JPS637458U - - Google Patents

Info

Publication number
JPS637458U
JPS637458U JP10060586U JP10060586U JPS637458U JP S637458 U JPS637458 U JP S637458U JP 10060586 U JP10060586 U JP 10060586U JP 10060586 U JP10060586 U JP 10060586U JP S637458 U JPS637458 U JP S637458U
Authority
JP
Japan
Prior art keywords
metal plating
dispersed
plating phase
electroformed thin
lubricating particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10060586U
Other languages
Japanese (ja)
Other versions
JPH061324Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986100605U priority Critical patent/JPH061324Y2/en
Publication of JPS637458U publication Critical patent/JPS637458U/ja
Application granted granted Critical
Publication of JPH061324Y2 publication Critical patent/JPH061324Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の電鋳薄刃砥石の部
分断面図、第2図は同砥石を製造するための製造
装置を示す縦断面図、第3図は従来の電鋳薄刃砥
石を砥石軸に固定した状態を示す縦断面図である
。 10……金属メツキ相、11……超砥粒、12
……潤滑性粒子。
Fig. 1 is a partial cross-sectional view of an electroformed thin-blade grindstone according to an embodiment of the present invention, Fig. 2 is a vertical cross-sectional view showing a manufacturing device for manufacturing the same grindstone, and Fig. 3 is a partial cross-sectional view of a conventional electroformed thin-blade grindstone. FIG. 3 is a longitudinal cross-sectional view showing a state fixed to a grindstone shaft. 10...Metal plating phase, 11...Super abrasive grain, 12
...Lubricating particles.

Claims (1)

【実用新案登録請求の範囲】 (1) 金属メツキ相中に超砥粒を分散させてなる
円板状の電鋳薄刃砥石において、 前記金属メツキ相中には潤滑性粒子が分散され
ていることを特徴とする電鋳薄刃砥石。 (2) 前記潤滑性粒子は、前記金属メツキ相中に
5〜40vo1%分散されていることを特徴とす
る実用新案登録請求の範囲第1項記載の電鋳薄刃
砥石。
[Scope of Claim for Utility Model Registration] (1) A disk-shaped electroformed thin-blade grindstone comprising superabrasive grains dispersed in a metal plating phase, in which lubricating particles are dispersed in the metal plating phase. An electroformed thin-edged whetstone featuring: (2) The electroformed thin blade grindstone according to claim 1, wherein the lubricating particles are dispersed in the metal plating phase in an amount of 5 to 40 vol%.
JP1986100605U 1986-06-30 1986-06-30 Electroformed thin blade grindstone Expired - Lifetime JPH061324Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986100605U JPH061324Y2 (en) 1986-06-30 1986-06-30 Electroformed thin blade grindstone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986100605U JPH061324Y2 (en) 1986-06-30 1986-06-30 Electroformed thin blade grindstone

Publications (2)

Publication Number Publication Date
JPS637458U true JPS637458U (en) 1988-01-19
JPH061324Y2 JPH061324Y2 (en) 1994-01-12

Family

ID=30970582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986100605U Expired - Lifetime JPH061324Y2 (en) 1986-06-30 1986-06-30 Electroformed thin blade grindstone

Country Status (1)

Country Link
JP (1) JPH061324Y2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009119559A (en) * 2007-11-15 2009-06-04 Disco Abrasive Syst Ltd Cutting blade
JP2012056012A (en) * 2010-09-08 2012-03-22 Disco Corp Cutting grinding wheel
JP2012056013A (en) * 2010-09-08 2012-03-22 Disco Corp Grinding wheel
JP2013132705A (en) * 2011-12-26 2013-07-08 Tokyo Seimitsu Co Ltd Electrocasting blade
JP2013223912A (en) * 2012-04-23 2013-10-31 Tokyo Seimitsu Co Ltd Cutting blade
JP2015116638A (en) * 2013-12-18 2015-06-25 株式会社東京精密 Electroformed blade
JP2019147221A (en) * 2018-02-27 2019-09-05 株式会社ディスコ Electro-deposition grindstone

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013995A (en) * 1973-06-11 1975-02-13
JPS6165776A (en) * 1984-09-06 1986-04-04 Matsushita Electric Ind Co Ltd Manufacture of grinder element for lubricated cutting processing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013995A (en) * 1973-06-11 1975-02-13
JPS6165776A (en) * 1984-09-06 1986-04-04 Matsushita Electric Ind Co Ltd Manufacture of grinder element for lubricated cutting processing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009119559A (en) * 2007-11-15 2009-06-04 Disco Abrasive Syst Ltd Cutting blade
JP2012056012A (en) * 2010-09-08 2012-03-22 Disco Corp Cutting grinding wheel
JP2012056013A (en) * 2010-09-08 2012-03-22 Disco Corp Grinding wheel
JP2013132705A (en) * 2011-12-26 2013-07-08 Tokyo Seimitsu Co Ltd Electrocasting blade
JP2013223912A (en) * 2012-04-23 2013-10-31 Tokyo Seimitsu Co Ltd Cutting blade
JP2015116638A (en) * 2013-12-18 2015-06-25 株式会社東京精密 Electroformed blade
JP2019147221A (en) * 2018-02-27 2019-09-05 株式会社ディスコ Electro-deposition grindstone
TWI781293B (en) * 2018-02-27 2022-10-21 日商迪思科股份有限公司 Electroplating grindstone

Also Published As

Publication number Publication date
JPH061324Y2 (en) 1994-01-12

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