JPS6371548U - - Google Patents

Info

Publication number
JPS6371548U
JPS6371548U JP15152287U JP15152287U JPS6371548U JP S6371548 U JPS6371548 U JP S6371548U JP 15152287 U JP15152287 U JP 15152287U JP 15152287 U JP15152287 U JP 15152287U JP S6371548 U JPS6371548 U JP S6371548U
Authority
JP
Japan
Prior art keywords
heat sink
insulator
thick
main surface
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15152287U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0328510Y2 (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987151522U priority Critical patent/JPH0328510Y2/ja
Publication of JPS6371548U publication Critical patent/JPS6371548U/ja
Application granted granted Critical
Publication of JPH0328510Y2 publication Critical patent/JPH0328510Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987151522U 1987-10-02 1987-10-02 Expired JPH0328510Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987151522U JPH0328510Y2 (es) 1987-10-02 1987-10-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987151522U JPH0328510Y2 (es) 1987-10-02 1987-10-02

Publications (2)

Publication Number Publication Date
JPS6371548U true JPS6371548U (es) 1988-05-13
JPH0328510Y2 JPH0328510Y2 (es) 1991-06-19

Family

ID=31068673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987151522U Expired JPH0328510Y2 (es) 1987-10-02 1987-10-02

Country Status (1)

Country Link
JP (1) JPH0328510Y2 (es)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (es) * 1975-04-15 1976-10-22
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (es) * 1981-04-30 1982-11-05

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131174U (es) * 1975-04-15 1976-10-22
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS57175448U (es) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPH0328510Y2 (es) 1991-06-19

Similar Documents

Publication Publication Date Title
JPS6371548U (es)
JPS59117160U (ja) 絶縁物封止半導体装置
JPS59117156U (ja) 絶縁物封止半導体装置
JPH0379443U (es)
JPS59112951U (ja) 絶縁物封止半導体装置
JPS59115653U (ja) 絶縁物封止半導体装置
JPH0336137U (es)
JPS63142849U (es)
JPH0233442U (es)
JPS59112954U (ja) 絶縁物封止半導体装置
JPS63182538U (es)
JPS6371547U (es)
JPH0176040U (es)
JPS6429843U (es)
JPS60130644U (ja) 半導体装置
JPS6212951U (es)
JPS62185340A (ja) 半導体装置
JPS6315056U (es)
JPS633160U (es)
JPS58155838U (ja) 半導体装置
JPH0211341U (es)
JPS61127644U (es)
JPH0183334U (es)
JPS63174458U (es)
JPS62167135U (es)