JPS6372182A - Printed wiring board with grounding layer - Google Patents
Printed wiring board with grounding layerInfo
- Publication number
- JPS6372182A JPS6372182A JP21598386A JP21598386A JPS6372182A JP S6372182 A JPS6372182 A JP S6372182A JP 21598386 A JP21598386 A JP 21598386A JP 21598386 A JP21598386 A JP 21598386A JP S6372182 A JPS6372182 A JP S6372182A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- hole
- solder
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 35
- 229910000679 solder Inorganic materials 0.000 claims description 32
- 239000010410 layer Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002131 composite material Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概 要〕
その表面にアース導体層を有する印刷配線基板であって
、基板とアース導体層とは絶縁性接着層を介して接合さ
れ、該両者間の電気的接続は両者のスルーホール同士、
又はスルーホールと接続パターンを半田により接続する
ことによりなされ、この接続部における基板とアース導
体層との間に溶融半田がその表面張力によって進入可能
スリット溝を設けることにより、前記基板とアース層と
を確実に接続すること、及び前記アース層の外側に露出
するスルーホールランド上の半田の盛り上りを少くする
ことが可能となり特に接続部の信頼性を格段に向上した
ものである。[Detailed Description of the Invention] [Summary] A printed wiring board having a ground conductor layer on its surface, wherein the board and the ground conductor layer are bonded via an insulating adhesive layer, and an electrical connection between the two is established. is between the two through holes,
Or by connecting the through hole and the connection pattern with solder, and by providing a slit groove between the board and the ground conductor layer at this connection part through which molten solder can enter due to its surface tension, the connection between the board and the ground conductor layer is made. This makes it possible to connect reliably and to reduce the buildup of solder on the through-hole land exposed to the outside of the ground layer, thereby significantly improving the reliability of the connection.
本発明は印刷配線基板上に絶縁性接着層を介してアース
導体層を接合して成る印刷配線複合基板に関し、特に、
高周波機能モジュール等を印刷配線基板で接続する際に
各機能モジュール間或いは接続信号線路間での電磁干渉
を防ぐべく機能モジュールのシールドケース・アースを
確実にするため、或いは信号線路からの電磁放散を防ぐ
ため、印刷配線基板の表裏両手面をアース導体でシール
ドし、且つ、印刷配線基板内に構成した信号線路間の干
渉の防止及び表裏面のアース電位を共通とする為、所望
のアース相互′ａ続（必ずしも必要でない）を行うよう
にした、印刷配線基板に関する。The present invention relates to a printed wiring composite board in which a ground conductor layer is bonded to a printed wiring board via an insulating adhesive layer, and in particular,
When connecting high-frequency function modules, etc. with a printed wiring board, in order to prevent electromagnetic interference between each function module or between connected signal lines, to ensure the shield case and grounding of the function modules, or to prevent electromagnetic radiation from signal lines. In order to prevent interference between the signal lines configured in the printed wiring board and to make the ground potential common between the front and back surfaces, the two sides of the printed wiring board are shielded with ground conductors. The present invention relates to a printed wiring board that performs a continuation (not necessarily required).
ところで近年、電子機器の軽薄短小化或いは生産性向上
の要求が強くなり、この要求に応えて、部品実装、平面
配線及び平面回路の構成に優れたりジッド基板と、可撓
性により立体配線の構成に優れたフレキシブル基板とを
組合せて接合形成し、多層配線基板の機能と、フレキシ
ブル基板の接続機能とを有する複合基板が開発されてい
る。本発明も主としてこのような複合基板を対象として
開発されたものであり従って以下の実施例においても複
合基板を例にとって説明するが本発明はかかる複合基板
に限定されず印刷配線基板全搬に適用できるものである
。However, in recent years, there has been a strong demand for electronic equipment to be lighter, thinner, shorter, and more compact, and to improve productivity. A composite board has been developed that is formed by bonding together a flexible board with excellent properties, and has the function of a multilayer wiring board and the connection function of a flexible board. The present invention was also developed primarily for such composite boards, and therefore, the following embodiments will also be explained using composite boards as an example, but the present invention is not limited to such composite boards, but can be applied to all types of printed wiring boards. It is possible.
第３図は従来のフレキシブル及びリジッド印刷配線複合
基板の要部を示す側面断面図である。同図において、符
号１はフレキシブル印刷配線基板（以下、ＦＰＣ基板と
呼ぶ）、２はリジッド印刷配線基板（以下、ＲＰＣ基板
と呼ぶ）、３ａ、３ｂは絶縁性接着剤より成る接着層、
４は半田、５ａ 、 ５ｂはアース導体板（Ｃｕ等）を
それぞれ示す。この従来例は、アース導体板５ａ 、
５ｂの所定位置に形成されたスルーホール１１ａ 、
１１ｂがＦＰＣ基板１及びＲＰＣ基板２に夫々形成され
たスルーホール１３゜１４あるいは接続パターン（ラン
ド部）１５にそれぞれ整合して配置され、接着層３ｂ
、 ３ａを介してアース導体板５ａ、５ｂ、ＦＰＣ基板
１、及びＲＰＣ基板２が夫々接合され、半田４によって
アース導体板５ａ 、 ５ｂのスルーホール１１ａ 、
１１ｂがＦＰＣ基板１のスルーホール
ル１４あるいは接続パターン１５にそれぞれ接続され、
これにより接続部Ｐが形成される。そして、この場合、
接続部Ｐにおける接着層３ｂはその逃げ穴１７の内径が
アース導体板５ａ 、 ５ｂのスルーホール１１ａ 、
１１ｂと略同−内径に形成されている。FIG. 3 is a side sectional view showing the main parts of a conventional flexible and rigid printed wiring composite board. In the figure, numeral 1 is a flexible printed wiring board (hereinafter referred to as an FPC board), 2 is a rigid printed wiring board (hereinafter referred to as an RPC board), 3a and 3b are adhesive layers made of an insulating adhesive,
4 represents solder, and 5a and 5b represent earth conductor plates (Cu, etc.), respectively. This conventional example includes a ground conductor plate 5a,
A through hole 11a formed at a predetermined position of 5b,
11b are arranged in alignment with through holes 13 and 14 or connection patterns (land portions) 15 formed in the FPC board 1 and RPC board 2, respectively, and the adhesive layer 3b
, 3a, the ground conductor plates 5a, 5b, the FPC board 1, and the RPC board 2 are respectively joined, and the through holes 11a of the ground conductor plates 5a, 5b are connected by solder 4.
11b are respectively connected to the through hole rule 14 or the connection pattern 15 of the FPC board 1,
As a result, a connecting portion P is formed. And in this case,
The inner diameter of the escape hole 17 of the adhesive layer 3b at the connection part P is the through hole 11a of the ground conductor plate 5a, 5b,
It is formed to have approximately the same inner diameter as 11b.
尚、符号１９ 、 ２０は夫々ＦＰＣ基板１のスルーホ
ールランド、ＲＰＣ基板２のスルーホールランドである
。Note that numerals 19 and 20 are through-hole lands of the FPC board 1 and through-hole lands of the RPC board 2, respectively.
上記従来例には次のような問題がある。即ち、接続部Ｐ
における接着層３ｂの逃げ穴１７の内径がアース導体板
５ａ 、 ５ｂのスルーホール１１ａ． １１ｂと略同
−内径に形成されているので、半田付けの際に半田４が
薄肉の接着層３ｂのスルーホールの内端面にぬれにクク
、逆にはじかれる状態になるので、ブリフジ状になって
スルーホール１ １ａ． １１ｂとＦＰＣ基板１のスル
ーホール１３及び接続パターン１５を接続することにな
り、ＦＰＣ基板１のスルーホールランド１９又は接続パ
ターン１５に対する接着面積が小となり、接続状態が不
安定となって接続の信頼性が低くなる。特に、アース導
体層のスルーホールとＦＰＣ基板１の接続パターン１５
を接続する際には、半田４が接着層３ｂにはじかれて接
続不良が発生し易い。The above conventional example has the following problems. That is, the connection part P
The inner diameter of the escape hole 17 in the adhesive layer 3b is the same as that of the through hole 11a in the ground conductor plates 5a, 5b. 11b, so during soldering, the solder 4 wets the inner end surface of the through-hole of the thin adhesive layer 3b and is repelled, resulting in a bulge-like shape. Through hole 1 1a. 11b and the through hole 13 and connection pattern 15 of the FPC board 1, the adhesive area for the through hole land 19 of the FPC board 1 or the connection pattern 15 becomes small, and the connection state becomes unstable and the reliability of the connection is reduced. sex becomes lower. In particular, the connection pattern 15 between the through hole in the ground conductor layer and the FPC board 1
When connecting, the solder 4 is likely to be repelled by the adhesive layer 3b, resulting in a poor connection.
本発明は上記の問題点にかんがみて創作されたもので、
アース導体層とＦＰＣ基板あるいはＲＰＣ基板の接続を
確実に行ない信頼性を高め、接続部の大形化を防止し、
更に基板の多層化を可能ならしめる印刷配線基板を提供
することを目的とする。The present invention was created in view of the above problems.
Ensures the connection between the ground conductor layer and the FPC board or RPC board to increase reliability and prevent the connection from becoming larger.
A further object of the present invention is to provide a printed wiring board that allows the board to be multilayered.
上記問題点を解決するための手段として、本発明によれ
ば、第１図に例示するように、印刷配線基板（１ 、
２）の少くとも片面に絶縁性接着層３ｂを介してアース
導体層（５ａ 、 ５ｂ）を重合すると共に該アース導
体層に形成したスルーホール１７と上記基板に形成した
対応スルーホール（１３。As a means for solving the above problems, according to the present invention, as illustrated in FIG.
2) A ground conductor layer (5a, 5b) is superimposed on at least one side of the substrate via an insulating adhesive layer 3b, and a through hole 17 formed in the ground conductor layer and a corresponding through hole (13) formed in the substrate.
１４）ないしは接続パターン（１５）とを半田（４）に
接続するアース届け印刷配線基板であって、前記アース
導体層の逃げ穴（１７）と、前記印刷配線基板の対応ス
ルーホール（１３．１４）又は接続パターン（１５）と
を接続する接続部（Ｑ）において前記接着層（３ｂ）に
前記各スルーホール（１１ａ 、 １１ｂ 、 １３
。14) or a grounding printed wiring board for connecting the connection pattern (15) to the solder (4), the escape hole (17) of the grounding conductor layer and the corresponding through hole (13.14) of the printed wiring board. ) or the connection pattern (15), each of the through holes (11a, 11b, 13) is formed in the adhesive layer (3b) at the connection part (Q) that connects
.
１４）よりも大径の逃げ穴（１７）を形成して前記接続
部（Ｑ）における基板とアース導体層との間に半田がそ
の表面張力によって進入可能なスリット溝（２５）を形
成したことを特徴とするアース層材印刷配線基板が提供
される。14) A relief hole (17) with a larger diameter is formed to form a slit groove (25) into which solder can enter due to its surface tension between the board and the ground conductor layer at the connection portion (Q). A ground layer material printed wiring board is provided.
アース導体層５ａ 、 ５ｂとフレキシブル基板１ある
いはリジッド基板２ （ＦＰＣ基板がない場合）の接続
部（Ｑ）にスリット溝（２５）を設けることにより、半
田ディツプ等の手法で半田付けを行なう際に溶融半田が
その表面張力の作用によってスリット溝（２５）内に進
入し、半田デイツプ後、半田レベラー等によって余分な
半田を除去してもスリット溝（２５）内に半田が残留し
、この半田によってアース導体板と基板１．２のスルー
ホールランド１９゜２０相互間を確実に接続することが
できる。そして、スリット溝（２５）を設けることによ
り、アース導体板の外側に露出する半田の盛り上りを小
さくすることができる。By providing a slit groove (25) in the connection part (Q) between the ground conductor layers 5a, 5b and the flexible board 1 or rigid board 2 (if there is no FPC board), it is easy to solder using a solder dip or other method. The molten solder enters the slit groove (25) due to its surface tension, and even if the excess solder is removed using a solder leveler etc. after the solder dip, the solder remains in the slit groove (25). The ground conductor plate and the through-hole lands 19 and 20 of the substrate 1.2 can be reliably connected to each other. By providing the slit groove (25), it is possible to reduce the amount of solder that is exposed on the outside of the ground conductor plate.
第１図は本発明実施例の要部を示す側面断面図、第２図
は本発明実施例の外観斜視図である。尚、これらの図に
おいて、前出の第３図（従来例）と同一部分又は相当部
分は同一符号を付して示しである。FIG. 1 is a side sectional view showing essential parts of an embodiment of the present invention, and FIG. 2 is an external perspective view of the embodiment of the present invention. In these figures, the same or equivalent parts as those in FIG. 3 (conventional example) mentioned above are designated by the same reference numerals.
第２図において、本発明により形成される接続部Ｑ（第
３図の接続部Ｐに相、当）においては接着層３ｂの逃げ
穴１７はアース導体板５ａ 、 ５ｂのスルーホール１
１ａ 、 Ｉｌｂ及びＰＰＣ基板１のスルーホール１３
の内径よりも大きな内径を有し、それによりアース導体
板５ａ 、 ５ｂとＰＰＣ基板１あるいは接続パターン
１５（表面側）あるいはＲＰＣ基板２（裏面側）との間
に凹状のスリット溝２５が形成される。In FIG. 2, in the connection part Q (corresponding to the connection part P in FIG. 3) formed according to the present invention, the relief hole 17 in the adhesive layer 3b is replaced by the through hole 1 in the ground conductor plates 5a and 5b.
1a, Ilb and through hole 13 of PPC board 1
As a result, a concave slit groove 25 is formed between the ground conductor plates 5a and 5b and the PPC board 1 or the connection pattern 15 (front side) or the RPC board 2 (back side). Ru.
本例の外観は、第２図に示すように、ＰＰＣ基板１がＲ
ＰＣ基板２上に全面にわたって接着層（図示せず）を介
して接合され、所定位置に接続部Ｑが設けられ、ＰＰＣ
基板１の端縁の一部が延長されて折曲げられ、立体配線
可能に形成され、これにより多層配線基板の機能と、他
のＦＰＣ基板との接続機能を有する複合基板に形成され
ている。The external appearance of this example is as shown in FIG.
It is bonded over the entire surface of the PC board 2 via an adhesive layer (not shown), and a connection part Q is provided at a predetermined position.
A part of the edge of the board 1 is extended and bent to enable three-dimensional wiring, thereby forming a composite board having the function of a multilayer wiring board and the function of connecting with other FPC boards.
好ましくはアース導体板５ａ、５ｂ、ＰＰＣ基板１、Ｒ
ＰＣ基板２の各スルーホールの内径は略同−に形成され
る。スリット溝５はその幅（厳密にはスルーホールラン
ド１９あるいはパターン１５（表面側）あるいはスルー
ホールランド２０（裏面側）とアース導体板との相互間
隔に対しその深さＤを充分大きく設定し、溶融された半
田４がその表面張力の作用によって進入可能に形成され
る。スリット溝２５の幅はアース導体板５ａ 、 ５ｂ
のスルーホールを円ボス加工により形成することにより
第１図に示す如く一層小さくすることができる。尚、ス
リット溝２５と同様の目的でＰＰＣ基板１とＲＰＣ基板
２との間でも接着層３ａのスルーホールを大径として上
記と同一要領でスリット溝２５′を設けることにより、
良好な接続が得られるがこの点については特願昭６１−
１４２９１８号明細書に詳しく開示されている。本例は
上記のようにアース導体板と基板１または２との間にス
リット溝２５を設けて構成することにより“−半田ディ
ツプ等の手法で半田付けを行なう際に溶融半田がその表
面張力によってスリット溝２５内に進入するので、半田
デイツプ後、半田レベラー等の手法によって接続部Ｑに
熱風を吹き付けて余分な半田を除去しても、第１図に示
すように、半田４は各スルーホール内及びアース導体板
５ａ 、 ５ｂの上下面に薄い半田層として残り、かつ
スリット溝２５内に進入したものは除去されずにメッキ
されたスルーホール相互間及びアース導体板との間を確
実に接続することができる。Preferably ground conductor plates 5a, 5b, PPC board 1, R
The inner diameters of the through holes of the PC board 2 are formed to be approximately the same. The slit groove 5 is set so that its depth D is sufficiently large relative to its width (strictly speaking, the mutual distance between the through-hole land 19 or pattern 15 (on the front side) or the through-hole land 20 (on the back side) and the ground conductor plate, The molten solder 4 is formed to be able to enter due to its surface tension.The width of the slit groove 25 is equal to the width of the ground conductor plates 5a and 5b.
By forming the through hole by circular boss machining, it can be made even smaller as shown in FIG. Incidentally, for the same purpose as the slit groove 25, a slit groove 25' is provided between the PPC board 1 and the RPC board 2 in the same manner as described above by increasing the diameter of the through hole in the adhesive layer 3a.
A good connection can be obtained, but regarding this point, the patent application
It is disclosed in detail in the specification of No. 142918. This example is constructed by providing the slit groove 25 between the ground conductor plate and the substrate 1 or 2 as described above, so that when soldering is performed by a method such as a solder dip, the molten solder is absorbed by its surface tension. Since the solder 4 enters the slit groove 25, even if the excess solder is removed by blowing hot air onto the connection part Q using a solder leveler or the like after the solder dip, as shown in FIG. A thin solder layer remains on the inner and upper surfaces of the ground conductor plates 5a and 5b, and the solder that has entered the slit groove 25 is not removed, ensuring a secure connection between the plated through-holes and with the ground conductor plate. can do.
以上の説明から明らかなように、本発明によれば、フレ
キシブル印刷配線基板（ＦＰＣ基板）１あるいは剛性印
刷配線基板（ＲＰＣ基板）２の接続部（Ｑ）にスリット
溝２５を設けた構造とすることにより、アース導体板と
ＦＰＣ基板１あるいはＲＰＣ基板２との間の接続不良発
生を確実に防止して接続の信頼性を大幅に高めることが
できる。As is clear from the above description, according to the present invention, the structure is such that the slit groove 25 is provided in the connection part (Q) of the flexible printed wiring board (FPC board) 1 or the rigid printed wiring board (RPC board) 2. By doing so, it is possible to reliably prevent the occurrence of a connection failure between the ground conductor plate and the FPC board 1 or the RPC board 2, and to greatly improve the reliability of the connection.
また、外側に露出するスルーホールランドパターンない
しはメッキ上の半田４の盛り上がりを除去できるので、
更に基板の多層化及び半田の使用量の低減化を図ること
ができると共に、部品搭載の不都合を解消することがで
きる。In addition, it is possible to remove the solder 4 bulge on the through-hole land pattern or plating that is exposed to the outside.
Furthermore, it is possible to increase the number of layers on the board and reduce the amount of solder used, and it is also possible to eliminate the inconvenience of mounting components.
第１図は本発明実施例の要部を示す側面断面図、第２図
は本発明実施例の外観斜視図、
第３図は従来例の要部を示す側面断面図である。
第１．２．３図において、
１はフレキシブル印刷配線基Ｆｉ（可撓性印刷配線板：
ＦＰＣ基板）、
２はリジッド印刷配線基板（剛性印刷配線基板：ＲＰＣ
基板）、
３ａ 、 ３ｂは絶縁性接着剤より成る接着層、４は半
田、
５ａ 、 ５ｂはアース導体板、
１１ａ、 １１ｂ、 １３．１４．はスルーホール、１
７は接着層の逃げ穴、
２５はスリット溝、
Ｑは接続部（半田接続部）、
をそれぞれ示す。FIG. 1 is a side sectional view showing the main parts of an embodiment of the present invention, FIG. 2 is an external perspective view of the embodiment of the invention, and FIG. 3 is a side sectional view showing the main parts of a conventional example. In Figure 1.2.3, 1 is a flexible printed wiring board Fi (flexible printed wiring board:
FPC board), 2 is a rigid printed wiring board (rigid printed wiring board: RPC
3a, 3b are adhesive layers made of insulating adhesive, 4 is solder, 5a, 5b are ground conductor plates, 11a, 11b, 13.14. is a through hole, 1
7 indicates an escape hole in the adhesive layer, 25 indicates a slit groove, and Q indicates a connection part (solder connection part).
Claims (1)
層（３ｂ）を介してアース導体層（５ａ、５ｂ）を重合
すると共に該アース導体層に形成したスルーホール（１
１ａ、１１ｂ）と上記基板に形成した対応スルーホール
（１３、１４）ないしは接続パターン（１５）とを半田
（４）により接続するアース層付印刷配線基板であって
、前記アース導体層のスルーホール（１１ａ、１１ｂ）
と前記印刷配線基板（１、２）の対応スルーホール（１
３、１４）又は接続パターン（１５）とを接続する接続
部（Ｑ）において前記接着層（３ｂ）に前記各スルーホ
ール（１１ａ、１１ｂ、１３、１４）よりも大径の逃げ
穴（１７）を形成して前記接続部（Ｑ）における基板と
アース導体層との間に半田（４）がその表面張力によっ
て進入可能なスリット溝（２５）を形成したことを特徴
とするアース層付印刷配線基板。A ground conductor layer (5a, 5b) is superposed on at least one side of the printed wiring board (1, 2) via an insulating adhesive layer (3b), and a through hole (1) is formed in the ground conductor layer.
1a, 11b) and the corresponding through holes (13, 14) or connection pattern (15) formed in the above board by solder (4), the printed wiring board having a ground layer, wherein the through hole in the ground conductor layer (11a, 11b)
and the corresponding through holes (1, 2) of the printed wiring board (1, 2).
3, 14) or the connection pattern (15), the adhesive layer (3b) has an escape hole (17) having a larger diameter than each of the through holes (11a, 11b, 13, 14). A slit groove (25) into which the solder (4) can enter due to its surface tension is formed between the substrate and the earth conductor layer at the connecting portion (Q). substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21598386A JPS6372182A (en) | 1986-09-16 | 1986-09-16 | Printed wiring board with grounding layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21598386A JPS6372182A (en) | 1986-09-16 | 1986-09-16 | Printed wiring board with grounding layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6372182A true JPS6372182A (en) | 1988-04-01 |
Family
ID=16681468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21598386A Pending JPS6372182A (en) | 1986-09-16 | 1986-09-16 | Printed wiring board with grounding layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6372182A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814626U (en) * | 1981-07-21 | 1983-01-29 | オムロン株式会社 | micro switch |
| JPS6039896A (en) * | 1983-08-13 | 1985-03-01 | 松下電工株式会社 | Method of producing multilayer circuit board |
-
1986
- 1986-09-16 JP JP21598386A patent/JPS6372182A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814626U (en) * | 1981-07-21 | 1983-01-29 | オムロン株式会社 | micro switch |
| JPS6039896A (en) * | 1983-08-13 | 1985-03-01 | 松下電工株式会社 | Method of producing multilayer circuit board |
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