JPS636757U - - Google Patents

Info

Publication number
JPS636757U
JPS636757U JP1986101319U JP10131986U JPS636757U JP S636757 U JPS636757 U JP S636757U JP 1986101319 U JP1986101319 U JP 1986101319U JP 10131986 U JP10131986 U JP 10131986U JP S636757 U JPS636757 U JP S636757U
Authority
JP
Japan
Prior art keywords
light
element pellet
emitting element
receiving
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986101319U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986101319U priority Critical patent/JPS636757U/ja
Publication of JPS636757U publication Critical patent/JPS636757U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】
第１図はこの考案によるホトセンサの一例を示
す平面図、第２図は第１図のＡＡ線断面図、第３
図は第１図の左側面図、第４図はこの考案のホト
センサの他の例を示す側面図、第５図乃至第８図
はそれぞれ更に他の例を示す斜視図、第９図はこ
の考案のホトセンサを用いたバーコード読取りホ
トセンサの例を示す断面図である。

Claims (1)

  1. 【実用新案登録請求の範囲】 発光素子ペレツトと、 その発光素子ペレツトの発光方向とほゞ同一方
    向を受光方向とする受光素子ペレツトと、 これら発光素子ペレツト及び受光素子ペレツト
    を埋込んだ透光性合成樹脂材のパツケージとより
    なるホトセンサ。
JP1986101319U 1986-06-30 1986-06-30 Pending JPS636757U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986101319U JPS636757U (ja) 1986-06-30 1986-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986101319U JPS636757U (ja) 1986-06-30 1986-06-30

Publications (1)

Publication Number Publication Date
JPS636757U true JPS636757U (ja) 1988-01-18

Family

ID=30971950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986101319U Pending JPS636757U (ja) 1986-06-30 1986-06-30

Country Status (1)

Country Link
JP (1) JPS636757U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058956U (ja) * 1991-07-17 1993-02-05 シヤープ株式会社 反射型ホトインタラプタ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278392A (en) * 1975-12-25 1977-07-01 Nec Corp Optical semiconductor device
JPS5645161U (ja) * 1979-09-17 1981-04-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278392A (en) * 1975-12-25 1977-07-01 Nec Corp Optical semiconductor device
JPS5645161U (ja) * 1979-09-17 1981-04-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058956U (ja) * 1991-07-17 1993-02-05 シヤープ株式会社 反射型ホトインタラプタ

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