JPS6377272U - - Google Patents
Info
- Publication number
- JPS6377272U JPS6377272U JP1986171285U JP17128586U JPS6377272U JP S6377272 U JPS6377272 U JP S6377272U JP 1986171285 U JP1986171285 U JP 1986171285U JP 17128586 U JP17128586 U JP 17128586U JP S6377272 U JPS6377272 U JP S6377272U
- Authority
- JP
- Japan
- Prior art keywords
- director
- bus bar
- receiving groove
- insulating plate
- overlapping surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003466 welding Methods 0.000 claims description 3
Landscapes
- Multi-Conductor Connections (AREA)
- Structure Of Printed Boards (AREA)
- Connection Or Junction Boxes (AREA)
Description
第１図は本考案に係る積層配線板を構成するブ
スバーと絶縁板の溶着前の断面図、第２図は同上
の溶着後の断面図、第３図は第２図の溶着部分の
拡大断面図、第４図は本考案の積層配線板を適用
した電気接続箱の分解斜視図である。
Ａ…積層配線板、１…ブスバー、１ａ，１ｂ…
回路、２…第１の絶縁板、２′…第２の絶縁板、
３…ダイレクター、４…ダイレクター受溝。
Figure 1 is a cross-sectional view of the bus bar and insulating plate that constitute the laminated wiring board according to the present invention before welding, Figure 2 is a cross-sectional view of the same after welding, and Figure 3 is an enlarged cross-sectional view of the welded portion of Figure 2. 4 are exploded perspective views of an electrical connection box to which the laminated wiring board of the present invention is applied. A... Laminated wiring board, 1... Bus bar, 1a, 1b...
circuit, 2...first insulating board, 2'...second insulating board,
3...Director, 4...Director receiving groove.
Claims (1)
合わせる第２の絶縁板の一方の重ね合わせ面に、
前記ブスバーの各回路を隔絶するダイレクターを
突設し、他方の重ね合わせ面にダイレクター受溝
を凹設し、第１および第２の絶縁板を重ね合わせ
て前記ダイレクターを超音波溶着によりダイレク
ター受溝に溶着したことを特徴とする積層配線板
。 On one overlapping surface of the first insulating plate on which the bus bar is arranged and the second insulating plate overlaid thereon,
A director is provided protrudingly to isolate each circuit of the bus bar, a director receiving groove is recessed in the other overlapping surface, the first and second insulating plates are overlapped, and the director is attached by ultrasonic welding. A laminated wiring board characterized by being welded to the director receiving groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171285U JPH0513025Y2 (en) | 1986-11-10 | 1986-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986171285U JPH0513025Y2 (en) | 1986-11-10 | 1986-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377272U true JPS6377272U (en) | 1988-05-23 |
| JPH0513025Y2 JPH0513025Y2 (en) | 1993-04-06 |
Family
ID=31106771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986171285U Expired - Lifetime JPH0513025Y2 (en) | 1986-11-10 | 1986-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513025Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007202223A (en) * | 2006-01-23 | 2007-08-09 | Viscas Corp | Cord element for diameter expansion holding cylinder of normal temperature shrink tube and diameter expansion holding cylinder |
-
1986
- 1986-11-10 JP JP1986171285U patent/JPH0513025Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007202223A (en) * | 2006-01-23 | 2007-08-09 | Viscas Corp | Cord element for diameter expansion holding cylinder of normal temperature shrink tube and diameter expansion holding cylinder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513025Y2 (en) | 1993-04-06 |
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