JPS6367357B2 - - Google Patents

Info

Publication number
JPS6367357B2
JPS6367357B2 JP59028812A JP2881284A JPS6367357B2 JP S6367357 B2 JPS6367357 B2 JP S6367357B2 JP 59028812 A JP59028812 A JP 59028812A JP 2881284 A JP2881284 A JP 2881284A JP S6367357 B2 JPS6367357 B2 JP S6367357B2
Authority
JP
Japan
Prior art keywords
sheet
conductive
connector
layer
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59028812A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6021590A (ja
Inventor
Gofu Junia Uirii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS6021590A publication Critical patent/JPS6021590A/ja
Publication of JPS6367357B2 publication Critical patent/JPS6367357B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59028812A 1983-07-05 1984-02-20 回路板の製造方法 Granted JPS6021590A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US510540 1983-07-05
US06/510,540 US4587727A (en) 1983-07-05 1983-07-05 System for generating circuit boards using electroeroded sheet layers

Publications (2)

Publication Number Publication Date
JPS6021590A JPS6021590A (ja) 1985-02-02
JPS6367357B2 true JPS6367357B2 (enExample) 1988-12-26

Family

ID=24031168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59028812A Granted JPS6021590A (ja) 1983-07-05 1984-02-20 回路板の製造方法

Country Status (4)

Country Link
US (1) US4587727A (enExample)
EP (1) EP0130430B1 (enExample)
JP (1) JPS6021590A (enExample)
DE (1) DE3469982D1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050273999A1 (en) * 2004-06-09 2005-12-15 General Electric Company Method and system for fabricating components
CN101795531A (zh) * 2010-03-11 2010-08-04 深圳和而泰智能控制股份有限公司 邮票孔连接结构、电路板及电路板分割方法
JP6541837B1 (ja) * 2018-05-01 2019-07-10 億奇生物科技責任有限公司Ａｉｄｍｉｃｓ Ｂｉｏｔｅｃｈｎｏｌｏｇｙ （Ｈｋ） Ｃｏ．， Ｌｉｍｉｔｅｄ 手作りの回路基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484935A (en) * 1965-07-28 1969-12-23 Western Electric Co Method of producing electrical circuit assemblies having through connectors
US3470612A (en) * 1966-11-14 1969-10-07 Texas Instruments Inc Method of making multilayer circuit boards
FR1541719A (fr) * 1967-07-17 1968-10-11 Csf éléments magnétiques intégrés à structure feuilletée
JPS5026021A (enExample) * 1973-07-06 1975-03-18
LU72278A1 (enExample) * 1975-04-14 1977-02-03
DE2553385A1 (de) * 1975-11-27 1977-06-08 Siemens Ag Verfahren zum herstellen von praezisen mustern in duennen metallisierungen auf kunststoffolien
US4056773A (en) * 1976-08-25 1977-11-01 Sullivan Donald F Printed circuit board open circuit tester
JPS55138291A (en) * 1979-04-11 1980-10-28 Alps Electric Co Ltd Substrate for mounting electric parts
JPS56101672U (enExample) * 1979-12-28 1981-08-10
JPS5780793A (en) * 1980-11-07 1982-05-20 Mitsubishi Electric Corp Method of producing printed circuit board
FR2512315A1 (fr) * 1981-09-02 1983-03-04 Rouge Francois Ebauche de circuit electrique multicouche et procede de fabrication de circuits multicouches en comportant application

Also Published As

Publication number Publication date
DE3469982D1 (en) 1988-04-21
JPS6021590A (ja) 1985-02-02
US4587727A (en) 1986-05-13
EP0130430B1 (en) 1988-03-16
EP0130430A3 (en) 1986-04-30
EP0130430A2 (en) 1985-01-09

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