JPS6375533A - Force detector - Google Patents

Abstract

PURPOSE:To facilitate the manufacture of a strain inducer and the formation of a detecting element by forming the plane strain inducer where a detection surface is formed between a center part and a peripheral part which have high rigidity. CONSTITUTION:The plane strain inducer 1 which is larger in rigidity at the center part 5 and peripheral part 2 than on the detection surface 9 is formed by; using either of the center part 5 and peripheral part 2 as a support part 4 and the other as an operation part 7 and forming the detection surface between the both. A detecting element 14 which varies electric resistance by its mechanical deformation is formed on the detection surface 9 of the strain inducer 1 to facilitate the manufacture of the strain inducer 1. Further, a detecting element for component detection in a Y-axial direction crossing the X axis of the detection surface 9 is formed in the X-axial direction of the detection surface 9 and a detecting element 4 for X-axial component detection is formed in the Y-axial direction of the detection surface 9. Further, a detecting element 14 for Z-axial component detection is formed in an axial direction a 45 deg. to the X and Y axes of the detection surface 9. Consequently, interference between components in the X- and Y-axial directions and Z-axial direction is eliminated to array the elements 14 having uniform performance.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a force detection device used, for example, in a robot I, a force sensor, a three-dimensional input device as a man-machine interface, and the like.

2. Description of the Related Art A conventional force detection device includes a strain body that elastically deforms when an external force is applied thereto, and a plurality of detection elements that change electrical resistance through mechanical deformation of the strain body. The strength of the external force is detected by extracting the change in electrical resistance as an electrical signal.

Generally, in this type of force detection device, the external force is a constant −
・It acts on a point, and x, y at the point of action
, forces Fx, Fy, Fz and moments Mx, M in the z coordinate system
The independent component forces of y and Mz act as shown in FIG.

In order to detect each component force, there is a force detection device in which the strain body is formed into a three-dimensional block structure so that the external force can be detected separately as multi-axial force components. Utility Model Publication No. 54-1.1903, Utility Model Number 54-21
．． 021, JP-A-59-954.33, JP-A-61-57825, JP-A-61. -791.
This is disclosed in Publication No. 29 and the like. In particular, the detection surface of the independent component forces of the forces Fx, Fy, Fz and the moments Mx, My, Mz in the x, y, z coordinate system at the point of application, that is, the surface to which the strain gauge is attached, is the component force It is characterized by the use of a plane perpendicular to the plane, and the strain-generating body must have a three-dimensional structure as a block structure as described above.

In such a structure, the means for manufacturing the strain-generating body is cutting or electric discharge machining, and the strain body must be manufactured from a block-shaped material.

Therefore, processing is difficult and complicated. In addition, it is common to attach a strain gauge detection element to each force detection element of each component, and to connect these electrically with a bridge, which makes it complicated to run lead wires around, making it difficult to downsize. However, it is difficult to reduce costs and has low mass productivity.

In addition, there are structures that combine structures and plates to form a three-dimensional block in order to separate external forces as multi-axial force components, and this structure is disclosed in Japanese Patent Application Laid-open No. 83929/1983. ing. In such a structure, since the detection body for each component is fastened with screws or the like, there is a problem of poor reproducibility. That is, hysteresis and nonlinearity occur due to the deformation of the fastening portion.

Purpose The present invention aims to provide a force sensing element whose strain-generating body is easy to manufacture and whose sensing element can also be easily formed.

Structure The present invention forms a plate-shaped flexural body in which a detection surface is formed between a highly rigid center portion and a peripheral portion, and uses one of the center portion and the peripheral portion as a supporting portion and the other as an acting portion. A detection element is formed on the detection surface. This results in
Since the strain-generating body has a flat plate shape, it can be formed with only a slight cutting process during production, and can also be processed by pressing such as fine blanking or casting. By forming a flat surface, the detection element can be formed using a thin film semiconductor, and in particular, a component in the X-axis direction that changes the electrical resistance by mechanical deformation in the X-axis direction of the detection surface. A detection element for detecting force is formed, and a Y axis perpendicular to the X-axis direction of the detection surface is formed.
A detecting element for detecting a component force in the Y-axis direction that changes electric resistance in the axial direction by mechanical deformation in the Y-axis direction, and a Z Since a detection element is formed to detect the component J in the Z-axis direction, which changes the electrical resistance by mechanical deformation in the Z-axis direction, there is less interference between the X, Y-axis directions and the Z-axis direction. It is composed of

A first embodiment of the present invention will be described based on FIGS. 1 to 13. First, the plate-shaped flexure element 1 has a ring-shaped peripheral part 2 that is thick and has high rigidity. Eight mounting holes 3 are formed. This peripheral portion 2 is connected to a support portion 4 that is fixed to a fixed portion (not shown).

Further, a thick disc-shaped central portion 5 is formed in the center, and four attachment holes 6 are formed through the central portion 5 in the thickness direction. A member (not shown) is attached to the center portion 5, and the center portion 6-5 serves as an acting portion 7 for receiving an external force.

Further, a thin flat plate part 8 is formed between the support part 4 and the action part 7, and the surface of this flat plate part 8 is used as a detection surface 9. Eight holes 10 having a relatively large diameter are formed in such a flat plate portion 8 at equal intervals. Eight arms 11 are formed radially through these holes 10 to connect the inner and outer peripheries. These arms 11 consist of a narrowest part 12 at the center thereof and substantially trapezoidal expanded parts 13 located at both ends of this narrow part 12. The arm portion 11 is positioned along the X-axis direction, the Y-axis direction, and the X-axis direction having an angle of 45 degrees with respect to the X-axis and the Y-axis.

Next, the expanded portion 13 on the X axis has Y,...
Y2. Detection elements 14 made of strain gauges labeled Y, , Y4 are formed. These detection elements 14
Among them, Y, Y4 are located in the outer expanded portion 13,
' Said Y2. Y3 is located at the inner expanded portion 13. These detection elements 14 are bridge-coupled as shown in FIG. 5, and Y, , Y2 . Y3. Y, is connected so that when the balance of the detection element 14 is lost, an output Vy is generated.

Further, the expanded portion 13 on the Y axis perpendicular to the X axis includes x, , x, , x3. A detection element 14 is formed by a strain gauge labeled x4. Of these detection elements 14, the above-mentioned X, . X3 is the inner expansion part 1
It is located at 3. These detection elements 14 are bridge-coupled as shown in FIG. 6, and have x, , x2 . x,
, x4 are connected so that when the balance of the detection element 14 is lost, an output Vx is generated.

Further, the expanded portion 13 located on the X-axis "-" which has an angle of 45 degrees with respect to the X-axis and the Y-axis has Z + +z, .
z3. z4. z6. Eight detection elements 14, labeled z, z, z, are formed. These detection elements 14
Among them, z, z4. z, , z are the outer expanded portions 13
Located at z2. z,,z6. z is located in the expanded portion 13 on the inside. These detection elements 14 are connected as shown in FIG. That is, 2. ．． 2. and 2
2.23 and 2. ．． 2. and 2. ．． 2. and are bridge-coupled as a unit, and when the balance between these is disrupted, an output of V7° is generated.

For the detection element 4 of the flat plate-like strain body shown above, it was also possible to use a conventionally used metal foil strain gauge. The necessity of flattening the strain-generating body is also important for the thin film formation technology of strain sensors.

The detection element 14 positioned as described above is formed by thin film technology. That is, the plate-shaped strain body 1 is made of aluminum alloy or stainless steel.
A buffer layer is deposited on the buffer layer. Specifically, this buffer layer is made of Si3N4 or 5, which has low internal stress.
2,000 to 10,000 people create a jOx film using the plasma CVD method. Next, a semiconductor thin film is laminated on top of this buffer layer to a thickness of 5,000 to 20,000 layers, and a highly conductive material (for example, Al, N1-Cr, Mo, etc.) is added to serve as an electrode material. metal thin film) 20
The layers are sequentially laminated to a thickness of 0.00 to 5000. Specifically, as the semiconductor thin film, μc-3i (microcrystal silicon) created by plasma CVD method or photoexcitation CVD method or n”a-3j:H was used.
As an electrode material, Al-3i (Si: 2 to 3 wt%
) is created by vapor deposition or sputtering.

Next, the electrode material is patterned into a predetermined shape by photolithography and etching methods. As etching,
Both wet etching and dry etching pose no problem in terms of shape, but dry etching is preferable in order to avoid effects on device characteristics. In addition, in the case of a-3i:H, CF4-02 (3 to 20 wt%) was etched using a plasma etching device.
Etching with good reproducibility and precision is possible by using a mixed gas of

Also, Fx, F y, F7. , MX, MY, and MZ and a bridge circuit for the detection element 14 are required, which increases wiring density and requires multilayer wiring. For this purpose, an interlayer insulating material such as photosensitive polyimide or Si3N4 is laminated. When photosensitive polyimide is used, it is applied using a roll coater or spinner, and contact holes are created using photolithography and etching processes. Si,
In the case of N4, the film is formed by plasma CVD method,
After applying the resist, a contact hole portion is created by photolithography and etching steps.

Additionally, secondary electrode materials (e.g. Al, Nj-Cr.

Mo, etc.) is laminated on this I-7, and predetermined wiring and pad portions are formed by photolithography and etching-E steps. Next, passivation is applied to improve moisture resistance and prevent mechanical damage. As a film, for example, parylene or S
In, Si3N4 is deposited.

It is also possible to form the primary electrode pattern, the interlayer insulation part, and the secondary electrode pattern in advance by forming the formation f stages of such a detection element] 3. It is possible to exclude defective products up to this stage and improve the yield in the final process1.
, the failure modes in the detection element 14 portion are primary and secondary.
Shorts and disconnections in the next electrode pattern accounted for 25%, shorts due to poor insulation in the interlayer insulation part, and disconnections due to defective contact holes accounted for about 20%, and defects up to this step accounted for the majority. Therefore, the effect of eliminating these defects at the purchasing process stage is significant.

Furthermore, when depositing the semiconductor thin film, a metal mask with one part open only in the necessary portion may be used to form the semiconductor thin film only in a predetermined position. This eliminates the need for photolithography and etching processes for semiconductor thin films, simplifies the process, and enables the detection element 14 to be formed at low cost.
It becomes possible to manufacture parts.

In such a configuration, the detection principle of the flat plate-shaped strain body 1 will be explained based on FIG. 8(a)(+)).

First, in FIG. 8, several strain-generating bodies 15 such as beams or plates are installed between the fixed part 16 and the vT moving part 17, and the distances from the center are shown on the upper and lower surfaces of the strain-generating bodies 15. Equally, a strain gauge 18 is provided as a detection element. The state shown in FIG. 8(a) is a state in which no load is applied to the movable part 17, and the state shown in FIG.
The state shown in b) is a state in which a downward load F is applied and the movable portion 17 moves downward. At this time, the upper surface of the strain body 15 on the fixed part 16 side is elongated, the lower surface is reduced, the upper surface on the movable part 17 side is reduced, and the lower surface is elongated.

That is, strains having the same absolute value and opposite signs occur in the strain gauge]8, and the resistance changes accordingly.

Generally, these four strain gauges 18 are bridge-coupled to obtain an output with four times the sensitivity compared to a single strain gauge.

Next, the one shown in FIG. 9 has a cross section similar to that of the flat plate-shaped flexure element 1 in this embodiment, and the surrounding support part 4 is fixed to a fixed part (not shown), and the central acting part 7 An external force acts on it. Now, FIG. 9(a) shows a state where no load is acting on the acting part 7, and FIG. 9(b) shows a state where Fz
This is a state where a vertical load of In this state, one side from the central acting part 7 is shown in FIG. 8 (1) as described above.
) is the same as the state shown in ), and the inner two detection elements 1/
I is contracted (-), and the two outer detection elements 14 are extended (+
). The state shown in FIG. 9(c) is a state in which a moment M is applied to the acting portion 7. In the second state, the left and right sides exhibit antisymmetrical deflection states, and the deflection states of the inner and outer detection elements 14 do not have opposite signs.

In the plate-shaped flexure element 1 exhibiting such a detection principle, the support part 4 and the action part 7 have higher rigidity than the flat part 8, and the support part 49 and the action part 7. An important requirement is that the flat plate portion 8 be integrally formed. That is, a fixed part and a load detection body are connected to the support part 4 and the action part 7, but if deformation or play occurs in these fastened parts due to external force, hysteresis may occur in the output. Nonlinearity may occur. Therefore, the supporting part 4 and the acting part 7
The supporting part 42 has higher rigidity than the flat plate part 8, and the supporting part 42 and the acting part 7. Since the flat plate portion 8 is integrally formed, hysteresis and nonlinearity do not occur. In addition, stress is likely to occur in the support part 4 and the action part 7 as fastening parts due to screw tightening, etc., which tends to cause distortion in the detection surface 9.
Since the rigidity is much higher than that of the flat plate part 8, the detection element 14 will not be distorted due to fastening of other members.

Generally, a pressure-sensitive member protruding in the Z-axis direction is attached to the centrally located acting part 7, but if a force Fx is applied to the tip of the pressure-sensitive member, My If a force Fy is applied to the tip of the pressure-sensitive member, a moment Mx will be generated in the acting portion 7. Therefore, three external forces My, Mx, and Fz are representative.

This stress relationship will be explained based on FIG. 10.

First, a point of action ○ is placed at the center of the detection surface 9. It is assumed that a pressure-sensitive member with a height of {circle around (2)} is attached to the point of application O0, and an external force is applied to the pressure-sensitive member at the point of application of 0°. Therefore, the point of action of the pressure sensitive member is 0. < Fx, Fy, Fz,
The components of Mx and My are F at the point of action O0 on the detection surface 9.
It is detected as three component forces of z, Mx, and My.

Next, a typical state in which an external force is applied to the flat plate-shaped strain body 1 will be explained based on FIGS. 11 to 13.

First, FIGS. 11(a), (b), (c), and (d) show a state in which only the moment My acts on the acting portion 7 as an acting force. At this time, as shown in FIG. 11(a), there is no deformation in the Mx component detection section, and x, , x2. The output Vx of the bridge circuit shown in FIG. 6 constituted by the detection elements x, , x4 is "0". In addition, the My component detection section is
The deformation mode is as shown in Fig. 11(b), and Y,...
Y2. The detection elements 14 indicated as Y, , Y are deformed, and the output Vy of the bridge circuit shown in FIG. 5 shows a value corresponding to the moment My. Furthermore, Fz component detection 17
Some of them have deformation modes as shown in Figures (C) and (d), z, z, z, z4. z、、z、、z、、z
, the eight detection elements 14 are deformed.

However, since the degree of this deformation is small and the output is determined by the bridge circuit shown in FIG. 7, it becomes almost "0". That is, ZI and 2. ．． 2
2 and 23.2. and 211,2. The directions of expansion and contraction of Z7 and Z7 are opposite directions, and in the bridge circuit shown in Figure 7, the combined resistance of each side is canceled out and becomes "0".
Therefore, the output Vz becomes "0".

Here, eight strain gauges are used to detect the Fz component, but it is also possible to use four strain gauges along the X and Y axes or one of the axes at 45 degrees to the X and Y axes. Detection is possible. However, this method was adopted in order to reduce the interference of forces (moments) other than Fz.

Next, the state where only moment Mx acts is the 12th
As shown in Figures (a), (b), (c), and (d), in this case, the output Vx of the Mx component detection section is generated, and the output Vy of the My component detection section is "0". Further, the output Vz of the Fz component detection section becomes "0" for the same reason as in the case in FIGS. 11(C) and (d) described above.

Furthermore, if only the force Fz acts, then Fig. 13 (aH
As shown in b), (c), and (d), in the Mx component detection section, X, , X4 are deformations on the + side, X, , X3 are deformations on the one side, and the bridge shown in FIG. Circuit output Vx
is "O". Further, the output Vy of the My component detection section is also "O" for the same reason. On the other hand, the output V7 of the Fz component detection section. can obtain an output eight times that of one detection element 14.

The output states shown in FIGS. 11 to 13 are summarized as shown in Table 1.

Table 1 In this way, deformation in the direction of maximum sensitivity is detected by the detection element 14 as a strain gauge, and the output of other interference components can be set to "0" by the bridge circuit.

Next, by forming the hole]O in the flat plate portion 8 of the flat plate-shaped flexure element 1, stress separation of each component is performed satisfactorily.

For example, if the flat plate part 8 does not have a hole]0 and is formed by a circular diaphragm, when an external force is applied to the acting part 7, the bending stress generated in the flat plate part 8 will naturally occur in the radial direction. However, approximately the same stress is generated in the circumferential direction as well. When the generation of stress in the circumferential direction is detected for each component, it greatly interferes with other components. However, as described above, by forming a plurality of holes 10 at equal intervals around the circumference at equal distances from the center, the bending stress in the circumferential direction generated in the flat plate portion 8 is reduced, and the occurrence of strain is reduced. It is designed so that it mainly appears only in the radial direction. Due to such an effect, there is no interference between the stresses of each component, and the stress separation is performed satisfactorily.

Further, an arm 11 is formed by a hole 10 formed in the flat plate part 8 of the flat plate-like strain body 1, and an enlarged part 1 of this arm 11 is formed.
A detection element 14 is located at 3.

This expanded portion 13 is formed by two holes 10 adjacent to each other, and has a shape approximately approximating a trapezoid. In the circumferential direction, the expanded portions 13 are separated from each other, and as described above, interference due to bending stress in the circumferential direction does not occur. Moreover, since the expanded portion 13 is located at the base of the arm 11 portion, it is a portion where bending stress in the radial direction is likely to occur.
This is an appropriate position for detecting strain caused by external force.

Furthermore, looking at the distribution of bending stress generated in the expanded portion 13, the stress distribution is relatively uniform in the expanded portion 13 at the base of the arm 11, and there is little interference. Therefore, when the sensing element 14 is attached as a strain gauge to the flat plate-like strain body 1, there is no variation in the accuracy of strain detection even if there is a slight positional shift, and this allows some positional shift. , there is no need to impose strict conditions on the accuracy of the affixing position.

In addition, since eight holes 10 are formed in the flat plate part 8 of the flat plate-like flexure element 1, a position that is at an angle of 45 degrees with respect to the radial direction of the X-axis and the Y-axis is formed. niz,,z2
．． Detection element 1 consisting of z,,z,,z,,z,,z,,z,
4 can be installed. Such a detection element 1
As shown in Table 1, F7. Components can be detected satisfactorily, and detected values other than the M x and M y components can be effectively erased when detecting the M x and M y components.

Next, a second embodiment of the present invention will be described based on FIG. 15. This embodiment employs the same configuration as the first embodiment described above, and also has the following features:
9 with a detection element 14 attached thereto. That is, X
A detection element 14 for Fy detection is attached to the side surface 19 of the arm 11 along the axis, and the side surface 19 of the arm 11 along the Y axis is attached.
A detection element 14 for detecting Fx is attached to 9, and a detection element 14 for detecting moment Mz is attached to a side surface 19 of arm 11 that forms an angle of 45 degrees with the X and Y axes.

Therefore, according to this embodiment, the moment Mz around the X-axis can also be detected.

In each of the above-mentioned embodiments, the plate-shaped strain-generating body 1 is described as having a disk shape, but the outer peripheral shape thereof is not limited to a disk shape, and may be square, rectangular, polygonal, etc. It is possible to form it in any shape.

Next, a third embodiment of the present invention will be described based on FIGS. 16 and 17. The hole 10 is not formed in the flat plate portion 8 of the flat plate-like strain body 1 of this embodiment, and the Mx detection axis and My
The X-axis direction and the Y-axis direction, which are the detection axes, are perpendicular to each other, and the detection elements 14 are arranged in the respective axis directions, and the detection elements 14 are arranged in the Fy direction, which forms 45 degrees with the X and Y axes, and the Z-axis direction, which is the mountain axis. 1
4.

What is shown in FIG. 18 is a fourth embodiment of the present invention, in which the hole 10
is elliptical in shape, and its major axis is in the radial direction,
That is, it is oriented in the radial direction.

Next, what is shown in FIG. 19 is a modification of the fourth embodiment, in which the direction of the oval hole 10 is different. That is, the short diameter of the hole 1o is arranged toward the radial direction.

Furthermore, what is shown in FIG. 20 is a further different modification of the fourth, in which the hole 10 is hexagonal.

In this way, any shape of the hole 10 can be adopted.

In each of the above-mentioned embodiments, the plate-shaped strain-generating body 1 is described as having a disk shape, but the outer peripheral shape thereof is not limited to a disk shape, and may be square, rectangular, polygonal, etc. It is possible to form it in any shape.

Effects of the present invention, as described above, one of the center part and the peripheral part is used as a support part and the other part is used as an action part, a detection surface is formed between these two rows, and the center part is larger than this detection surface. A plate-shaped flexure body with increased rigidity between the plate-shaped flexure body and the peripheral portion is formed, and a detection element that changes electrical resistance by mechanical deformation of the detection surface is formed on the detection surface of the flat plate-shaped flexure body. It is extremely easy to manufacture a flat plate-shaped flexure element, and it is possible to use a construction method that would not be possible with conventional block-shaped flexure elements. Change the electrical resistance by mechanical deformation of
Component force detection in the Y-axis direction in which a detection element for detecting component force in the axial direction is formed, and electrical resistance is changed by mechanical deformation in the Y-axis direction perpendicular to the X-axis direction of the detection surface. A component J in the X-axis direction that forms a detection element for the detection surface and changes electrical resistance by mechanical deformation in the Z-axis direction that forms 45 degrees with the X-axis and Y-axis directions of the detection surface. Since the detection element for detection is formed, it is possible to reduce the drop in the X, Y-axis directions, and Z-axis direction261, and the detection element can also be formed using a thin film semiconductor. , it is possible to arrange detection elements with uniform performance, their positions are also accurate, and in particular, it has the effect of facilitating the wiring of complicated lead wires for bridging each component. It is.

[Brief explanation of the drawing]

1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a plan view thereof, FIG. 3 is a sectional view taken along line A-A in FIG. 2, and FIG. ) 3-B line section, Fig. 5 is an electric circuit diagram showing the bridge circuit of the My component detection section, Fig. 6 is an electric circuit diagram showing the bridge circuit of the Mx component detection section, and Fig. 7 is the Fz component. An electric circuit diagram showing the bridge circuit of the detection section, Fig. 8 is a side view showing the detection principle, Fig. 9 is a side view showing the detection principle when an external force is applied to the flat plate-shaped strain body, and Fig. 10 shows the operation. FIG. 11 is a side view showing the state of deformation of the plate-like strain body when moment My acts on it, and FIG. 12 is a perspective view showing the state of force acting on the moment Mx.
A side view showing the deformation state of the flat plate-shaped strain body when
' Fig. 13 is a side view showing the deformation state of the flat plate-like strain body when force Fz is applied, Fig. 14 is a vector diagram showing each component force when external force is applied, and Fig. 15 is a FIG. 16 is a perspective view showing a third embodiment of the present invention, FIG. 17 is a sectional view taken along line C-C in FIG. 16, and FIG. 18 is a perspective view of the present invention. FIG. 19 is a plan view showing a modification thereof, and FIG. 20 is a plan view showing a further modification thereof. ]... Flat flexure body, 2... Peripheral part, 4... Support part, 5... Center part, 7... Acting part, 9... Detection surface, 1
4...Detection element, Jx, I diagram" 几しZ 11 1986-75533 (11) Figure 116, σnansen. Y-axis ×
",7
rVMx Uncertainty Licensing Procedures Correction Belt (Master) October 16, 1985 Commissioner of the Patent Office Black 1) Mr. Aki Yu
1.Special application for display of incident 1986. -219968 No. 2, Invention name power detection device 3, Relationship with the amended person case Patent applicant address: 1-3-6-4 Nakamagome, Ota-ku, Tokyo, Agent:
Person: 107 Address: 5-9-15 Minami-Aoyama, Minato-ku, Tokyo None Patent application 1986. -219968 Amendment Regarding this application, the description in the specification is amended as follows. Note 1: The scope of claims is amended as shown in the attached sheet. 2. Change "FX axis" on page 5, line 15 to "Y perpendicular to the X axis"
axis”. 3. Correct the [Y-axis perpendicular to the X-axis direction of the detection surface] on the 17th line of page 5 to the "Y-axis of the detection surface." 4. Correct "Y to change" on the 18th line of page 5 to "X to change". 5.Page 6, line 3, “in the Z-axis direction”
is corrected in the ``direction of the axis in the direction of the axis''. 6. "X-axis with a 45 degree angle" on page 7, line 1'2
Correct it to "an axis with an angle of 45 degrees". 7. Correct "on the X-axis to have" in line 18 of page 8 to "on the axis to have." 8. Correct "x" on page 23, line 18 to "rz". 9. Delete the sentences from the 3rd line to the 7th line on page 24. 10, page 24, line 14, rFz output axis, mountain axis, rFz detection axis". 11. Correct "X-axis direction" in the 10th line of page 26 to "Y-axis direction perpendicular to the X-axis." −2=12, “Y-axis direction perpendicular to the X-axis direction of the detection surface” in the 11th and 12th lines of page 26 is
Correct in the axial direction. ]33. Correct "Y-axis direction" on page 226, line 113 to "X-axis direction." 14, page 26, line 15, "the X-axis in the Z-axis direction forming 45 degrees" is corrected to "the axis in the 45-degree direction". Attachment 2, Claims Either one of the center part and the peripheral part is used as a support part and the other part is used as an action part, and a detection surface is formed between the two, and the center part and the peripheral part are larger than the detection surface. A flat plate-shaped flexural body with increased rigidity is formed, and the electric resistance is changed in the X-axis direction of the detection surface of the flat plate-shaped flexural body by mechanical deformation in the X-axis direction. A detection element for detecting a component force in the Y-axis direction on the face 3ζ is formed, and
A detection element for detecting a component force in the 1ti33 direction by mechanically deforming it in the Y-axis direction is formed to change the electrical resistance, and the detection element is arranged at an angle of 45 degrees with respect to the X-axis and Y-axis directions of the detection surface. A force detection device comprising a detection element for detecting a component force in the X-axis direction that changes electrical resistance by mechanical deformation of the force.

Claims (1)

[Claims] A flat plate in which one of a center part and a peripheral part is used as a support part and the other part is used as an action part, a detection surface is formed between the two, and the rigidity of the center part and the peripheral part is greater than that of the detection surface. A detection element is provided for detecting a component force in the X-axis direction, which forms a flat strain-generating body and changes electrical resistance in the X-axis direction of the detection surface of the flat plate-like strain-generating body by mechanical deformation in the X-axis direction. Y that changes the electrical resistance by mechanical deformation in the Y-axis direction perpendicular to the X-axis direction of the detection surface.
A Z element that forms a detection element for detecting component force in the axial direction, and changes electrical resistance by mechanical deformation in the Z-axis direction, which is at an angle of 45 degrees with the X-axis and Y-axis directions of the detection surface. A force detection device comprising a detection element for detecting component force in an axial direction.