−１−した。Even in comparison with Example 4, the impact resistance under 100% was significantly improved by adding the polyether sulfone resin.
（７） 比較例３゜
８０重計部のｒ３ Ｔ２＋６０にポリエーテルサルフォ
ン樹脂の粉末（平均粒径２００ ｐ ｍ） Ｉｎ重量部
を加え、１８０°Ｃで混合し７たが、３０分間混合した
後の樹脂混合物は極めて硬くなってしまい、プリプレグ
用樹脂としては不適であった。(7) Comparative Example 3 Parts by weight of polyethersulfone resin powder (average particle size 200 pm) In was added to 80 parts by weight of r3 T2+60 and mixed at 180°C for 30 minutes. The resulting resin mixture became extremely hard and was unsuitable as a prepreg resin.
（８）比較例４゜
ｓｏ重ｔｔ部のＢＴ２１６０に固型エビ・ビス型エポキ
シ樹脂エピコート１００４ （油化シエルエポキシ社製
）１０重量部を８０℃で混合すると、樹脂混合物のタン
クが極端に下がってしまい、それにポリエーテルサルフ
ォン樹脂を加えると全くタックがなくなった。他の固型
エポキシ樹脂（タレゾールノボラック型等）でも同様で
、タンクが少なくプリプレグ用樹脂としては不適であっ
た。(8) Comparative Example 4 When 10 parts by weight of a solid shrimp/bis type epoxy resin Epicoat 1004 (manufactured by Yuka Ciel Epoxy Co., Ltd.) was mixed with BT2160 of 4°so weight tt at 80°C, the tank of the resin mixture dropped extremely. When I added polyether sulfone resin to it, there was no tack at all. The same is true for other solid epoxy resins (Talesol novolac type, etc.), which have small tanks and are unsuitable as prepreg resins.
（９）比較例５゜
タックを出すために１０重量部のＢ Ｔ２１６０に対し
８０重計部のＥＬＡＩ２８を加え、触媒を加えて硬化さ
せた（１８０°ＣＸ ２ ｈｒｓ）。この硬化物のガラ
ス転移温度は１２０°Ｃで、耐熱用途には不適であった
。(9) Comparative Example 80 parts by weight of ELAI28 was added to 10 parts by weight of BT2160 to obtain a 5° tack, and a catalyst was added to cure the mixture (180°CX 2 hrs). The glass transition temperature of this cured product was 120°C, making it unsuitable for heat-resistant applications.
００）比較例６゜
１５重置部のＢ Ｔ２］６０．５重量部のＥＬＡ］２８
、ポリエーテルサルフォン樹脂８０重量部を実施例１と
同様にして混合したが、ポリエーテルサルフォン樹脂の
量が多いためタンクが全くなくプリプレグ用樹脂には不
適であった。00) Comparative Example 6゜15 overlapping part B T2] 60.5 parts by weight ELA] 28
, 80 parts by weight of polyether sulfone resin were mixed in the same manner as in Example 1, but due to the large amount of polyether sulfone resin, there was no tank at all, making it unsuitable for use as a prepreg resin.
（来夏以下余白）
〔発明の効果〕
以上説明したように本発明によれば、シアン酸エステル
成分とビスマレイミド成分から構成される樹脂に液状エ
ポキシ樹脂を混合し、更にポリエーテル→ノ′ルフォン
樹脂を粉末状態で分散させて混合することにより、耐熱
性、耐衝撃性、耐水性に優れ、かつタックの良好な、高
伸度カーボン繊維の含浸用としては好適なプリプレグ用
熱硬化性樹脂組成物を得ることができる。(Blank below next summer) [Effects of the Invention] As explained above, according to the present invention, a liquid epoxy resin is mixed with a resin composed of a cyanate ester component and a bismaleimide component, and further polyether→norfon A thermosetting resin composition for prepreg that has excellent heat resistance, impact resistance, water resistance, and good tack by dispersing and mixing resin in a powder state, and is suitable for impregnating high elongation carbon fibers. can get things.
Claims (1)
される樹脂９０〜３０重量部と、液状エポキシ樹脂１０
〜７０重量部と、ポリエーテルサルフォン樹脂２〜７５
重量部とからなり、前記ポリエーテルサルフォン樹脂が
粉末状態で分散したことを特徴とする熱硬化性樹脂組成
物。90 to 30 parts by weight of a resin composed of a cyanate ester component and a bismaleimide component, and 10 parts by weight of a liquid epoxy resin.
~70 parts by weight and 2 to 75 parts by weight of polyether sulfone resin
parts by weight, wherein the polyether sulfone resin is dispersed in a powder state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15797286A JPS6315846A (en) | 1986-07-07 | 1986-07-07 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15797286A JPS6315846A (en) | 1986-07-07 | 1986-07-07 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6315846A true JPS6315846A (en) | 1988-01-22 |
| JPH058945B2 JPH058945B2 (en) | 1993-02-03 |
Family
ID=15661455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15797286A Granted JPS6315846A (en) | 1986-07-07 | 1986-07-07 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6315846A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110125A (en) * | 1988-10-19 | 1990-04-23 | Mitsubishi Plastics Ind Ltd | Resin composition with high thermal conductivity |
| JPH0757821B2 (en) * | 1989-02-16 | 1995-06-21 | ヘクセル コーポレイション | Reinforced resin system for composite materials |
| US5747615A (en) * | 1988-04-29 | 1998-05-05 | Cytec Technology Corp. | Slurry-mixed heat-curable resin systems having superior tack and drape |
| NL1011391C2 (en) * | 1999-02-25 | 2000-08-28 | 3P Licensing Bv | Composite material comprising a thermally unstable component dissolved in a thermoplastic, made by dissolving the thermoplastic in a reactive solvent and dissolving the thermally unstable component in the resulting mixture |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57165451A (en) * | 1981-04-07 | 1982-10-12 | Mitsubishi Gas Chem Co Inc | Heat-resistant resin composition |
| JPS62277466A (en) * | 1986-05-26 | 1987-12-02 | Toray Ind Inc | Resin composition for prepreg |
-
1986
- 1986-07-07 JP JP15797286A patent/JPS6315846A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57165451A (en) * | 1981-04-07 | 1982-10-12 | Mitsubishi Gas Chem Co Inc | Heat-resistant resin composition |
| JPS62277466A (en) * | 1986-05-26 | 1987-12-02 | Toray Ind Inc | Resin composition for prepreg |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747615A (en) * | 1988-04-29 | 1998-05-05 | Cytec Technology Corp. | Slurry-mixed heat-curable resin systems having superior tack and drape |
| JPH02110125A (en) * | 1988-10-19 | 1990-04-23 | Mitsubishi Plastics Ind Ltd | Resin composition with high thermal conductivity |
| JPH0757821B2 (en) * | 1989-02-16 | 1995-06-21 | ヘクセル コーポレイション | Reinforced resin system for composite materials |
| NL1011391C2 (en) * | 1999-02-25 | 2000-08-28 | 3P Licensing Bv | Composite material comprising a thermally unstable component dissolved in a thermoplastic, made by dissolving the thermoplastic in a reactive solvent and dissolving the thermally unstable component in the resulting mixture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058945B2 (en) | 1993-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0262891B1 (en) | Resin composition of thermosetting resin and thermoplastic resin | |
| JP3092103B2 (en) | Method for producing molding composition containing thermosetting component and thermoplastic component | |
| CN107652933B (en) | Nanoscale single-component tough epoxy compound for bonding magnetic cores and preparation method thereof | |
| EP0583224B1 (en) | Thermosetting resins toughened with sulfone polymers | |
| JP4428978B2 (en) | Epoxy resin composition | |
| US3901833A (en) | Hardenable epoxy resin compositions and process for making the same | |
| JPH0639519B2 (en) | Epoxy resin composition and prepreg | |
| JP4894339B2 (en) | Epoxy resin composition for fiber reinforced composite materials | |
| JPS6315846A (en) | Thermosetting resin composition | |
| JPH04249544A (en) | Resin composition, prepreg and production of prepreg | |
| JPH0643508B2 (en) | Prepreg and manufacturing method thereof | |
| JPS6330519A (en) | Thermosetting resin composition | |
| KR940001169B1 (en) | Epoxy resin composition | |
| CN116875244B (en) | High-temperature-resistant quick-curing epoxy adhesive and preparation method thereof | |
| JPS6333472A (en) | Thermosetting resin composition | |
| JPS6028421A (en) | Epoxy resin composition | |
| JPS5853914A (en) | Epoxy resin composition | |
| JPS61166826A (en) | Epoxy resin composition | |
| JPH03243619A (en) | Epoxy resin composition | |
| JPS6338048B2 (en) | ||
| JPS60156716A (en) | Epoxy resin composition | |
| JPH0129509B2 (en) | ||
| JPS6330558A (en) | Thermosetting resin composition | |
| JPH0335018A (en) | Epoxy resin composition | |
| JPH0223584B2 (en) |