JPS6373697A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS6373697A JPS6373697A JP22001386A JP22001386A JPS6373697A JP S6373697 A JPS6373697 A JP S6373697A JP 22001386 A JP22001386 A JP 22001386A JP 22001386 A JP22001386 A JP 22001386A JP S6373697 A JPS6373697 A JP S6373697A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- printed wiring
- wiring board
- nickel plating
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 88
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 84
- 229910052759 nickel Inorganic materials 0.000 claims description 42
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 29
- 239000010931 gold Substances 0.000 claims description 28
- 229910052737 gold Inorganic materials 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 229910000521 B alloy Inorganic materials 0.000 claims description 2
- 229910018104 Ni-P Inorganic materials 0.000 claims description 2
- 229910018536 Ni—P Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ワイヤボンディング用プリント配線板に関す
る。特に良好なワイヤボンディング特性を有し、しかも
品質の安定した安価なプリント配線板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board for wire bonding. The present invention particularly relates to an inexpensive printed wiring board that has good wire bonding characteristics and is stable in quality.
［従来の技術］
この種のワイヤボンディング用プリント配線板に関して
は、特公昭５７−５７８６４号公報、特公昭６０−３７
６４０号公報に見られる様に、従来、銅張り積層板を出
発材料とし、穴あけ、銅めっき、エツチングにてパター
ン形成を行ない、次に銅１−に′准解ニッケルめっきを
施し、さらに電解ニッケルめっき上に電解金めっきを施
したプリント配線板を使用している。従来、ニッケルめ
っき及び金めつきは、前述したように、電解めっきを用
いているため、下記の６項目が問題となっている。[Prior Art] This type of printed wiring board for wire bonding is disclosed in Japanese Patent Publications No. 57-57864 and Japanese Patent Publication No. 60-37.
As seen in Publication No. 640, conventionally, a copper-clad laminate is used as a starting material, and a pattern is formed by drilling, copper plating, and etching, and then semi-chemical nickel plating is applied to the copper 1-, and then electrolytic nickel is applied. A printed wiring board with electrolytic gold plating applied on top of the plating is used. Conventionally, as described above, electrolytic plating has been used for nickel plating and gold plating, and the following six items have become a problem.
まず、■プリント配線板としての必要な配線以外に、め
っきを施すための配線が必要となるため、導体回路を設
計する上で、非常に煩く、多大の時間を必要とする。First, (1) In addition to the wiring necessary for the printed wiring board, wiring for plating is required, which makes designing a conductor circuit extremely troublesome and requires a lot of time.
■余分なめっき用の配線が生じるため、エツチングによ
るパターン形成時における断線不良の確率が高くなる。(2) Since extra wiring for plating is generated, the probability of disconnection during pattern formation by etching increases.
■プリント配線板として使用するにあたり、めっき用の
配線は邪魔であるため、ニッケルめっき及び金めつきを
施した後にそれら配線を除去する余分な工程か必要であ
る。■When used as a printed wiring board, the plating wiring is a hindrance, so an extra step is required to remove the wiring after nickel plating and gold plating.
また、■ボンディングの信頼性を上げるため、ある一定
以上のめっき厚みが必要であるが、電解めっきであるた
め、めっき厚みのばらつきが大であり、余分なめっきを
施すことになる。In addition, (1) In order to improve the reliability of bonding, a plating thickness of a certain level or more is required, but since it is electrolytic plating, there is a large variation in the plating thickness, resulting in the need to apply extra plating.
つまり、ワイヤボンディングの信頼性を上げるため、全
ての被めっき箇所に対して一定以上のめっき厚みが得ら
れる様に析出量を制御しなければならず、めっきの析出
し易い箇所は非常に多くめっきが析出してしまい、非常
に無駄であり、■時には不良の原因（電波密度が高くな
りすぎ、めっきがヤケてしまい、ワイヤボンディングで
きなくなる。）となる。In other words, in order to increase the reliability of wire bonding, the amount of precipitation must be controlled so that a plating thickness of a certain level or more can be obtained for all the parts to be plated, and there are many places where plating is likely to precipitate. is deposited, which is very wasteful and sometimes causes defects (the radio wave density becomes too high, the plating fades, and wire bonding becomes impossible).
また、■従来から知られている様に、Ｍｉ音波接合法を
用いて、アルミ線・金線等をボンディングするための樹
脂を基板とするプリント配線板においては、ワイヤと電
極表面との接着力は基板上の電極表面の硬さに影響を受
ける。つまり、電極表面が硬いと、ワイヤをボンディン
グする際の加圧力及び長時間におよぶ摩擦熱による高温
状態に対して電極表面が変形せず、ワーｒヤの接着力が
向上する。これは、ノミ極表面が硬く、変形しないので
、電極とワイヤとの両金属が接合面全面で十分に拡散す
るためと考えられる。In addition, as has been known in the past, in printed wiring boards with resin substrates for bonding aluminum wires, gold wires, etc. using the Mi sonic bonding method, the adhesive strength between the wires and the electrode surfaces is affected by the hardness of the electrode surface on the substrate. In other words, if the electrode surface is hard, the electrode surface will not be deformed by pressure applied during wire bonding and high temperature conditions caused by frictional heat over a long period of time, and the bonding force of the wire will be improved. This is thought to be because the surface of the chisel electrode is hard and does not deform, so both the metals of the electrode and wire are sufficiently diffused over the entire joint surface.
したがって、電極を電解ニッケルを用い゛Ｃ形成する場
合、表面硬度が小さい（ビッカース硬度：２５０〜１５
０Ｈｖ ）ため拡散係数の大きな金めつき等を一定の厚
み以上流さなければならず、非常に高価なプリント配線
板となつてしまう。Therefore, when the electrode is formed using electrolytic nickel, the surface hardness is small (Vickers hardness: 250 to 15
0Hv), gold plating or the like with a large diffusion coefficient must be applied to a certain thickness or more, resulting in a very expensive printed wiring board.
［発明の解決しようとする問題点］
以上述べた様に、ワイヤボンディング用プリント配線板
に電解ニッケルめワき及び電解金めっきを用いた場合、
導体回路を設計する段階においては非常に多大の時間を
浪費し、製造においては不良率か高くなり、工程数か増
え、無駄なめっきが多くなる。その結果、非常に高価で
、品質のばらつきの大きなプリント配線板となる。[Problems to be solved by the invention] As described above, when electrolytic nickel plating and electrolytic gold plating are used for wire bonding printed wiring boards,
An extremely large amount of time is wasted in the stage of designing a conductor circuit, and in manufacturing, the defective rate is high, the number of steps increases, and there is a lot of wasteful plating. The result is a printed wiring board that is very expensive and has a wide variation in quality.
そして、本発明の目的は、良好なワイヤボンディング特
性を有し、しかも品質の安定した安価なプリント配線板
を提供することにある。An object of the present invention is to provide an inexpensive printed wiring board that has good wire bonding characteristics and is stable in quality.
［問題点を解決するための手段］
本発明は、従来技術の問題点を解決し、上記目的を達成
すべくなされたものである。即ち、従来は、前述した如
く、ニッケルめっき及び金めつきを施す場合に電解めっ
きを用いたため、非常に多くの問題が生じていた。[Means for Solving the Problems] The present invention has been made to solve the problems of the prior art and achieve the above objects. That is, as described above, in the past, electrolytic plating was used to perform nickel plating and gold plating, which caused many problems.
これらの問題点を解決するために本発明か採った手段は
、
「超音波接合法を用いてワイヤボンディングがなされる
プリント配線板において、樹脂を基板とし、前記基板上
に銅にて導体回路及び電極を形成し、前記電極上に無電
解ニッケルめっきを施し、さらに前記無電解ニッケルめ
っき上に無電解金めつきを施してなることを特徴とする
プリント配線板」
てあり、電解ニッケルめっき及び電解金めっきのかわり
に、無電解ニッケルめフき及び無電解金めっきを用いる
ことにより、これらの問題点を解決することがてきるこ
とを見出した。すなわち、ニッケルめっき及び金めつき
とも無電解めっきであるため、ニッケルめっき及び金め
つきを施すための配線は不必要であり、導体回路を設計
する上で設計時間を短縮でき、また、めっき用の配線を
除去する工程を省略することができる。しかも。The means taken by the present invention to solve these problems is as follows: ``In a printed wiring board in which wire bonding is performed using an ultrasonic bonding method, a resin is used as a substrate, and a conductive circuit and a copper circuit are formed on the substrate. A printed wiring board characterized by forming an electrode, electroless nickel plating on the electrode, and electroless gold plating on the electroless nickel plating. It has been found that these problems can be solved by using electroless nickel plating and electroless gold plating instead of gold plating. In other words, since both nickel plating and gold plating are electroless plating, there is no need for wiring for nickel plating and gold plating, which shortens the design time when designing conductor circuits. The step of removing the wiring can be omitted. Moreover.
Ｓ電解めっきは化学的還元反応をもとにめっきを析出さ
せるものであるため、めっき液と接触している部分は均
一にめっきが析出するという特性を有しており、めっき
厚みのばらつきがほとんどなく、無駄なめっきを行なわ
なくて済む、また、前述した様に、無電解ニッケルめっ
きは化学的還元反応をもとにめっきの析出を起こさせる
ため、無電解ニッケルめっき浴には、次亜リン酸ナトリ
ウムまたはジメチルアミンボラン等の還元剤を含有して
いる。そのため、無電解ニッケルめっき皮膜は、Ｎｉ−
Ｐ合金またはＮｉ−Ｂ合金となり、非常に硬い皮膜（ビ
ッカース硬度：Ｎｉ−Ｐ・・・５５０〜６５０ Ｈｖ、
Ｎ １−Ｂ＝７００〜８００ Ｈｖ）となる。Since S electrolytic plating deposits plating based on a chemical reduction reaction, it has the characteristic that plating is deposited uniformly on areas that are in contact with the plating solution, and there is almost no variation in plating thickness. In addition, as mentioned above, electroless nickel plating causes plating precipitation based on a chemical reduction reaction, so hypophosphorus is not added to the electroless nickel plating bath. Contains a reducing agent such as sodium acid or dimethylamine borane. Therefore, the electroless nickel plating film is
It becomes P alloy or Ni-B alloy, and has a very hard film (Vickers hardness: Ni-P...550-650 Hv,
N1-B=700-800 Hv).
つまり、無電解ニッケル皮膜は非常に硬いため、鋼上に
無電解ニッケルめっきを施すだけで、アルミ線、金線等
を用いての超音波接合法を用いてのワイヤボンディング
は可使である。しかし、無電解ニッケルめっきは長時間
空気中に放置すると表面が酸化し、ワイヤボンディング
の接着力が低下して信頼性が劣るため、無電解ニッケル
めっき上にはニッケルめっきの酸化が防止可ｆｌな程度
の薄い金めつきは必要である。したがって、電解ニッケ
ルめっきを用いるかわりに無電解ニッケルめっきを用い
ることにより、金の使用量を非常に節約することができ
るのである。In other words, since the electroless nickel film is very hard, wire bonding using an ultrasonic bonding method using aluminum wire, gold wire, etc. can be used simply by applying electroless nickel plating on steel. However, if electroless nickel plating is left in the air for a long time, the surface will oxidize, reducing the adhesive strength of wire bonding and making it less reliable. A light gold plating is necessary. Therefore, by using electroless nickel plating instead of electrolytic nickel plating, the amount of gold used can be greatly reduced.
以上述べた様に、電解ニッケルめっき及び電解金めっき
のかわりに、無電解ニッケルめっき及び無電解金めっき
を使用することにより、良好なボンディング特性を有し
、しかも品質の安定した安価なプリント配線板を得るこ
とができる。As mentioned above, by using electroless nickel plating and electroless gold plating instead of electrolytic nickel plating and electrolytic gold plating, inexpensive printed wiring boards with good bonding properties and stable quality can be produced. can be obtained.
本発明で用いる無電解ニッケルめっき浴は、現在市販さ
れているものならどれでも良い、無電解ニッケルめっき
の厚みは、ｌｐｍ未満であると電極表面硬度が低く、無
電解ニッケルめっきとしての効果が得られず、また無電
解ニッケルめっきの厚みが１５ＪＬｍを超えるとＴｆｔ
極表面硬度はほぼ一定となり、１５ｐｍを超える無電解
ニッケルめっきは無駄である。したがって、無電解ニッ
ケルめっきの厚みはｌＩＬｍ−１５１Ｌｍの範囲内が良
好である。The electroless nickel plating bath used in the present invention may be any one that is currently commercially available. If the thickness of the electroless nickel plating is less than lpm, the electrode surface hardness will be low and the effect as electroless nickel plating will not be obtained. If the thickness of electroless nickel plating exceeds 15 JLm, Tft
The extreme surface hardness becomes almost constant, and electroless nickel plating exceeding 15 pm is wasteful. Therefore, the thickness of the electroless nickel plating is preferably within the range of lILm-151Lm.
同様に１本発明で用いられるｓＭｌ解金めつき浴として
は、現在市販されているものならどれでも良く、置換タ
イプのみで無電解金めっきを施しても、２１換タイプと
還元タイプを組合せて無電解金めワきを施してもどちら
でも良い。また、無電解金めっき厚みは、無電解二・ν
ケルめっきの酸化を防［・できる程度で良いため、 ０
．０１ｐｍから０．３ルｍの範囲内が良好である。Similarly, the sMl electrolytic plating bath used in the present invention may be any one that is currently commercially available, and even if electroless gold plating is performed using only the displacement type, it may be a combination of the 21 conversion type and the reduction type. Either electroless gold plating may be applied. In addition, the thickness of electroless gold plating is
Prevent oxidation of KEL plating [・As long as it can be done, 0
．． A range of 0.01 pm to 0.3 pm is good.
以下、本発明を比較例及び実施例により詳細に説明する
。Hereinafter, the present invention will be explained in detail with reference to comparative examples and examples.
［発明の実施例］
ル艶潰
ガラスエポキシ銅張り８１層板を樹脂基板とし、トリル
を用いて任意の位置にスルーホールを形成する。スルー
ホールを含む前記基板全面に！Ｉｉ電解銅めっき及び電
解鋼めっきを約２５ｐＬ−施す０次に日立化成工業（株
）製アルカリ現像型ドライフィルムを用いて銅めっき上
の任意の部分に耐エツチングレジストを形成し、塩化第
二銅エツチング液を用いて余分な銅を溶解除去し、導体
回路を形成する。[Embodiments of the Invention] An 81-layer glass epoxy-copper-clad board was used as a resin substrate, and through holes were formed at arbitrary positions using a trill. All over the board including through holes! Approximately 25 pL of Ii electrolytic copper plating and electrolytic steel plating are applied. Next, an etching resist is formed on any part of the copper plating using an alkaline developing type dry film manufactured by Hitachi Chemical Co., Ltd., and cupric chloride is applied. Excess copper is dissolved and removed using an etching solution to form a conductor circuit.
さらに、部品接続用の電極及びスルーホール以外をソル
ダーレジストで覆い、銅の露出している部分に電解ニッ
ケルめっき（ワット浴）及び電解金めっきを用いてニッ
ケルめっきを５ｇｍ以Ｆ、そして金めつきを０．５ ｕ
Ｌｍ以り施す。前記工程で処理し、得られたサンプルに
キューソウク・アン第２表
ト・ソファ（株）製モデル４１２３ウェッジ・ボンダー
を用いてアルミ線をボンディングする。（株）レスカ製
ゾルテスタアＰＴＲ−１００Ｓ及び実体顕微鏡を用いて
、ワイヤボンディング強度及び破壊部位を測定した。同
様に、１５０℃ ２４時間及び６日間エージング後のボ
ンディング強度及び破壊部位を測定した。その結果を第
１表に示す。Furthermore, areas other than the electrodes and through-holes for connecting parts are covered with solder resist, and the exposed copper parts are coated with nickel plating of 5 gm or more using electrolytic nickel plating (Watt bath) and electrolytic gold plating, and then gold plating. 0.5 u
Apply from Lm. An aluminum wire is bonded to the sample treated in the above process using a model 4123 wedge bonder manufactured by Kyusouk Ann 2nd Table Sofa Co., Ltd. The wire bonding strength and the fracture site were measured using Soltesta PTR-100S manufactured by Reska Co., Ltd. and a stereoscopic microscope. Similarly, the bonding strength and fracture site were measured after aging at 150° C. for 24 hours and 6 days. The results are shown in Table 1.
また、前記サンプルのクロスセクションを行ない、ニッ
ケルめっきの厚みを測定した０次に、セイコー電子工業
（株）製ケイ光Ｘ線微小部膜厚計５ＦＴ−１５７を用い
て金めつきの厚みを測定した。その結果を第２表に示す
。In addition, the sample was cross-sectioned to measure the thickness of the nickel plating. Next, the thickness of the gold plating was measured using a fluorescent X-ray microscopic film thickness meter 5FT-157 manufactured by Seiko Electronics Co., Ltd. . The results are shown in Table 2.
実施例
ガラスエポキシ銅張り積層板を樹脂基板とし、ドリルを
用いて任意の位置にスルーホールを形成する。スルーホ
ールを含む前記基板全面に、無電解銅めっき及び電解銅
めっきを約２ＳＩＬａ施す０次に、ロ立化或工業（株）
製アルカリ現像型ドライフィルムを用いて銅めっき上の
任意の部分に耐エツチングレジストを形成し、塩化第二
銅エツチング掖を用いて余分な銅を溶解除去し、導体回
路を形成する。EXAMPLE A glass epoxy copper-clad laminate is used as a resin substrate, and through holes are formed at arbitrary positions using a drill. Approximately 2 SILa of electroless copper plating and electrolytic copper plating is applied to the entire surface of the board, including the through holes, followed by Ritsuka Kogyo Co., Ltd.
An etching-resistant resist is formed on any part of the copper plating using an alkali-developable dry film, and excess copper is dissolved and removed using a cupric chloride etching scoop to form a conductor circuit.
さらに、部品接続用の電極及びスルーホール以外をソル
ダーレジストで覆い、銅の露出している部分に１日本カ
ニゼン（株）製シューマー・Ｓ−７８０を用いて無電解
ニッケルめっきを３ｇｍ以上施し、その無電解ニッケル
めっき上に日本エレクトロプレイティングエンジニャー
ス（株）製しクトロレス・プレツブを用いて無電解金め
っきを０．１俸璽以上施した。前記工程で処理し得られ
たサンプルにキューリツク・アンド・ソファ（株）製モ
デル４１２３ウェッジ・ボンダーを用いてアルミ線をボ
ンディングする。（株）レスカ製プルテスタ０ＴＲ−１
００Ｓ及び実体顕微鏡を用いて、ボンディング強度及び
破壊部位を測定した。Furthermore, areas other than the electrodes and through-holes for connecting components are covered with solder resist, and the exposed copper parts are electroless nickel plated to a thickness of 3 gm or more using Schumer S-780 manufactured by Nippon Kanigen Co., Ltd. On the electroless nickel plating, electroless gold plating of 0.1 g or more was applied using a Ctrores plate manufactured by Nippon Electroplating Engineers Co., Ltd. An aluminum wire is bonded to the sample processed in the above process using a model 4123 wedge bonder manufactured by Kulick & Sofer Co., Ltd. Pull tester 0TR-1 manufactured by Reska Co., Ltd.
Bonding strength and fracture site were measured using 00S and a stereomicroscope.
同様に、１５０℃２４時間及び６日間エージング後のボ
ンディング強度及び破壊部位を測定した。その結果を第
１表に示す。また、前記サンプルのクロスセクションを
行なって無電解ニッケルめっきの厚みを測定した。さら
に、セイコー電子工業３株）製ケイ光Ｘ線微小部膜厚計
５ＦＴ−１５７を用いて金めつきの厚みを測定した。そ
の結果を第２表に示す。Similarly, the bonding strength and fracture site were measured after aging at 150° C. for 24 hours and 6 days. The results are shown in Table 1. Further, the sample was cross-sectioned to measure the thickness of the electroless nickel plating. Further, the thickness of the gold plating was measured using a fluorescent X-ray microscopic film thickness meter 5FT-157 manufactured by Seiko Electronics Industries, Ltd. 3). The results are shown in Table 2.
［発明の効果］
以上詳述した通り、本発明にあっては、上記実施例にて
例示した如く、
「超音波接合法を用いてワイヤボンディングがなされる
プリント配線板において、樹脂を基板とし、前記基板上
に銅にて導体回路及び電極を形成し、前記電極上に無電
解ニッケルめっきを施し、さらに前記無電解ニッケルめ
っき上に無電解金めっきを施してなること」
にその特徴があり、これにより、良好なワイヤボンディ
ング特性を有し、しかも品質の安定した安価なプリント
配線板を提供することがてきるのである。[Effects of the Invention] As detailed above, in the present invention, as exemplified in the above embodiments, "In a printed wiring board on which wire bonding is performed using an ultrasonic bonding method, a resin is used as a substrate, A conductive circuit and electrodes are formed from copper on the substrate, electroless nickel plating is applied on the electrodes, and electroless gold plating is applied on the electroless nickel plating.'' This makes it possible to provide an inexpensive printed wiring board that has good wire bonding characteristics and is stable in quality.
すなわち１本発明に係るプリント配線板は、第１表及び
第２表からも明白な様に、鋼上に無電解ニッケルめっき
を施し、さらに前記無電解ニッケルめっき上に無電解金
めっきを施してから、超音波接合法を用いてワイヤボン
ディングしたことによって形成したものであるから、ボ
ンディングワイヤの剥離が全くないという良好なボンデ
ィング特性を有し、しかもボンディング強度の経時劣化
及びバラツキが少なく、品質が安定しているのである。Namely, as is clear from Tables 1 and 2, the printed wiring board according to the present invention includes electroless nickel plating on steel, and electroless gold plating on the electroless nickel plating. Since it is formed by wire bonding using an ultrasonic bonding method, it has good bonding characteristics with no peeling of the bonding wire, and there is little deterioration or variation in bonding strength over time, and the quality is high. It is stable.
図面は第１表に示した破壊部位を示すための断面図であ
る。The drawing is a sectional view showing the fractured parts shown in Table 1.
Claims (1)
れるプリント配線板において、樹脂を基板とし、前記基
板上に銅にて導体回路及び電極を形成し、前記電極上に
無電解ニッケルめっきを施し、さらに前記無電解ニッケ
ルめっき上に無電解金めっきを施してなることを特徴と
するプリント配線板。 ２）．前記無電解ニッケルめっきは、Ｎｉ−Ｐ合金もし
くはＮｉ−Ｂ合金であることを特徴とする特許請求の範
囲第１項記載のプリント配線板。 ３）．前記無電解ニッケルめっきの厚みが１〜１５μｍ
の範囲内であることを特徴とする特許請求の範囲第１項
記載のプリント配線板。 ４）．前記無電解金めっきの厚みが０．０１〜０．３μ
ｍの範囲内であることを特徴とする特許請求の範囲第１
項記載のプリント配線板。[Claims] 1). In a printed wiring board on which wire bonding is performed using an ultrasonic bonding method, a resin is used as a substrate, a conductive circuit and an electrode are formed of copper on the substrate, electroless nickel plating is applied on the electrode, and the above-mentioned A printed wiring board characterized by applying electroless gold plating on electroless nickel plating. 2). 2. The printed wiring board according to claim 1, wherein the electroless nickel plating is a Ni-P alloy or a Ni-B alloy. 3). The thickness of the electroless nickel plating is 1 to 15 μm.
The printed wiring board according to claim 1, wherein the printed wiring board is within the range of the following. 4). The thickness of the electroless gold plating is 0.01 to 0.3μ
Claim 1 characterized in that it is within the range of m.
Printed wiring board as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22001386A JPS6373697A (en) | 1986-09-17 | 1986-09-17 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22001386A JPS6373697A (en) | 1986-09-17 | 1986-09-17 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373697A true JPS6373697A (en) | 1988-04-04 |
Family
ID=16744563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22001386A Pending JPS6373697A (en) | 1986-09-17 | 1986-09-17 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373697A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6645606B2 (en) | 2001-06-06 | 2003-11-11 | Denso Corporation | Electrical device having metal pad bonded with metal wiring and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757864A (en) * | 1980-08-26 | 1982-04-07 | Hitachi Metals Ltd | Coated super hard alloy tool |
| JPS6037640A (en) * | 1983-07-08 | 1985-02-27 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | Color display tube |
-
1986
- 1986-09-17 JP JP22001386A patent/JPS6373697A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757864A (en) * | 1980-08-26 | 1982-04-07 | Hitachi Metals Ltd | Coated super hard alloy tool |
| JPS6037640A (en) * | 1983-07-08 | 1985-02-27 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | Color display tube |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6645606B2 (en) | 2001-06-06 | 2003-11-11 | Denso Corporation | Electrical device having metal pad bonded with metal wiring and manufacturing method thereof |
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