JPH05138811A - Manufacture of laminated metal sheet excellent in spot-weldability - Google Patents

Manufacture of laminated metal sheet excellent in spot-weldability

Info

Publication number
JPH05138811A
JPH05138811A JP3310517A JP31051791A JPH05138811A JP H05138811 A JPH05138811 A JP H05138811A JP 3310517 A JP3310517 A JP 3310517A JP 31051791 A JP31051791 A JP 31051791A JP H05138811 A JPH05138811 A JP H05138811A
Authority
JP
Japan
Prior art keywords
resin
metal plate
metal powder
conductive metal
laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3310517A
Other languages
Japanese (ja)
Inventor
Seishi Uei
清史 上井
Yukichi Watanabe
裕吉 渡辺
Akihiko Nishimoto
昭彦 西本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Engineering Corp
Original Assignee
NKK Corp
Nippon Kokan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NKK Corp, Nippon Kokan Ltd filed Critical NKK Corp
Priority to JP3310517A priority Critical patent/JPH05138811A/en
Publication of JPH05138811A publication Critical patent/JPH05138811A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide the method for manufacturing laminated metal sheet, in the resin layer of which electrically conductive metal powder is dispersed easily, uniformly and stably. CONSTITUTION:Electrically conductive metal powder, the hardness of which is more than or equal to that of metal sheets 4 and 7 is kneaded in advance with an extruder 1 and a die 2 in viscoelastic resin so as to produce resin layer, in which the particle diameter D of the electrically conductive powder in the resin is set to be D<=2.0T to the coating thickness T of the resin, which contains 3-30wt.% of the electrically conductive metal powder with particle diameter satisfying the relationship of 1.0T<=D<=2.0T among the electrically conductive metal powder to the total amount of the resin is applied onto one side of the metal sheet. Next, with pressure rollers 8 and 9, the coated metal sheet and the other metal sheet are bonded together so as to obtain laminated sheet in order to produce tire laminated metal sheet excellent in spot-weldability.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、スポット溶接性に優れ
た積層金属板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a laminated metal sheet having excellent spot weldability.

【0002】[0002]

【従来の技術】2枚の金属板の間に高分子樹脂をサンド
イッチした積層金属板は、制振性、軽量性に優れるため
騒音防止、振動防止、軽量化などを目的とし、自動車、
家電機器、建築材料などに多用されている。しかしなが
ら、積層金属板の芯材である高分子樹脂は、絶縁材料で
あるため導電性がなく、そのままでは直接通電によるス
ポット溶接を行うことができない。そのため、高分子樹
脂に金属粉を充填する方法(特開平2−48942号、
特開平2−86432号、特開平1−280544号、
特開昭62−234917号)、グラファイトを充填す
る方法(特公昭61−49112号)、らせん状の導電
体を充填する方法(特公昭61−29261号)、溝付
磁性ロールにより金属繊維を散布する方法(特開昭63
−72548号)、金属板に異形模様をつける方法(特
開昭59−145142号)、また金属板の表面の粗さ
を樹脂層よりも粗くする方法(特開昭62−22774
1号)などの公報により、金属板間の導電性を確保し、
直接通電によるスポット溶接を可能にする種々の方法が
提案されている。
2. Description of the Related Art A laminated metal plate in which a polymer resin is sandwiched between two metal plates has excellent vibration damping properties and light weight properties, and is intended for noise prevention, vibration prevention, weight reduction, etc.
It is widely used in home appliances and building materials. However, since the polymer resin, which is the core material of the laminated metal plate, is an insulating material, it has no electrical conductivity, and as it is, spot welding cannot be performed by direct energization. Therefore, a method of filling a metal powder in a polymer resin (Japanese Patent Laid-Open No. 2-48942)
JP-A-2-86432, JP-A-1-280544,
Japanese Unexamined Patent Publication (Kokai) No. 62-234917), graphite filling method (Japanese Patent Publication No. 61-49112), spiral electric conductor filling method (Japanese Patent Publication No. 61-29261), and metal fibers dispersed by a grooved magnetic roll. Method (JP-A-63
No. 72548), a method of forming a deformed pattern on a metal plate (JP-A-59-145142), and a method of making the surface of the metal plate rougher than the resin layer (JP-A-62-22774).
No. 1) and other publications ensure electrical conductivity between metal plates,
Various methods have been proposed that enable spot welding by direct energization.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上記従
来の提案方法において、金属粉を自然落下を利用して樹
脂に散布する方法(特開平2−48942号)、噴射式
ノズルにより導電性充填材を混入した液状樹脂を金属板
表面に積層する方法(特開昭62−234917号)、
溝付磁性ロールにより金属繊維を散布する方法(特開昭
63−72547号)および、らせん状の導電体を充填
する方法(特公昭61−29261号)などの公報で
は、金属粉または金属繊維等の導電体を幅、長手方向に
わたって樹脂中に均一に散布することは難しく、得られ
る積層金属板の部位によって導電性が悪化するなど安定
したスポット溶接性を確保することはできない。
However, in the above-mentioned conventional proposal method, a method of spraying a metal powder on a resin by utilizing a natural drop (Japanese Patent Laid-Open No. 2-48942) and a conductive filler by a jet nozzle are used. A method of laminating the mixed liquid resin on the surface of the metal plate (Japanese Patent Laid-Open No. 234917/1987).
In the publications such as a method of spraying metal fibers with a grooved magnetic roll (Japanese Patent Laid-Open No. 63-72547) and a method of filling a spiral conductor (Japanese Patent Publication No. 61-29261), metal powder or metal fibers are used. It is difficult to uniformly disperse the conductor in the resin over the width and the longitudinal direction, and it is impossible to secure stable spot weldability such that the conductivity is deteriorated depending on the site of the obtained laminated metal plate.

【0004】また、グラファイトを充填した場合(特公
昭61−49112号公報)では、下金属板と上金属板
とを貼合わせる際の加圧によりグラファイトが粉砕し、
十分な導電性が得られない。また、金属板に異形模様を
つける方法(特開昭59−145142号公報)では、
製造以前に鋼板の加工が必要であり、製品である積層鋼
板の表面に模様が出る。しかも、上下金属板間の接触状
態を幅、長手方向で均一にすることは難しく、得られる
積層鋼板の部位によって導電性が悪化する。
When graphite is filled (Japanese Patent Publication No. 61-49112), the graphite is crushed by the pressure applied when the lower metal plate and the upper metal plate are bonded together,
Sufficient conductivity cannot be obtained. Further, in a method of forming a deformed pattern on a metal plate (Japanese Patent Laid-Open No. 59-145142),
It is necessary to process the steel plate before manufacturing, and a pattern appears on the surface of the laminated steel plate that is the product. Moreover, it is difficult to make the contact state between the upper and lower metal plates uniform in the width direction and the longitudinal direction, and the conductivity deteriorates depending on the site of the obtained laminated steel plate.

【0005】また、金属板の表面の粗さを樹脂層よりも
粗くする方法(特開昭62−227741号公報)にお
いても同様に、上下金属板間の接触状態を幅、長手方向
で均一にすることは難しく、得られる積層金属板の部位
によって導電性が悪化するなど安定したスポット溶接性
を確保することはできない。本発明の目的は、容易に、
均一に、安定的に導電性金属粉を樹脂層に分散せしめて
積層金属板を製造する方法およびその積層金属板を提供
することにある。
Also, in the method of making the surface of the metal plate rougher than the resin layer (Japanese Patent Laid-Open No. 62-227741), the contact state between the upper and lower metal plates is made uniform in the width and longitudinal directions. It is difficult to do so, and it is impossible to secure stable spot weldability such as deterioration of conductivity due to the site of the obtained laminated metal plate. The object of the present invention is to
It is intended to provide a method for manufacturing a laminated metal plate by uniformly and stably dispersing conductive metal powder in a resin layer, and the laminated metal plate.

【0006】[0006]

【課題を解決するための手段】本発明者らは、上記課題
を解決するために種々検討を重ねた結果、次のような発
明を完成するに至った。即ち、本発明は、2枚の金属板
の間に粘弾性樹脂を挟装してなる積層金属板の製造方法
において、予め導電性金属粉を押出し機により粘弾性樹
脂中に混練りし、次いで該押出し機先端に取付けたダイ
スにより前記混練り粘弾性樹脂を金属板の片面に塗工
し、次いで、圧着ロ−ルにより、前記塗工金属板ともう
一方の金属板を圧着し、加熱処理し積層金属板とするこ
とを特徴とするスポット溶接性に優れた積層金属板の製
造方法であり、前記粘弾性樹脂に混入する導電性金属粉
の粒径(D)が塗工樹脂厚(T)に対し、D≦2.0T
であり、かつ該導電性金属粉のうち1.0T≦D≦2.
0Tである粒径の導電性金属粉が、該樹脂の全量中に3
〜30重量%含有することを特徴とし、さらに、導電性
金属粉粒子の硬度が、金属板と同等以下であることを特
徴とする積層金属板の製造方法である。
Means for Solving the Problems The inventors of the present invention have made various studies to solve the above problems, and as a result, have completed the following invention. That is, the present invention is a method for producing a laminated metal plate in which a viscoelastic resin is sandwiched between two metal plates, in which a conductive metal powder is previously kneaded into the viscoelastic resin by an extruder, and then the extruded product is extruded. The kneaded viscoelastic resin is coated on one side of a metal plate with a die attached to the machine tip, and then the coated metal plate and the other metal plate are pressure-bonded with a pressure roll, heat-treated and laminated. A method for producing a laminated metal plate having excellent spot weldability, which is characterized by using a metal plate, wherein the particle diameter (D) of the conductive metal powder mixed in the viscoelastic resin is equal to the coating resin thickness (T). On the other hand, D ≦ 2.0T
And 1.0T ≦ D ≦ 2.
The conductive metal powder having a particle size of 0T is 3% in the total amount of the resin.
The hardness of the conductive metal powder particles is equal to or less than that of the metal plate.

【0007】[0007]

【作用】本発明者らは、種々検討の結果、予め導電性金
属粉を押出し機により粘弾性樹脂中に混練りした後、塗
工することにより容易に、均一に、安定的に所望の量の
導電性金属粉を樹脂層に分散させることが可能となり、
かかる方法を用いれば、導電性金属粉を均一に分散せし
めた樹脂層を有する積層金属板を得ることができること
を見知した。
As a result of various studies, the inventors of the present invention knead the conductive metal powder in the viscoelastic resin in advance with an extruder and then apply the mixture to easily, uniformly and stably obtain a desired amount. It becomes possible to disperse the conductive metal powder in the resin layer,
It has been found that a laminated metal plate having a resin layer in which a conductive metal powder is uniformly dispersed can be obtained by using such a method.

【0008】本発明は、前述の如く、予め粘弾性樹脂中
に金属板の硬度と同等以下の導電性金属粉を押出し機を
用いて混練りし、均一に塗工するに当り、粘弾性樹脂中
の導電性金属粉の粒径(D)が、圧着後の樹脂厚(T)
に対し、D≦2.0Tであり、かつ該導電性金属粉のう
ち1.0T≦D≦2.0Tである粒径の導電性金属粉が
該粘弾性樹脂の全量中に3〜30重量%含有している樹
脂を、押出し機先端に取付けたダイスを用いて、所定量
の該混練り粘弾性樹脂を連続的に下金属板に塗工し、上
金属板を圧着する際、この樹脂を上下金属板間に挾み、
幅方向に樹脂厚みが均一になるように圧着ロ−ルを用い
て圧下し、樹脂厚(T)まで押し潰し、所望の接触面積
を得た後、加熱することを特徴とするスポット溶接性に
優れた積層金属板の製造方法である。
According to the present invention, as described above, the viscoelastic resin is used when the conductive metal powder having a hardness equal to or less than the hardness of the metal plate is kneaded in the viscoelastic resin in advance by using an extruder to uniformly coat the viscoelastic resin. The particle diameter (D) of the conductive metal powder inside is the resin thickness (T) after pressure bonding
On the other hand, the conductive metal powder having a particle diameter of D ≦ 2.0T and 1.0T ≦ D ≦ 2.0T of the conductive metal powder is 3 to 30 weight% in the total amount of the viscoelastic resin. % Of the resin, using a die attached to the end of the extruder, a predetermined amount of the kneaded viscoelastic resin is continuously applied to the lower metal plate, and when the upper metal plate is pressure-bonded, this resin Between the upper and lower metal plates,
The spot weldability is characterized in that the resin is pressed down using a pressure-bonding roll so that the resin thickness becomes uniform in the width direction, crushed to the resin thickness (T), a desired contact area is obtained, and then heated. It is an excellent method for producing a laminated metal plate.

【0009】本発明において用いる製造装置としては、 粘弾性樹脂と導電性金属粉とを確実に混練りし、かつ
樹脂を前方に送り出すことが可能な押出し装置と、 混練りされた粘弾性樹脂を金属板に塗工するための押
出し装置先端に取付けたダイス(ストランド・ダイス等
形状は特に限定しない)と、 金属板上に設けられた塗工樹脂上部にもう一方の金属
板を圧着し、かつ塗工樹脂を幅方向均一に押し広げるた
めの圧着装置と、 圧着された積層鋼板を加熱するための加熱装置と、 からなるものである。ここで、先ず、予め粘弾性樹脂中
に金属板の硬度と同等以下の導電性金属粉を混練りする
に当って用いられる押出し機は、確実に混練りし、かつ
樹脂を前方に送り出すことが可能なため、好ましいもの
である。
As the manufacturing apparatus used in the present invention, an extruding device capable of surely kneading the viscoelastic resin and the conductive metal powder and sending the resin forward, and a kneaded viscoelastic resin A die attached to the tip of an extrusion device for coating a metal plate (the shape of the strand, die, etc. is not particularly limited), and another metal plate is pressure-bonded to the upper part of the coating resin provided on the metal plate, and It comprises a pressure bonding device for uniformly spreading the coating resin in the width direction, and a heating device for heating the pressure-bonded laminated steel sheets. Here, first, an extruder used for previously kneading a conductive metal powder having a hardness equal to or less than the hardness of a metal plate into a viscoelastic resin is surely kneaded, and the resin can be sent forward. This is preferable because it is possible.

【0010】さらに、導電性金属粉の粒径範囲をD≦
2.0Tに限定した理由は、後述する実施例により得ら
れた知見によるものであり、まずD≦1.0Tでは樹脂
層中に導電性金属粉が埋没し、十分な導電性が得られな
い。また、D≧2.0Tでは十分な導電性が得られるも
のの積層金属板として必要な制振性能及び密着力が低下
するからである。このことから、前述のように、特に
1.0T≦D≦2.0Tの導電性金属粉の含有量につい
て、限定した。即ち、3重量%未満では、その効果が不
十分であり、30重量%を超えると、溶接性は良好であ
るが、密着力が低下し、かつ添加導電性金属粉コストが
過大となるので、上記の粒径を持つ導電性金属粉が3〜
30重量%含有されていることが必要となる。
Further, the particle size range of the conductive metal powder is D ≦
The reason for limiting to 2.0T is based on the knowledge obtained in the examples described later. First, when D ≦ 1.0T, the conductive metal powder is buried in the resin layer, and sufficient conductivity cannot be obtained. .. Also, if D ≧ 2.0T, sufficient conductivity can be obtained, but the vibration damping performance and adhesion required as a laminated metal plate are reduced. From this, as described above, the content of the conductive metal powder of 1.0T ≦ D ≦ 2.0T is limited. That is, if the amount is less than 3% by weight, the effect is insufficient, and if it exceeds 30% by weight, the weldability is good, but the adhesive force is reduced, and the cost of the added conductive metal powder becomes excessive. Conductive metal powder with the above particle size is 3 ~
It is necessary to contain 30% by weight.

【0011】また、この場合の導電性金属粉の硬度は、
金属板の硬度より柔らかいものを使用する。これは、導
電性金属粉の硬度が、金属板の硬度より硬い場合、2枚
の金属板を圧着した際に、金属板表面に押し傷が生じ、
外観が悪化するためである。本発明において、上記金属
板としては、冷延鋼板をはじめとして、溶融亜鉛メッキ
鋼板、電気亜鉛メッキ鋼板、2層メッキ鋼板、ステンレ
ス鋼板、アルミニウム板、チタン板などほとんどの金属
板を挙げることができ、板厚は特に限定しない。また、
本発明において、金属板の硬度と同等以下の導電性金属
粉としては、Ni粉が好ましいが鉄、銅、チタンなどの
金属粒子も挙げることができる。金属板を鋼板とした場
合、Ni粉は鋼板とほぼ同等の溶融温度および沸騰温度
を有し、しかも硬度についても熱処理により、鋼板と同
等以下の硬度(Hvで80〜180)を得ることがで
き、導電性金属粉としてNi粉は非常に好ましい。
The hardness of the conductive metal powder in this case is
Use one that is softer than the hardness of the metal plate. This is because when the hardness of the conductive metal powder is higher than the hardness of the metal plate, when the two metal plates are pressure-bonded, the surface of the metal plate is pressed and scratched.
This is because the appearance deteriorates. In the present invention, examples of the metal plate include cold-rolled steel plates, hot-dip galvanized steel plates, electrogalvanized steel plates, two-layer plated steel plates, stainless steel plates, aluminum plates, titanium plates, and most other metal plates. The plate thickness is not particularly limited. Also,
In the present invention, as the conductive metal powder having a hardness equal to or less than the hardness of the metal plate, Ni powder is preferable, but metal particles such as iron, copper and titanium can also be mentioned. When the metal plate is a steel plate, the Ni powder has a melting temperature and a boiling temperature almost equal to those of the steel plate, and the hardness of the Ni powder can be equal to or less than that of the steel plate (80 to 180 in Hv) by heat treatment. Ni powder is very preferable as the conductive metal powder.

【0012】[0012]

【実施例】以下に本発明の実施例を添付図面を参照しな
がら説明する。図1は、本発明にかかる積層金属板の製
造装置の一実施態様例の模式図である。図において、1
は押出し機{(株)笠松化工製ニ−ダ−・ル−ダ−,能
力(ニ−ダ−・ケ−ス容量50L)}、2は押出し機1
の先端に取付けたダイス(ストランド・ダイス)、3は
導電性金属粉を混練りした樹脂、4は下金属板、5は塗
工樹脂層、6は膜厚計、7は上金属板、8及び9は圧着
ロ−ル、10は積層金属板、11及びは12加熱炉(熱
風式循環炉)、13は導電性金属粉(Ni粉)である。
Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a schematic view of an example of one embodiment of a laminated metal plate manufacturing apparatus according to the present invention. In the figure, 1
Is an extruder {kneader / ruder manufactured by Kasamatsu Kako Co., Ltd., capacity (kneader / case capacity 50 L)}, 2 is an extruder 1
Dies (strand dies) attached to the tip of the, 3 is a resin in which conductive metal powder is kneaded, 4 is a lower metal plate, 5 is a coating resin layer, 6 is a film thickness meter, 7 is an upper metal plate, 8 Reference numerals 9 and 9 are pressure-bonded rolls, 10 is a laminated metal plate, 11 and 12 are heating furnaces (hot air circulation furnace), and 13 is conductive metal powder (Ni powder).

【0013】まず、塗工に先立ち押出し機(ニ−ダ・ル
−ダ)1を用いて、熱硬化型アクリル系の粘弾性樹脂中
に所望の量.粒径の導電性金属粉13を予め樹脂中に十
分に分散、充填する。この場合の粘弾性樹脂3の粘性度
としては、30℃,せん断速度103 sec -1で、100 poise
以上のものを使用する。また導電性金属粉13の硬度
は、金属板4及び7の硬度より柔らかいものを使用す
る。本実施例においては、硬度(Hv)は、 導電性金属粉13…Hv90,金属板4及び7…Hv1
10である。
First, prior to coating, an extruder (kneader, ruder) 1 was used to coat a desired amount of the thermosetting acrylic viscoelastic resin. The conductive metal powder 13 having a particle size is sufficiently dispersed and filled in the resin in advance. In this case, the viscoelastic resin 3 has a viscosity of 100 poise at 30 ° C. and a shear rate of 10 3 sec −1.
Use the above. The hardness of the conductive metal powder 13 is softer than the hardness of the metal plates 4 and 7. In this embodiment, the hardness (Hv) is as follows: conductive metal powder 13 ... Hv90, metal plates 4 and 7 ... Hv1
It is 10.

【0014】次に、上記導電性金属粉13を混練りした
粘弾性樹脂3をニ−ダ・ル−ダ1の先端に取付けたダイ
ス(ストランド・ダイス)2により、下金属板4上に所
定の樹脂厚さ(T)になるだけの量を幅方向均一に連続
的に塗工する。このようにして下金属板4上に均一な導
電性が付与された塗工樹脂層5が設けられる。塗工樹脂
層5は、膜厚計6により幅方向の樹脂層の塗工厚が測定
され、幅方向一定の所望される塗工厚となるように制御
される。次に、他のもう1枚の上金属板7を圧着する。
樹脂層5上に圧着される上金属板7は樹脂層5が設けら
れた下金属板4とともに圧着ロ−ル8,9に送られ圧着
され、図2に示すような積層金属板10となる。
Next, a viscoelastic resin 3 obtained by kneading the conductive metal powder 13 is fixed on the lower metal plate 4 by a die (strand die) 2 attached to the tip of the kneader ruder 1. The resin thickness (T) is continuously applied uniformly in the width direction. In this way, the coating resin layer 5 having uniform conductivity is provided on the lower metal plate 4. The coating thickness of the resin layer in the width direction of the coating resin layer 5 is measured by the film thickness meter 6, and the coating thickness is controlled to be a desired coating thickness which is constant in the width direction. Next, another upper metal plate 7 is pressure-bonded.
The upper metal plate 7 to be pressure-bonded on the resin layer 5 is sent to the pressure rolls 8 and 9 together with the lower metal plate 4 provided with the resin layer 5 and pressure-bonded to form a laminated metal plate 10 as shown in FIG. ..

【0015】ここで図2は本発明方法により製造した積
層金属板の模式断面図であり、図示するように導電性金
属粉13が、塗工樹脂層5から突出するばかりの状態と
なり、導電性金属粉13を圧下した状態が可能となり、
圧着ロ−ル8,9により、塗工厚(T)まで押し潰し、
所望の接触面積を得ることが出来る。この際の圧着ロ−
ル8,9の圧着力は、塗工された樹脂を幅方向均一に押
し広げ、かつ樹脂中に混入した導電性金属粉13を塗工
厚さまで押し潰す力を有することが必要である。また、
圧着ロ−ル8,9の材質については、必要な圧着力が幅
方向で均一に得られるものであれば特に限定する必要は
ない。このようにしてできた積層金属板10は、加熱炉
11,12に送られ塗工樹脂層5が十分に架橋するまで
加熱され、スポット溶接可能な積層金属板製品となる。
FIG. 2 is a schematic cross-sectional view of a laminated metal plate manufactured by the method of the present invention. As shown in the drawing, the conductive metal powder 13 is just projected from the coating resin layer 5 and the conductivity is reduced. It becomes possible to reduce the metal powder 13
Crush to the coating thickness (T) with pressure rolls 8 and 9,
A desired contact area can be obtained. Crimping roll at this time
It is necessary that the pressing force of the rollers 8 and 9 has a force to uniformly spread the coated resin in the width direction and to crush the conductive metal powder 13 mixed in the resin to the coating thickness. Also,
The material of the crimping rolls 8 and 9 is not particularly limited as long as the required crimping force can be uniformly obtained in the width direction. The laminated metal plate 10 thus formed is sent to the heating furnaces 11 and 12 and heated until the coating resin layer 5 is sufficiently crosslinked, and becomes a laminated metal plate product capable of spot welding.

【0016】この場合の上記上下金属板4,7として本
実施例では、冷延鋼板を使用したがこれ以外の溶融亜鉛
メッキ鋼板、電気亜鉛メッキ鋼板、2層メッキ鋼板、ス
テンレス鋼板、アルミニウム板、チタン板などほとんど
の金属板を使用することが出来、その厚は特に限定しな
い。また、金属板の硬度と同等以下の導電性金属粉とし
ては、Ni粉が好ましいが鉄、銅、チタンなどの金属粒
子も挙げることができる。金属板を鋼板とした場合、N
i粉は鋼板とほぼ同等の溶融温度および沸騰温度を有
し、しかも硬度についても熱処理により、鋼板と同等以
下の硬度(Hvで80〜180)を得ることができ、導
電性金属粉としては非常に好ましい。
In this embodiment, cold-rolled steel plates are used as the upper and lower metal plates 4 and 7 in this case, but other hot-dip galvanized steel plates, electrogalvanized steel plates, two-layer plated steel plates, stainless steel plates, aluminum plates, Most metal plates such as titanium plate can be used, and the thickness thereof is not particularly limited. Further, as the conductive metal powder having a hardness equal to or less than the hardness of the metal plate, Ni powder is preferable, but metal particles such as iron, copper and titanium can also be mentioned. When the metal plate is a steel plate, N
The i powder has a melting temperature and a boiling temperature almost equal to those of the steel sheet, and the hardness of the i powder can be less than or equal to that of the steel sheet (80 to 180 in Hv) by heat treatment. Is preferred.

【0017】以下に本発明の実施例を具体的に説明す
る。熱硬化型アクリル系の樹脂(30℃,せん断速度103
sec -1で、500 〜800 poise )に種々の粒径、添加量の
導電性金属粉13を充填させ、図1に示す装置により、
下鋼板4の厚さ0.4mm、材質冷延鋼板に塗工し、上金
属板7を圧着し積層鋼板とした。表1に本発明方法にお
ける実施例の実験条件と結果を示す。また、比較材の実
験条件と結果を表2に示す。
Examples of the present invention will be specifically described below. Thermosetting acrylic resin (30 ℃, shear rate 10 3
In sec -1 , 500 to 800 poise) is filled with various kinds of particle size and the amount of conductive metal powder 13 added, and the apparatus shown in FIG.
A lower steel plate 4 having a thickness of 0.4 mm was coated on a cold-rolled steel plate, and the upper metal plate 7 was pressure-bonded to obtain a laminated steel plate. Table 1 shows the experimental conditions and results of the examples in the method of the present invention. Table 2 shows the experimental conditions and results of the comparative material.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 [Table 2]

【0020】なお溶接試験は、サンプルサイズ30mm×10
0 mm、加圧力 200kgf 、電流10.5kA、通電時間12サイク
ル、スクイズタイム35サイクル、電極チップD型、元径
16mm、先端直径6mmにて行った。積層鋼板と単板(積層
鋼板と同材質、同厚さ)を2枚合わせて50本溶接し、正
常に溶接できたものの全体に対する百分率で溶接性を評
価した。表1および表2から明らかなように本発明の実
施例の場合、導電性金属粉の粒径をDとし、樹脂厚をT
とすると、1.0T≦D≦2.0Tなる範囲にあり、か
つ導電性金属粉の添加量が3〜30重量%の範囲で安定
して溶接でき、しかも良好な密着力を有することがわか
る。
The welding test was conducted with a sample size of 30 mm × 10.
0 mm, pressure 200 kgf, current 10.5 kA, energizing time 12 cycles, squeeze time 35 cycles, electrode tip D type, original diameter
16 mm, tip diameter 6 mm. Fifty pieces of laminated steel plates and veneers (same material and thickness as laminated steel plates) were combined and welded normally, and the weldability was evaluated by the percentage of those that could be welded normally. As is clear from Table 1 and Table 2, in the case of the examples of the present invention, the particle diameter of the conductive metal powder is D, and the resin thickness is T.
Then, it can be seen that 1.0T ≦ D ≦ 2.0T, and that the amount of the conductive metal powder added is 3 to 30% by weight, stable welding can be performed, and that good adhesion is obtained. ..

【0021】[0021]

【発明の効果】本発明により、スポット溶接可能な積層
金属板の製造方法において、導電性金属粉を押出し機及
びダイスを用いることにより樹脂層中に均一に分散せし
めることが可能となり、かかる積層金属板の安定な製造
が可能となった。さらに、予め樹脂中に金属板の硬度と
同等以下の導電性金属粉を押出し機及びダイスを用いて
混練りし、均一に充填し、かつ樹脂中の導電性金属粉の
粒径を塗工樹脂厚(T)に対し特定し、かつ導電性金属
粉量を特定し、圧着ロ−ルを用いて圧着することによ
り、容易に、均一に、安定的に導電性金属粉を樹脂層に
分散せしめた積層金属板の製造方法が得られる。
EFFECTS OF THE INVENTION According to the present invention, in a method for producing a laminated metal plate capable of spot welding, it becomes possible to uniformly disperse conductive metal powder in a resin layer by using an extruder and a die. It became possible to manufacture a stable plate. Further, a conductive metal powder having a hardness equal to or less than the hardness of the metal plate is previously kneaded in the resin using an extruder and a die, and uniformly filled, and the particle size of the conductive metal powder in the resin is applied to the coating resin. Disperse the conductive metal powder in the resin layer easily, uniformly and stably by specifying the thickness (T) and specifying the amount of the conductive metal powder and press-bonding using the press-roll. A method of manufacturing a laminated metal plate is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明にかかる積層金属板の製造装置の模式
図、
FIG. 1 is a schematic view of an apparatus for manufacturing a laminated metal plate according to the present invention,

【図2】本発明方法により製造した積層金属板の模式断
面図。
FIG. 2 is a schematic cross-sectional view of a laminated metal plate manufactured by the method of the present invention.

【符号の説明】[Explanation of symbols]

1 押出し機(ニ−ダ−・ル−ダ−)、 2 ダイス(ストランド・ダイス)、 3 導電性金属粉を混練りした樹脂、 4 金属板、 5 塗工樹脂層 6 膜厚計 7 金属板、 8 圧着ロ−ル、 9 圧着ロ−ル、 10 積層金属板、 11 加熱炉、 12 加熱炉、 13 導電性金属粉。 DESCRIPTION OF SYMBOLS 1 Extruder (kneader, ruder), 2 dies (strand dies), 3 resin mixed with conductive metal powder, 4 metal plate, 5 coating resin layer 6 film thickness meter 7 metal plate , 8 crimp rolls, 9 crimp rolls, 10 laminated metal plates, 11 heating furnaces, 12 heating furnaces, 13 conductive metal powders.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B32B 31/06 7141−4F ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location B32B 31/06 7141-4F

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 2枚の金属板の間に粘弾性樹脂を挟装し
てなる積層金属板の製造方法において、 予め導電性金属粉を押出し機により粘弾性樹脂中に混練
りし、次いで該押出し機先端に取付けたダイスにより、
前記混練り粘弾性樹脂を金属板の片面に塗工し、次い
で、圧着ロ−ルにより、前記塗工金属板ともう一方の金
属板を圧着し、積層金属板とすることを特徴とするスポ
ット溶接性に優れた積層金属板の製造方法。
1. A method for producing a laminated metal plate comprising a viscoelastic resin sandwiched between two metal plates, wherein conductive metal powder is previously kneaded into the viscoelastic resin by an extruder and then the extruder is used. With the die attached to the tip,
A spot characterized in that the kneaded viscoelastic resin is applied to one side of a metal plate, and then the coated metal plate and the other metal plate are pressure bonded by a pressure roll to form a laminated metal plate. A method for manufacturing a laminated metal sheet having excellent weldability.
【請求項2】 前記粘弾性樹脂に混入する導電性金属粉
の粒径(D)が塗工樹脂厚(T)に対し、D≦2.0T
であり、かつ該導電性金属粉のうち1.0T≦D≦2.
0Tである粒径の導電性金属粉が、該樹脂の全量中に3
〜30重量%含有することを特徴とする請求項1記載の
スポット溶接性に優れた積層金属板の製造方法。
2. The particle diameter (D) of the conductive metal powder mixed in the viscoelastic resin is D ≦ 2.0T with respect to the coating resin thickness (T).
And 1.0T ≦ D ≦ 2.
The conductive metal powder having a particle size of 0T is 3% in the total amount of the resin.
The method for producing a laminated metal sheet having excellent spot weldability according to claim 1, wherein the content is from about 30% by weight.
【請求項3】 前記導電性金属粉粒子の硬度が、金属板
と同等以下であることを特徴とする請求項1または2記
載のスポット溶接性に優れた積層金属板の製造方法。
3. The method for producing a laminated metal plate having excellent spot weldability according to claim 1, wherein the hardness of the conductive metal powder particles is equal to or lower than that of the metal plate.
JP3310517A 1991-11-26 1991-11-26 Manufacture of laminated metal sheet excellent in spot-weldability Pending JPH05138811A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3310517A JPH05138811A (en) 1991-11-26 1991-11-26 Manufacture of laminated metal sheet excellent in spot-weldability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3310517A JPH05138811A (en) 1991-11-26 1991-11-26 Manufacture of laminated metal sheet excellent in spot-weldability

Publications (1)

Publication Number Publication Date
JPH05138811A true JPH05138811A (en) 1993-06-08

Family

ID=18006186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3310517A Pending JPH05138811A (en) 1991-11-26 1991-11-26 Manufacture of laminated metal sheet excellent in spot-weldability

Country Status (1)

Country Link
JP (1) JPH05138811A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6374634A (en) * 1986-09-19 1988-04-05 新日鐵化学株式会社 Spot weldable composite type vibration-damping material
JPS6447534A (en) * 1987-08-18 1989-02-22 Kobe Steel Ltd Production of conductive composite steel plate
JPH0286432A (en) * 1988-09-22 1990-03-27 Kawasaki Steel Corp Manufacture of composite steel plate having excellent resistance welding property

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6374634A (en) * 1986-09-19 1988-04-05 新日鐵化学株式会社 Spot weldable composite type vibration-damping material
JPS6447534A (en) * 1987-08-18 1989-02-22 Kobe Steel Ltd Production of conductive composite steel plate
JPH0286432A (en) * 1988-09-22 1990-03-27 Kawasaki Steel Corp Manufacture of composite steel plate having excellent resistance welding property

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