JPS6377732A - Molding method for multilayer printed substrate - Google Patents
Molding method for multilayer printed substrateInfo
- Publication number
- JPS6377732A JPS6377732A JP61221825A JP22182586A JPS6377732A JP S6377732 A JPS6377732 A JP S6377732A JP 61221825 A JP61221825 A JP 61221825A JP 22182586 A JP22182586 A JP 22182586A JP S6377732 A JPS6377732 A JP S6377732A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- pressure
- adhesive
- inner periphery
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000465 moulding Methods 0.000 title description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 3
- 239000011800 void material Substances 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野」 本発明は、多層プリント板に係り、特に多層ブ。[Detailed description of the invention] (Industrial application field) The present invention relates to a multilayer printed board, and particularly to a multilayer printed board.
リント板を消滅させることのできる成形方法およ６び装
置に関する。The present invention relates to a molding method and device that can eliminate lint plates.
従来のボイドレス成形方法は、特開昭５７−１１８６９
８号公報に記載のように、低圧密封室内で接着している
。しかし、４ｓ造土、低圧度（真空度）に限。The conventional voidless molding method is disclosed in Japanese Patent Application Laid-open No. 57-11869.
As described in Publication No. 8, they are bonded in a low-pressure sealed chamber. However, it is limited to 4S earthwork and low pressure (vacuum).
界がある事と、積層体内の真空度を安定して保持。There is a field and the degree of vacuum inside the laminate is maintained stably.
する事ができないために、接着剤材料の接着性１のばら
つきに対して、ボイドの発生を完全に抑止。Because it is impossible to do so, it completely suppresses the occurrence of voids due to variations in the adhesive properties of adhesive materials.
する事が困難であった。これらに対して、積層体゛をバ
ックに入れ、高圧タンクに挿入し、ガスを用゛いて加圧
、加熱する方法もあるが、高圧タンクお。It was difficult to do so. For these, there is a method of putting the laminate in a bag, inserting it into a high-pressure tank, and using gas to pressurize and heat it, but the high-pressure tank is not suitable.
よびガスの加圧加熱装置が必要となり、かつ安全）０確
保のため、取扱いに相当な注意を要するという点および
、７ＪＯ圧加熱に要する時間が、従来の装置゛と比較し
７て遅いために、新しい接着剤を開発する゛必要がある
等の問題点があった。7JO pressure heating equipment is required, and considerable care is required in handling to ensure safety), and the time required for 7JO pressure heating is slower than with conventional equipment. However, there were problems such as the need to develop a new adhesive.
〔発明が解決しようとする問題点〕 ｌ、上
記従来技術は、積層体内の真空度を安定して・保持する
点について配慮がなされておらず、ボイ・ドの発生を完
全に抑止する事は困難であるという。[Problems to be solved by the invention] l. The above-mentioned prior art does not take into consideration the point of stably maintaining the degree of vacuum within the laminate, and it is not possible to completely suppress the occurrence of voids. It is said to be difficult.
問題があった。There was a problem.
本発明の目的は、績ノ一体内の真空度の保持が不□。The purpose of the present invention is to prevent the maintenance of the degree of vacuum within the chamber.
安定であっても、ボイドの発生を完全に抑止できるよう
にすることにある。The purpose is to completely prevent the occurrence of voids even if the structure is stable.
（問題点を解決するための手段）
上記目的は、積層体の外周部だけを予め高圧に゛させた
後、前記積層体内の内周部の加熱により溶融した接着剤
の圧力を高める事により達成されるｇ〔作用〕
すなわち、積層体の外周部だけを予め高圧に保゛持する
事により、加熱時の接着剤の流出を防ぎ、積層体内に充
填する接着剤量を増す事ができる。１・・また外周部だ
けを毘圧に負荷した直後、内周部に・所定の圧力を負荷
させる事により、積層体内の圧力を、接着剤の溶融粘度
に関係なく、保持する事・ができるので、ボイドの発生
を完全に抑止できる。(Means for solving the problem) The above object is achieved by first applying high pressure to only the outer circumference of the laminate, and then increasing the pressure of the melted adhesive by heating the inner circumference of the laminate. [Function] That is, by holding only the outer peripheral portion of the laminate at a high pressure in advance, it is possible to prevent the adhesive from flowing out during heating and increase the amount of adhesive filled into the laminate. 1. In addition, by applying a predetermined pressure to the inner circumference immediately after applying pressure only to the outer circumference, the pressure inside the laminate can be maintained regardless of the melt viscosity of the adhesive. Therefore, the occurrence of voids can be completely suppressed.
以下、本発明の一実施例を第１図により説明す。 An embodiment of the present invention will be described below with reference to FIG.
る０
第１図において、１は、絶縁物に係る、ガラスエポキシ
樹脂板の両面に予め鋼箔を付着して記載。0 In Figure 1, 1 is a glass epoxy resin plate that is an insulator, with steel foil attached to both sides in advance.
してなるプリント配線板である。２は、接着剤に、。This is a printed wiring board. 2 is for adhesive.
係るガラスエポキシ樹脂の未硬化剤（プリプレグ）゛で
ある。This is an uncured agent (prepreg) for such glass epoxy resin.
第１図に示す様に、プリント配線板１とプリプレグ２を
交互に積層する。谷プリント配線板１に゛は、各プリン
ト配線板２間の相対位置を固定する′ためのガイド穴を
穿設してあり、このガイド穴へ、。As shown in FIG. 1, printed wiring boards 1 and prepregs 2 are alternately laminated. The valley printed wiring board 1 is provided with guide holes for fixing the relative positions of the printed wiring boards 2.
ガイドビン３を挿入して、積層体４を構成する。。A guide bin 3 is inserted to form a laminate 4. .
次に積層体４のガイドビン３に、不発明に係る積層体４
の外周部だけに高圧を負荷するための外枠・治具５を固
定する。この状態を保持するために、ＩＯ内周枠６に固
定する。そして、前記積層体４を加・圧加熱するために
、本発明に係る成形装置の加圧、・加熱ベッド７に装填
する。その後直ちに、積層体・４の外周部だけを加圧加
熱するために、外周加圧・加熱ボルスタ８に、ラムａ９
を通して高圧を負荷、・。Next, the laminate 4 according to the invention is placed in the guide bin 3 of the laminate 4.
An outer frame/jig 5 is fixed for applying high pressure only to the outer periphery of. In order to maintain this state, it is fixed to the IO inner peripheral frame 6. Then, in order to press and heat the laminate 4, it is loaded onto the press and heat bed 7 of the molding apparatus according to the present invention. Immediately thereafter, in order to pressurize and heat only the outer periphery of the laminate 4, a ram a9 is attached to the outer periphery pressurizing/heating bolster 8.
Load high pressure through the...
後保持する。これにより積層体４の外周部に接触。hold after. This makes contact with the outer periphery of the laminate 4.
している外枠治具４に高圧および熱が加わるため、。Because high pressure and heat are applied to the outer frame jig 4,
積層体４を構成している外周部のプリプレグ２が。The prepreg 2 on the outer periphery forming the laminate 4.
溶融し始める。また外枠治具４に加圧、加熱保持。Begins to melt. Additionally, the outer frame jig 4 is pressurized and heated.
した直後に積ノ一体４の内周部に圧力および熱を、・
６ ・
内周加圧加熱ボルスタ１０に、７Ａ ｂ １１を通して
、所定圧力を負荷すると、槓ノ一体４の内周部のグリプ
ルレグ２が溶融し始める。この時、積層体４の内周部の
溶融したプリプレグ２は、圧力により外周部。Immediately after applying pressure and heat to the inner periphery of the product 4,
6. When a predetermined pressure is applied to the inner periphery pressurized heating bolster 10 through 7A b 11, the gripple leg 2 on the inner periphery of the hammer 4 begins to melt. At this time, the melted prepreg 2 on the inner circumference of the laminate 4 is melted on the outer circumference due to pressure.
へ流出しようとするが、前記外枠治具４に高圧が負荷さ
れ、積層体４の外周部の溶融したプリプレ。However, high pressure is applied to the outer frame jig 4, and the pre-pre-prep on the outer periphery of the laminate 4 melts.
グが高圧に保持されてｂるために、流出を防げら。The gas is held at high pressure to prevent leakage.
れ、積層体４の内周部の溶融したプリプレグ２は、。The melted prepreg 2 on the inner circumference of the laminate 4 is as follows.
外周部の外へほとんど流出しない。従って、積層゛体４
内に積層体４内を充分に満たすだけの溶融し１゛たプリ
プレグ２が残る。さらに、この状態で積層。There is almost no leakage outside the outer periphery. Therefore, the laminate 4
There remains enough melted prepreg 2 to sufficiently fill the inside of the laminate 4. Furthermore, it is laminated in this state.
体４の内周部の溶融したプリプレグ２の圧力が上′昇す
るため、溶融したプリプレグ２の圧力（液体圧）を高め
る事ができ、溶融したプリプレグ２内゛に残存するボイ
ドをこの液体圧力により消失させする事ができる。Since the pressure of the melted prepreg 2 on the inner circumference of the body 4 increases, the pressure (liquid pressure) of the melted prepreg 2 can be increased, and the voids remaining inside the melted prepreg 2 can be removed by this liquid pressure. It can be made to disappear.
具体例を説明する。A specific example will be explained.
プリント配線板１は、大きさが５００ｍｍ・板厚０．３
朋程度、プリプレグは、板厚ｏ、１ ｗｉ＋を２枚づつ
積。The printed wiring board 1 has a size of 500 mm and a board thickness of 0.3 mm.
As for my prepreg, I stacked two sheets each of board thickness O and 1 wi+.
層した積層体を用いて、本発明の方法および装置、。Methods and apparatus of the present invention using layered laminates.
・ ４ ・ を使用して、プリント配線板１を接着し、多層プ。・ 4 ・ Glue the printed wiring board 1 using a multilayer adhesive.
リント板を成形したところ、プリント配線板１間。When the lint board was molded, one printed wiring board was formed.
にボイドは発生していない。No voids have occurred.
（発明の効果〕
以上詳細に説明したように不発明によれば、接５着後の
各プリント配肪板間のボイ〆の発生を抑止。(Effects of the Invention) As explained in detail above, according to the invention, the occurrence of voids between each printed fat plate after bonding is suppressed.
する事ができるので、多層プリント板の接着ボイ゛ド不
良を低減できる効果がある。This has the effect of reducing adhesive void defects in multilayer printed boards.
第１図は、本発明の一実施例による積層体の外１０周部
だけに高圧を負荷できる外枠治具と、内周部゛に所定圧
力を負荷する内周加圧加熱ボルスタを合・せて示す断面
図である。
１・・・プリント配線板、 ３・・・ガイドビン、
・４・・・積層体、 ５・・・外枠治具、 ６・・・
内周枠、 Ｉ−７・・・加圧加熱ベッド。
、”Ｔ’ｈ
７−−−アリシト配線ネグFIG. 1 shows a combination of an outer frame jig that can apply high pressure only to the outer 10 peripheries of a laminate according to an embodiment of the present invention, and an inner periphery pressurized heating bolster that applies a predetermined pressure to the inner periphery. FIG. 1...Printed wiring board, 3...Guide bin,
・4... Laminated body, 5... Outer frame jig, 6...
Inner peripheral frame, I-7...pressure heating bed. ,”T'h 7---Alicito Wiring Neg
Claims (1)
線板を絶縁性接着剤を交互に積重ねて積層体を形成し、
この積層体を上、下金型の間で加圧加熱して前記各プリ
ント配線板を積層接着する多層プリント板の成形工程に
おいて、前記積層体の外周部だけを予め高圧に保持し、
加圧加熱による接着剤の流出を防ぐ事によって積層体の
内周部の加熱により溶融した接着剤の圧力を高める事の
できることを特徴とする多層プリント板の成形方法。1. A laminate is formed by alternately stacking printed wiring boards with conductor circuits formed on both sides of an insulator with insulating adhesive,
In the process of forming a multilayer printed board in which the laminate is heated under pressure between upper and lower molds to laminate and bond the printed wiring boards, only the outer peripheral portion of the laminate is held at high pressure in advance,
A method for forming a multilayer printed board, characterized in that the pressure of the melted adhesive can be increased by heating the inner circumference of the laminate by preventing the adhesive from flowing out due to pressurized heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221825A JPS6377732A (en) | 1986-09-22 | 1986-09-22 | Molding method for multilayer printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61221825A JPS6377732A (en) | 1986-09-22 | 1986-09-22 | Molding method for multilayer printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6377732A true JPS6377732A (en) | 1988-04-07 |
Family
ID=16772778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61221825A Pending JPS6377732A (en) | 1986-09-22 | 1986-09-22 | Molding method for multilayer printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6377732A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002509A1 (en) * | 1993-07-13 | 1995-01-26 | Teknek Electronics Limited | Method of laminate manufacture |
-
1986
- 1986-09-22 JP JP61221825A patent/JPS6377732A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995002509A1 (en) * | 1993-07-13 | 1995-01-26 | Teknek Electronics Limited | Method of laminate manufacture |
| GB2294661A (en) * | 1993-07-13 | 1996-05-08 | Teknek Electronics Ltd | Method of laminate manufacture |
| GB2294661B (en) * | 1993-07-13 | 1997-04-02 | Teknek Electronics Ltd | Method of laminate manufacture |
| US5688350A (en) * | 1993-07-13 | 1997-11-18 | Teknek Electronics Limited | Method of laminate manufacture |
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