JPS6381030A - Manufacture of electrically-conductive composite metallic plate - Google Patents
Manufacture of electrically-conductive composite metallic plateInfo
- Publication number
- JPS6381030A JPS6381030A JP61227539A JP22753986A JPS6381030A JP S6381030 A JPS6381030 A JP S6381030A JP 61227539 A JP61227539 A JP 61227539A JP 22753986 A JP22753986 A JP 22753986A JP S6381030 A JPS6381030 A JP S6381030A
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- electrically conductive
- conductive substance
- conductive
- softened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 53
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 22
- 239000000126 substance Substances 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 39
- 229910052751 metal Inorganic materials 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
β（苫（上！λ（明旦］％９リ−
本発明は、予め導電性物質を埋設した樹脂フィルムを２
枚の金属板にて挾持した導電性に優れた複合金属板の製
造方法に関する。Detailed description of the invention β
The present invention relates to a method of manufacturing a composite metal plate with excellent conductivity sandwiched between two metal plates.
従来−Ｑ挟狽−
従来より複合金属板に導電性を付与する方法としては、
樹脂中に金属微粉末を混合添加したり、長さ１〜２１１
ｍ以上の金属繊維を樹脂層中（二層状ニ設けること等が
良く知られている。また、他の方法としては、特開昭５
９−２１５８６２号に開示されているように、金属繊維
または箔粉を網目状で樹脂層中に一層設ける方法がある
。Conventional - Q-insertion - As a conventional method of imparting conductivity to a composite metal plate,
Mixing and adding metal fine powder to resin, length 1 to 211
It is well known to provide metal fibers of m or more in diameter in a resin layer (in two layers).
As disclosed in Japanese Patent Application No. 9-215862, there is a method in which metal fibers or foil powder is provided in a network in a resin layer.
褒瞥外胱内山−〇（する問題点
しかしながら、前記の従来技術のうち、前者の方法は、
該粉末の粒径が細かすぎるため大量に添加する必要があ
り、樹脂の接着性の劣化、コストが高くつく等の欠点を
有する。また、後者の方法は、特に樹脂フィルム厚が５
０〜７０μと薄い場合、樹脂に対する金属繊維または箔
粉の比率が大きくなり、やはり、樹脂の接着性の劣化、
制振特性の劣化およびコストが高くつく等の欠点を有す
る。However, among the above-mentioned conventional techniques, the former method has the following problems:
Since the particle size of the powder is too small, it is necessary to add a large amount, which has disadvantages such as deterioration of resin adhesiveness and high cost. In addition, in the latter method, especially when the resin film thickness is 5
When the thickness is between 0 and 70μ, the ratio of metal fibers or foil powder to the resin becomes large, which also leads to deterioration of the adhesion of the resin,
It has drawbacks such as deterioration of damping characteristics and high cost.
ｒ！！ＭＨＩ’ｌ＝全−射シ友１−４１９−や−９１り
肇−すなわち、本発明は、２枚の金属板および該金属板
間に配置された樹脂フィルムからなる複合金属板の製造
方法において、軟化状態の樹脂フィルム上に該樹脂フィ
ルム厚の１００〜１３０％以」二の粒径を有する導電性
物質を分散、配置し、さらに押圧手段により該導電性物
質を樹脂フィルム中に埋設させて導電性樹脂フィルムを
得、その後膣導電性樹脂フィルムの両面に金属板を積層
することを特徴とする導電性複合金属板の製造方法を提
供するものである。r! ! MHI'l = surjective shiyu 1-419-ya-91riji - That is, the present invention provides a method for manufacturing a composite metal plate consisting of two metal plates and a resin film disposed between the metal plates. , dispersing and arranging a conductive substance having a particle size of 100 to 130% or more of the thickness of the resin film on a softened resin film, and further embedding the conductive substance in the resin film by pressing means. The present invention provides a method for manufacturing a conductive composite metal plate, which comprises obtaining a conductive resin film and then laminating metal plates on both sides of the vaginal conductive resin film.
本発明方法に用いられる２枚の金属板の種類は、特に限
定されるものではなく、冷延鋼板、表面処理鋼板等いず
れでも良く、目的とする用途、分野に応じて適宜に選択
される。また、これらの２枚の金属板の種類は同一であ
っても異種のものであってもよい。金属板の板厚につい
ても特に限定されない。The types of the two metal plates used in the method of the present invention are not particularly limited, and may be cold-rolled steel plates, surface-treated steel plates, etc., and are appropriately selected depending on the intended use and field. Moreover, the types of these two metal plates may be the same or different types. The thickness of the metal plate is also not particularly limited.
前記金属板間に配置される樹脂フィルムの種類としては
、例えばポリエチレン、ポリプロピレン等が挙げられる
が、特に限定されるものではない。Examples of the type of resin film disposed between the metal plates include polyethylene, polypropylene, etc., but are not particularly limited.
また、該樹脂フィルムの厚さは５０〜７０μが好ましい
。Moreover, the thickness of the resin film is preferably 50 to 70 μm.
前記樹脂フィルムに埋設される導電性物質として使用さ
れる金属の種類としては、例えば、鉄、黄銅、ステンレ
ス鋼等が挙げられるが、特に限定されない。導電性物質
の粒径は、前記樹脂フィルムの厚さの１００〜２００％
、好ましくは１００〜１３０％である。下限を１００％
としたのは、上下２枚の金属板の導通を容易にするため
であり、上限を１３０％としたのは、接着性を損なわな
いようにするためである。Examples of the metal used as the conductive substance embedded in the resin film include iron, brass, stainless steel, etc., but are not particularly limited. The particle size of the conductive substance is 100 to 200% of the thickness of the resin film.
, preferably 100 to 130%. lower limit to 100%
The reason for this is to facilitate electrical conduction between the upper and lower two metal plates, and the reason for setting the upper limit to 130% is to prevent adhesion from being impaired.
ここで、粒径とは、導電性物質の外径を表わすものであ
る。また、かかる範囲では、得られる複合金属板を構成
する２枚の金属板間の導通作用が良好となる。導電性物
質の分散量は、前記樹脂フィルムの２．０〜３．０体積
％が好ましい。上限を３．０％としたのは、かかる範囲
では樹脂の特性が劣化しないからであり、下限を２，０
％としたのは、導電性の付与を完全にするためである。Here, the particle size represents the outer diameter of the conductive substance. Further, within this range, the conduction between the two metal plates constituting the resulting composite metal plate becomes good. The amount of the conductive substance dispersed is preferably 2.0 to 3.0% by volume of the resin film. The upper limit was set at 3.0% because the properties of the resin would not deteriorate within this range, and the lower limit was set at 2.0%.
% in order to completely impart conductivity.
導電性物質の形状は球状が好ましいが、これは得られる
複合金属板を構成する２枚の金属板への導電性物質の平
均接触率が高くなるからである。The shape of the conductive substance is preferably spherical, since this increases the average contact ratio of the conductive substance to the two metal plates constituting the resulting composite metal plate.
かかる導電性物質は軟化状態のフィルム上に分−３−′
散装置される。軟化状態のフィルムは成形されたフィル
ムを再び加熱等により軟化させてもよく、またグイ等か
ら押出された成膜中のものであってもよく、適宜の押圧
手段によって導電性物質を表面より埋設しうる軟らかさ
を有していればよい。Such conductive material is dispersed onto the film in a softened state. The softened film may be a formed film that is softened again by heating, etc., or may be a film that has been extruded from a stick or the like and is in the process of being formed, and the conductive material may be buried from the surface by appropriate pressing means. It is sufficient as long as it has enough softness.
また、本発明方法に用いられる導電性物質の供給分散法
として、振動式定量フィーダー、ロータリーフィーダー
、テーブルフィーダー、スクリ。Further, as a method for supplying and distributing the conductive substance used in the method of the present invention, a vibrating quantitative feeder, a rotary feeder, a table feeder, and a screen feeder are used.
−フィーダー等が挙げられるが、振動式定量フィーダの
装置が好適に用いられる。- Although feeders etc. can be mentioned, a vibrating quantitative feeder device is preferably used.
次に、押圧を行うが、本発明に用いられる押圧手段とし
ては、押えロール、熱プレス等が挙げられる。Next, pressing is performed, and examples of the pressing means used in the present invention include a presser roll, a hot press, and the like.
２枚の金属板の積層方法は、公知の方法がいずれも適用
できる。例えば、生産規模、用途等に応じて、熱プレス
による積層方法、熱ロールによる連続積層方法等、いず
れの方法でもよい。Any known method can be applied to the method of laminating the two metal plates. For example, any method such as a lamination method using a hot press or a continuous lamination method using a hot roll may be used depending on the production scale, application, etc.
以下、本発明の一興体例を添付図面に基づき詳細に説明
する。Hereinafter, an embodiment of the present invention will be described in detail based on the accompanying drawings.
第１図は、本発明の一興体例を示す製造工程の一５＝ 概略図である。FIG. 1 is a diagram illustrating one example of the manufacturing process of the present invention. It is a schematic diagram.
第１図に示すごとく、まず、コイル状に巻かれた樹脂フ
ィルム（１）を巻戻しながら加熱炉（２）で加熱して、
該樹脂フィルム（１）を軟化させる。加熱温度は使用す
る樹脂の種類によって異なるが、樹脂フィルム上に分散
させる導電性物質（３）が、ロール圧延前に飛散しない
程度が好ましい。なお、軟化した樹脂フィルム（１）は
加熱炉（２）内部において、ダレおよびフクレ等が発生
しゃすく、これを防止するために、フクレ上下面を駆動
式エンドレスベルト（７）で挾持しつつ進行方向に移送
する。As shown in Fig. 1, first, a resin film (1) wound into a coil is heated in a heating furnace (2) while being unwound.
The resin film (1) is softened. Although the heating temperature varies depending on the type of resin used, it is preferable that the heating temperature is such that the conductive substance (3) dispersed on the resin film does not scatter before rolling. Note that the softened resin film (1) tends to sag and blister inside the heating furnace (2), and in order to prevent this, the upper and lower surfaces of the blister are held between the driven endless belts (7) as the film progresses. transport in the direction.
次に前記の軟化した樹脂フィルム（１）上に、振動式定
量フィーダ（６）により導電性物質（３）を−定量分散
させ、引続いて押えロール（４）により該導電性物質（
３）を前記樹脂フィルム中に埋設し、冷却後、導電性樹
脂フィルム（５）としてコイル状に巻取る。なお、前記
一対の押えロール（４）のすきまは、埋設させる導電性
物質（３）の粒径と同程度にすれば良い。Next, the conductive substance (3) is quantitatively dispersed onto the softened resin film (1) using a vibrating quantitative feeder (6), and then the conductive substance (3) is dispersed using a presser roll (4).
3) is embedded in the resin film, and after cooling, it is wound up into a coil shape as a conductive resin film (5). Note that the gap between the pair of presser rolls (4) may be made to be approximately the same as the particle size of the conductive material (3) to be buried.
引続いて、前記導電性樹脂フィルム（５）の両面に金属
板を熱ロール圧接法等により積層し、最終製品としての
導電性複合金属板を得るが、該積層方法は特に限定され
るものではない。Subsequently, metal plates are laminated on both sides of the conductive resin film (5) by hot roll pressure welding or the like to obtain a conductive composite metal plate as a final product, but the lamination method is not particularly limited. do not have.
本発明の他の具体例におけるフィルムの作製法としては
、第２図に示すごとく、溶融樹脂をＴダイ（１０）によ
り樹脂フィルム（１）として押出し、］゛ダダイ出該樹
脂フィルム（１）が完全に冷却する萌に振動式定量フィ
ーダ（６）により、該樹脂フィルム−１−に導電性物質
（３）を一定量分散させ、引続いて押え〔１−ル（４）
により樹脂フィルム（１）中に埋設して導電性を樹脂フ
ィル１２に付与する方法が挙げられる。As shown in FIG. 2, a method for producing a film in another specific example of the present invention is to extrude a molten resin as a resin film (1) using a T-die (10), and then extrude the resin film (1) from a die. A fixed amount of the conductive substance (3) is dispersed in the resin film-1- by a vibrating quantitative feeder (6) while the moe is completely cooled, and then a presser [1-rule (4)
A method of imparting conductivity to the resin film 12 by embedding it in the resin film (1) can be mentioned.
火施桝 次に実施例を挙げ、本発明をさらに具体的に説明する。Hisemasu Next, the present invention will be explained in more detail with reference to Examples.
実施例１
前記第１図の装装置を用い、導電性複合金属板を製造し
た。厚さ０．０７ｍｍのポリエヂレン系樹脂フィルムを
加熱炉内で９０℃に加熱軟化後、該樹脂フィルム上に粒
径００７４〜０．１０４ｍｍの球形状鉄粉を分散させた
。なお、分散量は前記樹脂フィルムの３０体積％とした
。次に押えロールにより該鉄粉を樹脂フィルム中に埋設
させ、導電性樹脂フィルノ、を作成した後、２枚の鋼板
（板厚０．６肩ｍ）を熱ロールににす、前記導電性樹脂
フィルムに積層し、導電性複合金属板を得た。Example 1 A conductive composite metal plate was manufactured using the mounting apparatus shown in FIG. A polyethylene resin film having a thickness of 0.07 mm was heated and softened at 90° C. in a heating furnace, and then spherical iron powder having a particle size of 0074 to 0.104 mm was dispersed on the resin film. Note that the amount of dispersion was 30% by volume of the resin film. Next, the iron powder is embedded in a resin film using a presser roll to create a conductive resin film, and then two steel plates (thickness: 0.6 m) are rolled into a hot roll. This was laminated onto a film to obtain a conductive composite metal plate.
得られた複合金属板の溶接性をつぎの方法により評価し
た。第３図に示すごとく、複合金属板（８）を２枚重ね
合イつせ（重ね合わせ長さ一４０ｍｍ）、該中央部に電
極（９）を位置させてスポット溶接を行った。スポット
溶接の条件および結果を第１表に示す。The weldability of the obtained composite metal plate was evaluated by the following method. As shown in FIG. 3, two composite metal plates (8) were stacked one on top of the other (overlapping length - 40 mm), and an electrode (9) was positioned in the center to perform spot welding. Table 1 shows the spot welding conditions and results.
本発明にかかる複合金属板は、試験数ｎ−５２２に対し
、全数が溶接可能であった。All of the composite metal plates according to the present invention could be welded in the test number n-522.
発明（２）偕米
以上の結果から、２枚の金属板間に、予め導電性物質を
埋設した樹脂フィルムを配置させることにより、スポッ
ト溶接性に優れた導電性複合金属板を安価に製造するこ
とが可能となった。Invention (2) Based on the above results, a conductive composite metal plate with excellent spot weldability is produced at a low cost by arranging a resin film in which a conductive substance is embedded in advance between two metal plates. It became possible.
第１図および第２図は、本発明方法の一具体例を示す概
略図、第３図は、複合金属板のスポット溶接方法を示す
概略図である。
図面中の主な符号は次の通りである。
ｌ・・・樹脂フィルム、２・・・加熱炉、３・・・導電
性物質、４・押えロール、８−複合金属板。1 and 2 are schematic diagrams showing a specific example of the method of the present invention, and FIG. 3 is a schematic diagram showing a method for spot welding composite metal plates. The main symbols in the drawings are as follows. 1-Resin film, 2-Heating furnace, 3-Electroconductive material, 4-Press roll, 8-Composite metal plate.
Claims (1)
フィルムからなる複合金属板の製造方法において、軟化
状態の樹脂フィルム上に該樹脂フィルム厚の１００〜１
３０％の粒径を有する導電性物質を分散、配置し、さら
に押圧手段により該導電性物質を樹脂フィルム中に埋設
させて導電性樹脂フィルムを得、その後該導電性樹脂フ
ィルムの両面に金属板を積層することを特徴とする導電
性複合金属板の製造方法。(1) In a method for manufacturing a composite metal plate consisting of two metal plates and a resin film disposed between the metal plates, a resin film of 100 to 1
A conductive substance having a particle size of 30% is dispersed and arranged, and the conductive substance is further embedded in the resin film by a pressing means to obtain a conductive resin film, and then metal plates are placed on both sides of the conductive resin film. A method for producing a conductive composite metal plate, characterized by laminating the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61227539A JPS6381030A (en) | 1986-09-25 | 1986-09-25 | Manufacture of electrically-conductive composite metallic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61227539A JPS6381030A (en) | 1986-09-25 | 1986-09-25 | Manufacture of electrically-conductive composite metallic plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6381030A true JPS6381030A (en) | 1988-04-11 |
| JPH0568342B2 JPH0568342B2 (en) | 1993-09-28 |
Family
ID=16862485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61227539A Granted JPS6381030A (en) | 1986-09-25 | 1986-09-25 | Manufacture of electrically-conductive composite metallic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6381030A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145142A (en) * | 1983-02-09 | 1984-08-20 | 住友金属工業株式会社 | Weldable laminated board |
-
1986
- 1986-09-25 JP JP61227539A patent/JPS6381030A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145142A (en) * | 1983-02-09 | 1984-08-20 | 住友金属工業株式会社 | Weldable laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0568342B2 (en) | 1993-09-28 |
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