JPS6371548U - - Google Patents
Info
- Publication number
- JPS6371548U JPS6371548U JP15152287U JP15152287U JPS6371548U JP S6371548 U JPS6371548 U JP S6371548U JP 15152287 U JP15152287 U JP 15152287U JP 15152287 U JP15152287 U JP 15152287U JP S6371548 U JPS6371548 U JP S6371548U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- insulator
- thick
- main surface
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151522U JPH0328510Y2 (US06623731-20030923-C00012.png) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151522U JPH0328510Y2 (US06623731-20030923-C00012.png) | 1987-10-02 | 1987-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6371548U true JPS6371548U (US06623731-20030923-C00012.png) | 1988-05-13 |
| JPH0328510Y2 JPH0328510Y2 (US06623731-20030923-C00012.png) | 1991-06-19 |
Family
ID=31068673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987151522U Expired JPH0328510Y2 (US06623731-20030923-C00012.png) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328510Y2 (US06623731-20030923-C00012.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51131174U (US06623731-20030923-C00012.png) * | 1975-04-15 | 1976-10-22 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS57175448U (US06623731-20030923-C00012.png) * | 1981-04-30 | 1982-11-05 |
-
1987
- 1987-10-02 JP JP1987151522U patent/JPH0328510Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51131174U (US06623731-20030923-C00012.png) * | 1975-04-15 | 1976-10-22 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS57175448U (US06623731-20030923-C00012.png) * | 1981-04-30 | 1982-11-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328510Y2 (US06623731-20030923-C00012.png) | 1991-06-19 |
