JPS6370161U - - Google Patents
Info
- Publication number
- JPS6370161U JPS6370161U JP1986164210U JP16421086U JPS6370161U JP S6370161 U JPS6370161 U JP S6370161U JP 1986164210 U JP1986164210 U JP 1986164210U JP 16421086 U JP16421086 U JP 16421086U JP S6370161 U JPS6370161 U JP S6370161U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- island
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (https=) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (https=) | 1986-10-28 | 1986-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370161U true JPS6370161U (https=) | 1988-05-11 |
| JPH0447966Y2 JPH0447966Y2 (https=) | 1992-11-12 |
Family
ID=31093119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986164210U Expired JPH0447966Y2 (https=) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447966Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009060093A (ja) * | 2007-08-06 | 2009-03-19 | Seiko Instruments Inc | 半導体装置 |
| JPWO2019116457A1 (ja) * | 2017-12-13 | 2020-05-28 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967552U (https=) * | 1972-09-28 | 1974-06-12 | ||
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
-
1986
- 1986-10-28 JP JP1986164210U patent/JPH0447966Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967552U (https=) * | 1972-09-28 | 1974-06-12 | ||
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009060093A (ja) * | 2007-08-06 | 2009-03-19 | Seiko Instruments Inc | 半導体装置 |
| JPWO2019116457A1 (ja) * | 2017-12-13 | 2020-05-28 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447966Y2 (https=) | 1992-11-12 |